Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

UMC starts mass prod'n of 0.11um eFlash touch ICs

Posted: 28 Sep 2015 ?? ?Print Version ?Bookmark and Share

Keywords:UMC? Automotive infotainment? Other automotive electronics? Mobile communication equipment? Portable computers?

United Microelectronics Corp. (UMC) has begun high-volume production of touch ICs manufactured on a 0.11?m eFlash process. The foundry said it has more than 30 touch customers in production and is shipping more than 40 million touch ICs per month.

According to the company, the process offers smaller and faster logic devices for higher performance, while enabling the integration of higher density embedded flash and SRAM for use in MCUs for touchscreen products of all sizes. UMC said it introduced the specialised technology in late 2012 as the foundry industry's first, true 12V aluminum back-end-of-line (BEoL) process for Internet of Things (IoT) applications.

The process marks another step for UMC toward products aimed at specialised applications. Earlier this year, ARM and UMC announced the first availability of an ARM Artisan physical IP platform on 55nm to accelerate embedded systems and IoT device development. In December last year, Infineon and UMC announced an alliance in power semiconductors for automotive applications.

With the process, UMC is aiming to tap growth in touch panels that are used in various mobile devices.

UMC said its 0.11?m touch IC platform improves SNR by more than three times compared with today's widely used 3.3V solutions, allowing IC designers to create a new generation of enhanced touch interface products.

UMC has developed the 0.11?m process on 8in wafers using what the company calls the most aggressive aluminum BEoL technology, allowing touch IC designers to enjoy lower non-recurring engineering (NRE) and related costs.

The company also provides in-house flash IP to speed time-to-market and facilitate customisation.

UMC said it is developing an ultra-low leakage (uLL) process to reduce core current on devices and SRAM by up to four times.

- Alan Patterson
??EE Times





Article Comments - UMC starts mass prod'n of 0.11um eFl...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top