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New Products
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Keysight enables wideband digital receiver to fit PXIe format (2016-04-15)
- Stackable NOR, NAND flash suitable for apps, IoT (2016-04-12)
- 10nm DDR4 DRAM may extend Moore's Law (2016-04-11)
- Client SSD packs embedded TLC NAND Flash (2016-02-22)
- Avago reveals multi-reader HDD read channel in silicon (2015-12-01)
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Cypress unveils 256Mb Quad SPI NOR Flash memory (2015-11-17)
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Micron rolls out persistent memory device (2015-11-13)
- 9 memory products that shift car apps into high gear (2015-10-30)
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NOR flash memory optimised for 'instant-on' apps (2015-10-27)
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NAND flash devices for embedded apps compatible with SPI (2015-10-23)
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Enterprise-performance HDDs tout 12Gb/s SAS support (2015-10-22)
- SSD boosts performance for high-end PCs, workstations (2015-10-07)
- eMemory rolls out OTP IP in 16nm FinFET Plus process (2015-09-16)
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XMC SATA SSD aimed at industrial, defence apps (2015-08-26)
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Diablo bares first all-flash DDR4 server system (2015-08-12)
News & Trends
- China: new fab hub of Asia? (2016-06-21)
- Expect NAND flash demand to return by second half of 2016 (2016-06-06)
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Win some, lose some: DRAM stands on shaky ground (2016-05-12)
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Hedge fund pressures Marvell board reshuffle (2016-04-29)
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7.3 quake shakes Japan's IC, auto industries (2016-04-19)
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Micron ventures into data centre flash storage market (2016-04-18)
- iPhone SE teardown reveals perfect mix of old and new parts (2016-04-04)
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VCs aid SE Asia tech start-ups (2016-03-29)
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Micron phases out planar, boosts 3D NAND production (2016-02-15)
- Flash, Re-RAM and STT-MRAM uncover dev't concerns (2016-02-02)
- Western Digital acquires more than 100 patents from IBM (2016-01-29)
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Toshiba to sell chip business except NAND (2016-01-25)
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Dialog lets go of Atmel as Microchip swoops in (2016-01-22)
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3D XPoint moves from lab to fab (2016-01-18)
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Start-up invests $2.9M to take S'pore companies to the cloud (2016-01-12)
Technical Archives
- Selecting memory for high performance FPGA platforms (2016-05-04)
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Data inspection techniques for massive memory designs (2016-05-02)
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Probing ReRAMs: Forming scaling, quantised conductance (2016-04-11)
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Probing ReRAMs: 3D filaments, brain-like functions (2016-03-16)
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Phase change memory advances: Discontinuity, melting (2016-03-11)
- Quick peek at memory testing (2016-03-09)
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Phase change memory advances: Threshold switching (2016-03-07)
- Exploring Samsung's 14 nm LPE FinFET (2016-02-03)
- Examining memory models (2016-01-04)
- Recent revelations on non-volatile memory conduction (2015-12-24)
- Grasp soft-decoding in SSD controllers (2015-12-23)
- Flash storage: 3D TLC NAND to beat MLC (Part 2) (2015-10-30)
- Flash storage: 3D TLC NAND to beat MLC (Part 1) (2015-10-27)
- Resolving giga-scale challenges in memory design (2015-09-16)
- Addressing PCM elevated temp data retention (2015-09-01)
Application Notes
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IHS: iPhone SE, an amalgamation of 3 generations of iPhones (2016-04-07)
- Exploring the future for SSDs (2015-08-31)
- Cheaper, denser NAND need better ECC (2015-08-07)
- MSP430 FRAM: How to and best practices (2014-10-01)
- Initialising KeyStone I DDR3 (2014-09-11)
- DDR3 design requirements for KeyStone DSP (2014-09-10)
- Understanding flash core voltage supply (2013-10-09)
- Configure CoreNet Platform Cache as SRAM (2013-09-25)
- Using CodeWarrior Linker Command File for Qorivva/PX (2013-08-16)
- Example of LPC24XX external memory bus (2013-06-13)
- Data transfer rate tolerance in clock asynchronous serial I/O mode (2012-07-05)
- Employ high speed comm for clock synchronous slave reception with DMAC (2012-07-04)
- Improving SATA and SAS measurements (2012-06-18)
- Enable autorestart capability in MAX16046 (2012-05-08)
- Generate multiple PWM with DMA (2011-12-22)
Bloggers Say
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Interviews & Viewpoints
Top Ranked Articles
- Win some, lose some: DRAM stands on shaky ground
- Data inspection techniques for massive memory designs
- Hedge fund pressures Marvell board reshuffle
- 7.3 quake shakes Japan's IC, auto industries
- Micron ventures into data centre flash storage market
- Keysight enables wideband digital receiver to fit PXIe format
- Probing ReRAMs: Forming scaling, quantised conductance
- IHS: iPhone SE, an amalgamation of 3 generations of iPhones
- VCs aid SE Asia tech start-ups
- Probing ReRAMs: 3D filaments, brain-like functions