Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > 0.18

0.18 Search results

?
?
total search584 articles
2012-04-02 X-FAB adds high-temperature capability to micrometers
The module claims to include high temperature, high voltage and non-volatile memory features to the company's XH018 portfolio.
2010-07-06 WiSpry, IBM co-develop tunable RF MEMS
WiSpry Inc. and IBM are collaborating to develop MEMS process technology and manufacture its tunable RF product roadmap.
2006-07-26 Winbond's 32bit solution cuts product development time
Winbond has launched the integrated general 32bit single-chip W90P710 and W90N745, and a comprehensive development proposal to reduce product development time of system houses.
2007-03-02 Winbond to feature 32bit MCUs at IC and system design event
Winbond Electronics Corp. will showcase two products at the 12th International IC-China Conference & Exhibitionthe W79E8XX (8051 core) LPC series and the 32bit W90P710/W90N745 (ARM core) MCU.
2005-06-28 Winbond buys out NexFlash for code-flash play
Winbond Electronics Corp. has acquired serial flash maker NexFlash Technology Inc. for an undisclosed sum.
2009-12-21 VT Silicon, TowerJazz deliver 4G RF front-end IC
VT Silicon has selected TowerJazz for the world's first silicon 4G RF Front End IC capable of meeting the stringent operating requirements of 4G mobile devices.
2004-04-23 VLSI papers weigh 65nm, new circuits
While technologists look to 65-nanometer nodes, circuit designers by and large are two generations back.
2004-02-20 Virage to support DongbuAnam 0.13?m CMOS processes
DongbuAnam Semiconductor and Virage Logic Corp. have entered into a licensing and royalty-bearing agreement that provides for the delivery of Virage Logic's technology-optimized platforms for DongbuAnam's new 0.13?m CMOS processes.
2003-07-25 Virage licenses IP to Silterra, SMIC
IP provider Virage Logic struck two licensing deals, saying it would transfer logic, memory and I/O technology to Silterra Malaysia Sdn. Bhd. and Semiconductor Mfg Int. Corp. in China.
2006-06-01 Vimicro ICs eye handset mainstream
After making its mark in image processors for PC cameras, then moving into audio chips for cellphones, Chinese fabless company Vimicro Corp. is bringing it all together in its first line of multimedia chips for midrange feature phones.
2004-08-30 Video interface processors offer huge space savings
Focus Enhancements released two new video interface processors in a BGA package, targeting system designers who need compact components for mobile and handheld apps.
2008-01-04 Vanguard finalizes purchase of Winbond's 200mm fab
Aiming to expand its capacity, Taiwan specialty foundry provider Vanguard International Semiconductor Corp. has completed its acquisition of Winbond Electronics Corp.'s 200mm fab.
2013-06-25 Utilising non-volatile memory IP in SoC designs
Integrating anti-fuse NVM on chip for program storage results to increased margin as well as independence from vagaries of supply chain and component availability.
2007-06-07 USB PHY trims power in 65nm, 45nm SoC designs
Chipidea introduces a USB PHY core for 1.8V I/O devices that it says offers the industry's lowest power consumption for SoC designs in the 65nm and 45nm advanced technology nodes.
2001-03-01 UMC, Photobit target handset, still-camera
United Microelectronics Corp. said it has readied a special CMOS image sensor process for a twin assault on the digital still-camera and cellphone camera markets.
2006-07-11 UMC, NTU partner on RF chip for WiMAX
UMC and National Taiwan University today announced that their research collaboration has resulted in the delivery of a fully-integrated RF receiver design for WiMAX.
2007-01-10 UMC's new 300mm fab to open in '08
United Microelectronics Corp. said it foresees opening a new 300mm wafer plant in 2008.
2005-07-29 UMC trims capex after poor Q2, upbeat on Q3
Taiwan's foundry chip maker United Microelectronics Corp. has reported poor financial results for the second quarter, in contrast to its rival Taiwan Semiconductor Manufacturing Co. Ltd (see July 26 story), but gave an upbeat forecast for the third quarter.
2002-02-08 UMC to cut spending, increase advanced capacity
United Microelectronics Corp. intends to cut capital spending this year by 27 percent, joining its foundry rivals in tightening purses for what they expect to be a slow recovery in 2002.
2005-08-09 UMC riled by TSMC comments on Hejian, says report
Foundry chip maker United Microelectronics Corp. (UMC) has been critical of its rival Taiwan Semiconductor Mfg Co. Ltd (TSMC) alleging that Rick Tsai, TSMC's chief executive officer, made libelous remarks, according to a China Post report on Friday (Aug. 5).
2004-03-01 UMC picks up SiS fab for $321 million
United Microelectronics Corp. said Thursday it will acquire an 8-inch wafer fab from PC chipset designer Silicon Integrated Systems Inc. in an all-stock deal worth $321 million.
2006-01-18 UMC offers 90nm MPW service via Europractice
The Europractice IC service operated by the Interuniversities Microelectronics Center is now offering access to 90nm CMOS manufacturing on multiproject wafers from UMC.
2002-11-22 UMC licenses MoSys 1T-SRAM
United Microelectronics Corp. has licensed MoSys Inc.'s 1T-SRAM technology as part of the foundry's IP strategy to offer SoC designers memories that are more tightly aligned with its processes.
2002-03-14 UMC licenses ARM cores
Taiwan Semiconductor foundry United Microelectronics Corp. has licensed the ARM946E core and the ARM1022E core.
2007-05-09 UMC gears up for CPUs, NAND flash memory
United Microelectronics Corp. said it is in talks on a CPU production deal, but it is being circumspect on how it will attack the high-volume flash memory market.
2006-04-21 UMC fabs Sonos memory IC
United Microelectronics Corp. has made a new type of memory on a foundry basis for Solid State System Co.
2005-03-02 UMC 0.13?m HS process developed JMicron Serial ATA II PHY core
United Microelectronics Corp. (UMC) and JMicron Technology Corp. revealed that JMicron's Serial ATA (SATA) II PHY Technology has been developed and proven on UMC's 0.13?m HS (high speed) process.
2005-09-01 Ultrawideband chip tackles video distribution
General Atomics expands UWB options with its new Aspen chip.
2008-06-11 Ultralow-power FPGA aims to break industry records
The folks at SiliconBlue have just announced a revolutionary new class of single-chip, ultralow-power FPGA devices, that they say set a new industry standard for price, power, and space along with unprecedented ASIC-like logic capacity for battery-powered, handheld consumer applications.
2004-10-01 Tundra weighs in with host bridge for Freescale's upcoming processors
Tundra plans to release a PowerPC-to-PCI-X host bridge that supports DDR2-400 SDRAM Gbit Ethernet and flash for the PowerPC processor MPC7448 announced by Freescale.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top