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2002-10-01 X Architecture members deliver 130nm masks
X Initiative member companies Cadence Design Systems, DuPont Photomasks, and Numerical Technologies have successfully produced the first X Architecture photomask for the 130nm semiconductor process technology node.
2002-02-13 UMC dropping Dow's SiLK from performance 130nm process
After working with Dow Chemical's low-k dielectric film for nearly a year, UMC is preparing to drop Dow's SiLK from its high-performance 130nm process, choosing a path different than that of development partner IBM Corp.
2003-08-11 UMC developing niche 130nm aluminum process
United Microelectronics Corp. said that it is developing an aluminum-based 130nm process for customers that don't need the speed of copper.
2002-06-18 Trouble at 130nm node causes finger pointing
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2010-10-14 Tower integrates MRAM in 130nm CMOS
Tower Semiconductor has integrated a thermally assisted switching magnetic random access memory from Crocus Technology into its 130nm CMOS manufacturing process.
2002-08-12 Toshiba offers 130nm process as foundry service
Toshiba Corp. will offer its 130nm copper process line to third-party customers on a foundry basis.
2006-09-07 Synopsys unrolls connectivity IP for SMIC 130nm tech
Synopsys has expanded its DesignWare MSIP portfolio with the release of connectivity IP for SMIC's 130nm technology.
2013-03-12 ST, CMP team up to deliver 130nm CMOS process
The H9A CMOS process is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP.
2005-11-21 SMIC, Magma offering RTL-to-GDSII flow for 130nm SoCs
Magma Design Automation Inc. and Semiconductor Manufacturing International Corporation (SMIC) have made available a validated reference flow based on Magma's Blast Create, Blast Plan Pro, Blast Fusion and Blast Power for system-on-chips (SoCs) targeted at SMIC's 130nm process.
2005-04-22 SMIC moves to 130nm production
Chip maker Semiconductor Mfg Int. Corp. (SMIC) is scheduled to begin volume production at its 130nm line later this year.
2004-05-07 Scaling dead at 130nm, says IBM technologist
The traditional scaling of semiconductor manufacturing processes died somewhere between the 130nm and 90nm nodes, Bernie Meyerson, IBM's CTO, told an industry forum.
2003-03-24 Samsung deploys KLA-Tencor system for sub-130nm processes
Samsung Electronics Co. Ltd has purchased a 300mm optical thin-film metrology tool from KLA-Tencor Corp.
2007-06-07 Russian fab partners with U.S. firm for 130nm move
Russian foundry JSC Angstrem has teamed with a U.S. company to import a 0.13?m process as the basis for a foundry operation.
2002-10-16 NEC pushes CMOS-compatible process to 130nm
With communications, consumer and high-end computing applications in mind, NEC has upgraded its embedded-DRAM process to 0.135m.
2013-11-21 Malaysia foundry ready to take X-Fab to 180nm, 130nm
X-Fab Silicon's Rudi De Winter talks to EE Times Europe about his company's acquisition of 1st Silicon in Malaysia and its transition to 200mm wafer manufacturing.
2005-10-14 MagnaChip ups capex, tips 130nm process
Amid a plan to boost its capital spending, South Korea's MagnaChip Semiconductor Ltd is developing a new 130nm process technology for a range of applications.
2006-09-07 Korean foundry develops 130nm CMOS image sensors
Dongbu Electronics announced early this week that it has completed development of an advanced CMOS image sensor process at the 130nm node together with Electronics & Telecom Co. Ltd.
2007-03-29 Infineon licenses 130nm CMOS tech to HSMC
Infineon Technologies has signed a memorandum of understanding with startup Hindustan Semiconductor Manufacturing Corp. to license its 130nm CMOS process technology.
2007-06-08 Indicators point to AMD as Angstrem's partner in 130nm fab
Although Anatoly Sukhoparov of JSC Angstrem has declined to confirm the source of his company's forthcoming 130nm CMOS process, a number of indicators point to AMD.
2004-10-29 Grace claims its close to 130nm process deal with U.S. IDM
Chinese foundry chip maker Grace Semiconductor Mfg Corp. said it is in the final stages of negotiating a technology transfer for a 0.13?m manufacturing process from a U.S.-based integrated device manufacturer.
2005-05-04 DongbuAnam offers 130nm process on multi-project wafers
DongbuAnam Semiconductor Inc. is offering access to a 130nm manufacturing process with up to eight layers of copper interconnect through a multi-project wafer service, the foundry said.
2007-01-31 Dongbu, ARM extend delivery of IP design for 130nm
Dongbu Electronics and ARM are joining efforts to extend the availability of ARM low-power and speed-and-density products to designers developing chips using Dongbu's CMOS process at the130nm node.
2004-01-09 Cypress adopts Cadence extractor for 130nm, 90nm flows
Cypress Semiconductor Corp. has adopted the latest version of Cadence Design Systems' Fire & Ice QXC as the sign off cell-based extractor in its 130nm and 90nm flows.
2004-09-10 Cadence, UMC create sub-130nm IC reference flow
Cadence Design Systems Inc. and foundry United Microelectronics Corp. have announced an RTL-to GDSII reference flow for digital IC designs implemented in UMC's 130nm and lower processes.
2003-03-10 Asynchronous design demonstrated at 130nm
Fulcrum Microsystems has reported successful characterization of a 130nm test chip carrying its fully asynchronous Nexus crossbar switch block.
2002-10-29 ASIC slump slows transition to 130nm systems
ASIC design starts will decline 12.3 percent to 4,345 this year following the precipitous 36 percent drop in design starts in 2001, according to a new report by Gartner Dataquest.
2007-05-24 ARM processor optimized for 130nm process
Optimized for Dongbu's processing at the 130nm node, the newly added ARM IP added to Dongbu HiTek's portfolio enables reduced time and cost in designing SoC solutions
2012-03-26 130nm CMOS logic backend tech unleashed
SilTerra Malaysia released the CL130AL that offers single poly up to six layers of aluminum metallization, borderless contacts and via with USG inter-metal dielectric.
2005-03-21 Xilinx Asia-Pacific headquarters ready to capitalize
Xilinx Inc. revealed that its Asia-Pacific headquarters (XAP) based in Singapore is fully operational and ready to capitalize on the semiconductor market growth across the region.
2004-12-17 Winbond achieves silicon success with Synopsys design platform
Winbond Corp. has achieved first-pass silicon success using Synopsys Inc.'s Galaxy Design platform for its latest 130nm, MPEG-4 multimedia chips.
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