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2015-08-05 CoolCube 3D interconnect targets FinFET process
The research institute demonstrated the feasibility of CoolCube used to stack FinFET layers on its 300mm production line as well as with fully-depleted silicon-on-insulator manufacturing processes.
2014-03-13 Consortium releases HMC specification update
HMCC's update acknowledges existing industry nomenclature by migrating the associated channel model from SR to VSR, while the USR definition also increases performance from 10Gb/s up to 15Gb/s.
2013-05-06 Conquering FinFET challenges
Here's a look at the challenges from custom/analogue, digital, parasitic extraction and signoff perspectives.
2014-12-05 Clash of FPGA devices expected for 2015
Companies that include Intel, Altera and Xilinx are developing and pushing to market their respective FPGA offerings in the coming year in a flood of marketing claims and counter-claims.
2014-03-20 Chip stacks feature near-zero TSV keep-out zones
GlobalFoundries describes a middle-of-line layer stack technique that uses nitride, PMD oxide, and a contact protection layer with a high coefficient of thermal expansion.
2013-01-21 Chip makers expect slow but sunny year ahead
TSMC, Intel and ASML are among several big industry players that are projecting increased profits in 2013.
2014-07-01 Chip industry to face hurdles brought by 20nm tech
Executives from two capital equipment firms said chip vendors face the challenges brought by higher costs and complexities due to tighter margins, new processes and materials at 20nm and beyond.
2014-04-01 CEO of China's SMIC talks about global expansion
EE Times correspondent Junko Yoshida sat down with SMIC CEO Tzu-Yin Chiu in a one-on-one interview that revealed the company's interest to expand globally.
2013-12-13 Cadence: Europe to abandon digital for mixed-signal chips
An executive from Cadence said that Europe will concentrate its efforts toward biomedical, automotive and mixed signal chip design, and will give up on leading edge digital chip design.
2014-03-17 Cadence takes systems design on ecosystem level
Along with Cadence CEO's keynote, two other keynoters from Imagination and Tensilica described a connectivity-driven design and the challenges in design process in different systems levels.
2011-09-14 Broadcom CTO tackles NetLogic buy
Broadcom CTO Henry Samueli sat down for an interview with EE Times and shared his thoughts on the company's intention of buying NetLogic for $3.7 billion.
2012-10-18 ARM's V8 to be used for TSMC's 16nm FinFET
Taiwanese foundry plans to use ARM's first 64bit processor, the V8, as a test vehicle for the 16nm FinFET process.
2013-02-07 ARM thumbs up for ST's FDSOI process
ARM rates FDSOI process as 'good technology' and announces the addition of two licensees utilising its big-little approach to multi-processing during a conference with financial analysts.
2011-08-22 ARM struggles with silicon, battery tech
ARM's Simon Segars says the company is facing big hurdles in silicon scaling and developments in battery technology, which is standing in the way of opportunities in mobile systems.
2015-08-05 Are smartphones getting too hot?
Premium smartphones require a delicate balance between performance and battery life. With increases in performance, are phones getting too hot?
2014-08-25 Are multi-patterning corners necessary for 16/14 nm?
Multi-patterning is the technique required for printing geometries that are smaller than the wavelength of light used in manufacturing can accurately resolve. Find out if it is indeed needed for 16-nm and 14-nm nodes.
2014-04-09 Apps processor revenues profit from 64bit, multi-core techs
A market research firm projected a revenue growth of roughly $37.2 billion for application processors in mobile devices in 2008, driven by the latest technologies and a push for integrated devices.
2014-09-16 Apple-Samsung rivalry expands to 20nm chips
The two prominent smartphone makers are set to ship their latest smartphone models powered by their own mobile processors in the 20nm node, which Apple and Samsung used in radically different ways.
2015-09-10 Apple touts A9 chips for new iPad, iPhone
The iPad Pro will be available in November and the new iPhones (6s and 6s Plus) will be available Sept. 25. The mobile devices were announced alongside a new Apple TV that uses an A8 processor.
2015-09-21 Apple plans to divvy up 14/16nm orders among foundries
Apple is expected to allocate its orders for 14/16nm products this year and next as part of a strategy to gain pricing power over foundry suppliers such as Samsung and TSMC.
2013-05-29 Analysis: More to join ST in FDSOI ecosystem
STMicroelectronics will soon find company in what's currently seen as an empty FDSOI ecosystem as momentum slowly but surely builds up on a global scale.
2014-05-06 AMD takes massive strides with ARM cores
AMD has apparently upgraded its on-chip fabric, I/O and memory-management units for its upcoming ARM cores, saying that it is well along in implementing its architecture work and custom designs.
2013-12-30 Altera CEO: Industry is looking up despite down 2014
John Daane, Altera's CEO, stated that Moore's Law will remain while the near term looks upbeat as a result of scaling that will continue for several generations, offsetting rising fab costs.
2015-09-16 All iPhone 7 to pack TSMC A10 processor, says report
TSMC will make all of the microprocessors for the iPhone 7 that is due in 2016 using its 16nm FinFET manufacturing process, according to a Chinese language report.
2014-01-21 Advantages of hierarchical flow for SoC design
Learn why it is critical to minimize lengthy problem detection and fix issues as early as possible using a comprehensive hierarchical SoC methodology.
2015-11-27 Abu Dhabi takes active role over GloFo deal
A Bloomberg report stated that Mubadala Development has talked with potential buyers for all or part of Globalfoundries, where it could fetch $15 billion or $20 billion if a deal goes ahead.
2015-11-13 A9: Story of Apple's design ambitions
The A9 is really a story within a story. On a basic level it is a story of a sixth generation AP that is fabricated in a FinFET process. It is also a bigger story of Apple semiconductor design ambitions.
2016-01-19 A tech walkthrough of metal gate I/O transistors
The input/output (I/O) transistor is the workhorse of the metal gate CMOS transistors, yet noone really talks about it. In this article, we'll see why it is worth a look.
2015-08-19 A look inside GlobalFoundries' Fab 8
A tour of the plant and an affiliated research centre in nearby Albany provided a look inside an operation that now carries the DNA of chip giants such as AMD, IBM and Samsung.
2016-04-06 A disruptive turn of things at Intel
Things are shaking up at the technology company with the departure of two executives and another one missing in action. The development has left Silicon Valley all abuzz.
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