Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > EDA/IP
?
?
EDA/IP??

Marvell to use SerDes technology for multi-die products

Posted: 01 Apr 2016 ?? ?Print Version ?Bookmark and Share

Keywords:Chip-to-chip technology? Chord signaling? multi-die products?

California-based Marvell Technology Group Ltd. will soon be releasing a variety of multi-die products that use the Glasswing-chip-to-chip SerDes technology that it licensed from Kandou Bus SA, a startup company from Lausanne, Switzerland.

The technology is capable of delivering 1Tbps bandwidth at less than 1W and is suitable for short chip-to-chip links inside and outside of packaging, according to Kandou, a 2011 spin off from the Ecole Polytechnic Federale de Lausanne (EPFL).

Chord signaling

Kandou's technology is based on a method called Chord signaling and comprises correlated signals sent over multiple wires. The version of Chord signaling employed in Glasswing, CNRZ-5 coding, delivers 5 bits over 6 wires for a total bandwidth of 125Gbps. The total link power consumption of Glasswing when built in TSMC's 16nm 16FF foundry process is about 700 femtojoules/bit.

Kandou claims that the energy efficiency at high bandwidth will enable architectural innovations in a number of products ranging from mobile terminals, such as smartphones, to enterprise and data centre computers.

- Peter Clarke
??EE Times Europe





Article Comments - Marvell to use SerDes technology for...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top