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2002-07-03 IBM SiGe technology to be integrated into LeCroy oscilloscopes
LeCroy Corp. has entered into an agreement with IBM Corp. wherein the latter will deploy their next-gen 0.18?m SiGe technology into LeCroy's WaveShape Analysis Oscilloscopes.
2003-09-04 Hynix launches new high-voltage process technology
Hynix Semiconductor announced that they have completed the development of a 0.18?m high- voltage process technology.
2006-10-18 Hua Hong NEC, Synopsys team up for reference design
Synopsys and Hua Hong NEC announced their jointly developed Reference Design Flow 2.0 for Hua Hong NEC's 0.18?m process.
2010-10-26 Gennum taps TowerJazz SBC18 process for video crosspoint switch
Gennum to use 0.18-micron SiGe BiCMOS process to make 290x290 crosspoint switch
2003-08-29 Faraday to expand IP cores with UMC process
Faraday Technology Corp. has announced that it will expand its silicon verified IP offerings on UMC's 0.18?m, 0.15?m, and 0.13?m processes.
2004-09-14 eSilicon tapes out SoC to TSMC process using Magma system
eSilicon Corp. has taped out a 0.18?m SoC design to TSMC's LV process using Magma's Blast Create and Blast Fusion, an integrated RTL-to-GDSII design flow.
2006-08-28 eMemory, Silterra extend semicon collaboration
eMemory has verified its Neobit one-time-programmable memory on Silterra's 0.18m CL180G and CL180H CMOS process technologies.
2016-05-04 Dongbu provides iPDK support for Synopsys' Custom Compiler solution
Dongbu HiTek and Synopsys' newly developed iPDKs for 0.11?m mixed-signal for implementing audio codecs and DACs and 0.18?m BCDMOS process for designing data converters.
2016-06-23 Dongbu provides iPDK support for Synopsys
Dongbu HiTek and Synopsys' newly developed iPDKs for 0.11?m mixed-signal for implementing audio codecs and DACs and 0.18?m BCDMOS process for designing data converters.
2009-06-04 Dongbu HiTek taps Kilopass' NVM solution
Kilopass Technology, Inc. has announced that is developing one-time programmable (OTP) memories for Dongbu HiTek's 0.18?m biCMOS-DMOS process.
2005-08-01 Develop a robust low-power embedded flash
A major consideration in the development of a 0.18?m embedded flash technology is how to integrate flash in existing libraries and processes
2005-03-10 CMOS process offers high integration
Jazz Semiconductor announced the availability of a 17GHz vertical PNP (VPNP) module on its 0.18?m RFCMOS platform.
2005-07-15 Atmel's ASIC libraries provide 5.5 million usable ASIC gates
Atmel released to production a set of 0.18?m CMOS cell-based ASIC libraries providing up to 5.5 million usable ASIC gates, which, according to the company, is the highest level of integration currently available in the space market.
2005-11-11 Atmel offers wireless foundry process
Semiconductor maker Atmel Corp. rolled out a new, 0.18-micron process technology for wireless customers
2005-04-25 Atmel brings 80 percent cost savings to latest FPGAs
Atmel announced a complete set of 0.18?m structured array matrices to convert most FPGA and CPLDs with its Ultimate Logic Conversion.
2003-01-30 Artisan licenses chip-design software to SMIC
Artisan Components Inc. has announced that China foundry SMIC would start using its chip design software for the 0.18?m technology generation.
2003-11-04 Aoba Technology bead inductors rated to 6A
Aoba Technology Co. Ltd has announced the availability of its FBM P series of ferrite chip bead inductors that features rated current of 1A to 6A, dc resistance of 0.01- to 0.18 ohms, and impedance of 11 ohms to 1.2 kiloohms.
2008-11-26 aBCD process tech cuts voltage transistor pitch
MagnaChip Semiconductor Ltd has announced the availability of its 0.18?m and 0.35?m advanced bipolar CMOS-DMOS (aBCD) process technologies for foundry customers.
2012-02-08 5V FRAMs offer 400kHz maximum operating frequency
Fujitsu Semiconductor's new FRAM series is based on the company's 0.18?m technology.
2003-08-07 ZyDAS taps UMC for 802.11b-compliant IC
ZyDAS Technology has selected United Microelectronics Corp. to manufacture its recently released ZD1202 - an 802.11b fully compliant single-chip MAC and BBP.
2005-01-20 ZMD, 1st Silicon team up for automotive chips, foundry
ZMD AG and 1st Silicon (Malaysia) Sdn. Bhd have formed a partnership for the development and supply of automotive extensions to manufacturing processes, the two companies announced Tuesday (Jan. 18).
2009-06-10 Zigbee SoC tailored for industrial apps
Ember Corp. will start shipping in Q3 a Zigbee networking SoC targeting industrial rather than consumer applications, and specifically smart metering in the medium term.
2002-12-16 Zeevo Bluetooth SoC has 10.9-by-13.1mm footprint
The TC2001 Bluetooth SoC combines radio, link controller, audio, and CPU functionality in a 10.9-by-13.1mm, 65-ball package.
2002-03-18 Zarlink TDM chip switches 8,192-by-8,192 channels
Designed for next-generation networking equipment, the MT90871 non-blocking TDM chip provides the same capacity as four conventional 4,096-by-4,096 channel switching chips.
2005-05-23 Zarlink seeks 'strategic alternatives' amid loss, poor outlook
Zarlink Semiconductor Inc. said that it is seeking "strategic alternatives" amid another loss for the troubled communications-chip maker.
2002-10-18 Zarlink packet processors transport TDM via Ethernet
The MT90880/1/2/3 packet processors support Ethernet backplanes and transport high volumes of TDM access service.
2002-07-08 Xilinx struggles to fulfill orders
Xilinx Inc. said it is struggling to fulfill orders for some of its newer FPGA products following reports that programmable-logic players may be in for a rocky second half of the year.
2004-07-30 Xilinx invests in China foundry
Programmable chips supplier Xilinx Inc. has invested in China-based foundry He Jian Technology (Suzhou) Co. Ltd.
2002-07-18 Xilinx chief sees slow recovery
The electronics industry should be able to avoid a double-dip recession and instead see very slow growth through the second half of this year, said the chief executive of Xilinx Inc.
2008-01-18 X-FAB turns Malaysia facility to analog/mixed-signal fab
X-FAB Silicon Foundries is transforming its Sarawak, Malaysia facility into an analog/mixed-signal foundry operation.
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