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Corial touts novel etching process for device deprocessing

Posted: 09 Mar 2016 ?? ?Print Version ?Bookmark and Share

Keywords:Corial? deprocessing? plasma etch? failure analysis flow?

Corial, a plasma etch and deposition equipment manufacturer, has expanded the capabilities of the Corial 200I ICP system with etching processes targeted specifically at deprocessing of devices down to 20nm. In the failure analysis flow, dry etch is the reference technology for sample deprocessing before any physical investigation of the device, to reveal a defect and identify its root cause.

Deprocessing is a challenging step as the device must retain electrical integrity and its surface must remain planar for further tests. Corial has developed a variety of processes to enable removal of polyimide, silicon nitride, silicon oxide, ILD, low & ultra-low K layers and metal (Al). As an example, we demonstrated the capability to expose many layers of metal with SiO2 etch rate as high as 0.2m/min while leaving no residue on the sample surface.

Corial 200I ICP system

Figure 1: In the failure analysis flow, the Corial 200I ICP system features etching processes targeted specifically at deprocessing of electronic devices down to 20nm.

Corial leverages a concept of universal shuttle, enabling deprocessing of dies, packaged dies and wafers up to 200mm, with only one etch equipment and no need for changing pieces of the reactor chamber to switch between sample types. The Corial 200I is built upon a production-proven technology with an inductively coupled plasma (ICP) source capable for low plasma potential and tight control of very low bias voltage, giving rise to minimum damage of metal lines. This etch system is fully automated, delivering stable processes with simple operation and minimum maintenance.





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