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2006-07-21 Actions' new product line targets PMP market
Actions Semiconductor has launched new Series 7500 products and introduced the Series 13 product family targeting the personal media player (PMP) market.
2012-08-23 A*STAR IME's ADC converter boasts lowest power consumption
Researchers from A*STAR IME have developed an analog-to-digital converter which decreases the total power consumption of an implantable neural recording microsystem.
2007-08-21 A $60M funding for TSMC's packaging tech
Capital appropriations totaling $59.8 million will be set aside by Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) for use in establishing 300mm, wafer-level packaging technology.
2006-08-16 6th ESC-Taiwan gathers world's leading embedded tool vendors
Design engineers in Taiwan will be treated to an array of leading-edge technologies as the world's major embedded tool suppliers gather to showcase their products at the 6th Embedded Systems Conference-Taiwan.
2013-04-05 40nm process geometries take a quarter of global wafer capacity
IC Insights' report reveals that a huge share of the worldwide wafer capacity still remains dedicated to mature processes with "large" features sizes.
2009-02-06 3D sensor moves from car to CE
Emerging consumer electronics applications have prompted smart 3D sensor chip maker Canesta Inc. to adapt its 3D CMOS image technology from automotive applications to a new consumer version of its 3D image processing chip.
2005-04-01 32bit processors take on real-time apps
Processor architectures have evolved to meet the constraints of real-time control applications.
2005-03-18 32bit MCU line targets network-enabled appliances
The MB9140x series of 32bit MCUs from FMA pack a full range of networking security features, on-board ROM and RAM, and support for IPv6, the next-gen Internet protocol.
2002-03-01 1st Silicon, FTD forge joint marketing, tech support deal
1st Silicon (Malaysia) Sdn Bhd and Singapore-based FTD Technology Pte Ltd have entered into a worldwide joint marketing and technical support agreement.
2005-03-31 1st Silicon to fab sensor technology for Russian firm
1st Silicon (Malaysia) Sdn. Bhd and UniqueICs LLC of Russia, a subsidiary of Kedah Wafer Emas (KWE) of Malaysia, have completed the development of a color CMOS photoreceiver cell technology for sensors.
2005-05-11 1st Silicon starts production of Sharp's flash technology
1st Silicon Sdn. Bhd. has completed qualification and begun production shipment of Sharp Corp.'s 0.13?m NOR flash technology.
2011-07-06 16bit MCU enables analog intergration
Freescale has released a single-chip MCU that combines the different devices required for relay-driven electric motor control.
2012-03-19 0.11?m, 0.16?m CMOS image sensor platform unleashed
The TS11IS hybrid from TowerJazz allows designers to create higher resolution high-end sensors with smaller pixels and enhanced performance.
2005-09-14 'First true' One-Chip ZigBee SoC
Measuring 7-by-7mm, Chipson's CC2430 combines a robust radio, programmable microcontroller, flash memory, and both IEEE802.15.4 and ZigBee software all in one easy-to-use and cost-effective chip.
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