Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

All iPhone 7 to pack TSMC A10 processor, says report

Posted: 16 Sep 2015 ?? ?Print Version ?Bookmark and Share

Keywords:TSMC? iPhone? Apple? microprocessor? FinFET?

According to a Chinese language report, TSMC will develop all of the microprocessors for the iPhone 7 that is set for release in 2016 using its 16nm FinFET manufacturing process.

Taiwan's Commercial Times referenced unnamed people in Apple's supply chain as sources for the story.

This would represent a rejection for Samsung and Globalfoundries, its partner in 14nm FinFET manufacturing. Samsung is thought to have a 50 per cent share of production of the current processor, the A9, that is shipping in the recently launched iPhone 6 and iPhone 6 Plus. It would also be a bounce back into Apple's favour for TSMC.

Mass production of the A10 processor is expected to start in March 2016 so that parts can be ready for the iPhone 7 to launch in about September 2016. In addition Apple's A10 will use TSMC's integrated fan-out (InFO) wafer-level packaging technology, the report said.

- Peter Clarke
??EE Times Europe





Article Comments - All iPhone 7 to pack TSMC A10 proces...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top