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2013-04-02 IME, UTAC team up for 2.5D TSI packaging solutions
United Test and Assembly Center will collaborate with A*STAR's IME to develop a 2.5D Through-Silicon-Interposer (TSI) platform for packaging solutions.
2012-12-20 A*STAR offers 2.5D through-silicon-interposer MPW service
The service is aimed at providing a cost-effective platform to do research and development prototyping and proof-of-concept in 2.5D TSI technology.
2011-12-07 IME, Tezzaron develop "2.5D" interposer tech
A*STAR Institute of Microelectronics and Tezzaron Semiconductor aim to refine the design and manufacture of silicon interposers and standardize the process, flows, and process design kits.
2012-02-13 Challenges, opportunities of the 2.5D/3D ecosystem
While opportunities abound, moving to 2.5D/3D manufacturing has posed significant challenges to designing, fabricating, assembling and testing of 2.5D/3D ICs
2013-06-25 A*STAR IME, IC firms team up to tackle industry issues
A*STAR Institute of Microelectronics launched the 2.5D Through-Silicon Interposer Consortium to speed market adoption of TSI tech, which is driven by demands in computer infrastructure and CEs.
2012-12-21 Nikon, IME to open lithography R&D lab in Singapore
Nikon has teamed up with A*STAR's Institute of Microelectronics for an R&D facility in Singapore that will develop advanced optical lithography technology for IC manufacturing.
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