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A*STAR set-ups high density, low-cost packaging consortium

Posted: 12 Nov 2015 ?? ?Print Version ?Bookmark and Share

Keywords:A*STAR? low-cost packaging? consortium? FOWLP?

A*STAR's Institute of Microelectronics (IME), in collaboration with Amkor Technologies, NANIUM, STATS ChipPAC, NXP Semiconductors, GlobalFoundries, Kulicke & Soffa, Applied Materials, Dipsol Chemicals, JSR, KLA-Tencor, Kingyoup Optronics, Orbotech and Tokyo Ohka Kogyo, has set-up a high-density fan-out wafer level packaging (FOWLP) consortium to extend FOWLP capabilities for applications in devices such as smartphones, tablets, navigation tools and gaming consoles.

These devices call for application processors with greater system capabilities such as increased memory and bandwidth, as well as faster processing speed to support myriad demanding applications and functions, while consuming low power. At the same time, the sheer market volume for such devices necessitates system cost reduction.

FOWLP is a low-cost packaging technology for system scaling which enables multiple chips to be integrated in a small form factor on a single package. However, the adoption of conventional FOWLP technology for high performance, multi-functional devices is being challenged by pin-count density of a few hundreds of I/Os per device package. These limitations have a direct impact on its capability to support increased system requirements and performance.

The consortium aims to provide solutions to overcome these limitations. It will develop a high-density FOWLP test vehicle capable of supporting thousands of I/Os and characterising the package for die shift, die protrusion and wafer warpage analysis that will enable system scaling for smartphones and mobile tablets. Concurrently, tight wiring to accommodate increased pin counts using fine pitch multi-layer redistribution layer technology will be demonstrated for large area FOWLP while maintaining its signal/power integrity and reliability.

"System integration is necessary to enable diverse functionalities with high performance in future applications across a wide spectrum of industries including computing and networking, healthcare, consumer electronics, transport and automotive. With the high-density FOWLP consortium, IME continues to add to its portfolio of advanced packaging platforms so as to provide wide-ranging solutions for the continued evolution and different needs of complex and demanding devices," said Dim-Lee Kwong, executive director of IME.

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