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NAND flash devices for embedded apps compatible with SPI

Posted: 23 Oct 2015 ?? ?Print Version ?Bookmark and Share

Keywords:Toshiba? NAND flash? SPI? wearable? memory?

Toshiba Corp. has unveiled a portfolio of NAND flash memory products for embedded applications compatible with Serial Peripheral Interface (SPI). Applications for the "Serial Interface NAND" include consumer applications as flat-screen TVs, printers and wearable devices and industrial applications, including robots.

Users can choose from a line-up of 12 products that offers three densities, 1Gb, 2Gb and 4Gb; two packages, WSON and SOP; and two power supply voltages.

Compatibility with SPI, which can be controlled with just six pins, allows the "Serial Interface NAND" to be used as SLC NAND flash memory, with a low pin count, small package and large capacity.

Serial Interface NAND

NOR flash memory is typically used in embedded applications for consumer and industrial devices. However, in order to realise extra functionality in embedded devices, demand is growing for larger memory densities for saving software (including boot up programmes, firmware and embedded OS) and data (including log data). This is driving demand for SLC NAND flash memory, which offers higher density and reliability and a lower bit cost than NOR flash memory.

By adding the "Serial Interface NAND" to its product line-up, Toshiba aims to meet wide ranging market needs and to expand the market for NAND flash memory.

The devices operate from -40C to 85C and use 24nm process technology for SLC NAND. They are available in small and versatile packages. The WSON package is 6mm x 8mm and the SOP package is 10.3mm x 7.5mm. BGA packaged products are also under development, with sample shipments scheduled for 1Q16. The packages and the pin assignments are compatible with common serial flash memories.

Samples shipment has started and mass production is scheduled to begin with the 1Gb products from December. Mass production of the remaining line-up will follow.





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