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2014-07-11 IBM invests $3B in R&D to take on cloud, Big Data systems
Tech giant IBM is set to channel billions of funds into two research initiatives to push the limits of chip technology needed to meet the demands of cloud computing and Big Data systems.
2015-12-01 HMC, HBM gain wider appeal for computing networking apps
An expert said that while HMC and HBM products are rolling out along with DDR4, it's clear there's room for all three technologies to find market share as standards take time to settle into place.
2014-04-24 Hardened floating point DSP gives FPGAs a boost
Altera is building hardened single-precision floating point DSP blocks into its FPGAs and SoCs, performing up to 1.5TFLOPS in Arria 10 devices and 10TFLOPS in Stratix 10. Adding a layer of hardened multipliers and adders helped eliminate nearly all the logic usage in existing floating point computations.
2012-06-20 Handling behemoth designs
Learn about some strategies and tool requirements for physical implementation of large and complex semiconductors.
2016-02-12 GlobalFoundries, SUNY Poly open advanced patterning centre
The $500 million, five-year programme will accelerate the introduction of EUV lithography technologies into manufacturing to expedite next generation chip technology.
2015-07-14 GlobalFoundries rolls out FD-SOI platform
GlobalFoundries' FDX platform, using an advanced FD-SOI transistor architecture, confirms the momentum of this technology by expanding the ecosystem and assuring a source of high-volume supply.
2012-05-02 Globalfoundries preps for 20nm TSVs
If all goes well, the company hopes to take production orders in the second half of 2013 for 3D chip stacks using 20nm and 28nm process technology.
2015-07-21 Globalfoundries plans to start FD-SOI prod'n in Europe
Globalfoundries is investing $250 million to develop and its own variant of a fully-depleted silicon-on-insulator (FD-SOI) manufacturing process and get it into production in Europe.
2012-12-20 Globalfoundries consider SSRW tech as 3rd option
The chip foundry is evaluating a third manufacturing option to follow conventional bulk planar CMOS based on a super-steep retrograde well approach.
2012-12-17 Globalfoundries CEO: Time for foundry 2.0
Globalfoundries' CEO accosted critics who claim that the fabless era is done and insisted that the foundry model is still experiencing huge growth rates.
2015-09-18 Globalfoundries CEO talks about FD-SOI, FinFET and IoT
Sanjay Jha said many applications are expected to drive the industry's growth, which include mass market smartphones, M2M, IoT and automotive, which don't need the cost and complexity of FinFET.
2015-07-02 GlobalFoundries acquires IBM's chip manufacturing business
GlobalFoundries will be IBM's exclusive semiconductor processor technology provider for the next 10 years. The deal could expand GlobalFoundries' current capacity by more than 10 per cent.
2013-09-23 Global IC manufacturing equipment spending to fall in 2013
Worldwide semiconductor manufacturing equipment spending is projected to total $34.6 billion this year, an 8.5 per cent decline from 2012 spending of $37.8 billion, according to Gartner Inc.
2014-04-16 GigOptix ASIC expansion addresses designs in lower nodes
GigOptix has released an ASIC product series that provide benefits including low production costs and rapid design cycles.
2016-03-21 Getting into the loop: What to expect at Apple's next event
What's with the cryptic "Let Us Loop You In" tagline? Plenty of "interesting" ideas have been floated. And what will Apple announce there? Glad you asked. Brian Dipert lists what we may hear at the upcoming Apple event.
2015-04-10 Galaxy S6 teardown: Discovering Samsung's Shannon chip
Speculations that Samsung is cutting its ties with Qualcomm give further credence to claims that the Korean company will be using its Shannon chipset to more devices, even the flagship ones.
2015-04-07 Future of 3D SoCs: Adding unlimited layers sans TSVs
The future of three-dimensional (3D) very large scale integration (VLSI) for system-on-chips (SoCs) will not stack die connected by through-silicon-vias (TSVs), but will build them on a single layered die, according to Qualcomm.
2014-04-22 FPGAs must shape up to accelerate growth
The rocketing ASIC mask-set and NRE costs have not yielded a surge of FPGA designs, but have rather driven engineers to resort to older technology nodes to mitigate the cost issues. Considering this and the standing Moore's Law concern, the FPGA outlook does not appear so bright.
2014-06-24 FPGAs afford server boosts in datacentres
Bing is rolling out Stratix-based fabric on servers to accelerate processing of customer searches, an approach that Microsoft revealed to improve ranking server throughput by 95 per cent.
2011-02-07 First EUV tool ships amid power, tech concerns
ASML may have shipped the world's first EUV lithography tool, but experts insist EUV is not yet ready.
2013-04-02 FinFETs still not ready for prime time
Rising capacitance is one of many challenges that lie ahead before a process node that utilises 3D transistors can be realised, according to a panel of experts at the annual Synopsys User Group meeting.
2012-12-18 FDSOI beneficial for FPGAs, says Altera
Altera's approval of FDSOI process for manufacturing FPGAs hints at possible implementation of multiple-foundry manufacturing strategy.
2015-09-22 Examining the most underrated FPGA design tool ever
There is a design tool that is being quietly adopted by FPGA engineers because, in many cases, it produces results that are better than hand-coded counterparts.
2011-03-03 EUV late for 10nm party, says Intel
Although it is late for the 10nm design rule definition stage at Intel,
2013-04-10 Enabling superior FinFET predictability
Find out how 3D physical simulation tools can be used to provide superior FinFET predictability.
2015-04-24 EDA tool reduces design time for FinFETs
The Calibre xACT claims to quickly and accurately extract parasitic capacitance, resistance and inductance for IC designs including digital, custom, analogue and RF.
2015-07-09 Dissecting FD-SOI: Understanding the risks and opportunities
According to the CEO of CEA-Leti, FD-SOI's genuine advantage wasn't obvious at process nodes such as 40nm or 32nm, but there is a certain degree of potential now at 28nm node.
2015-03-10 Did Apple Watch, MacBook fail to deliver on promises?
Apple launched its highly anticipated smart watch and MacBook at the recent Spring Forward. While both devices touted admirable engineering, they seemingly failed to show anything revolutionary.
2013-11-26 Despite flat year, Intel remains optimistic
The company revealed that 2014 will be another flat year for the company, yet it is maintaining historically high capex spending, seeing the need for a new 450mm fab on the horizon.
2015-02-09 Dark Silicon: Looking to monolithic 3D for ray of light
According to an ARM executive, dark silicon is projected to account for "about one-third of total area in the 20nm technology node, increasing to as much as 80 per cent by the 5nm node."
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