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2013-04-05 TSMC to kickstart 20nm line ahead of schedule
TSMC is reportedly poised to start installing equipment for 20nm production at its fab in Tainan, Taiwan, on April 20 enabling it to begin volume production at the end of the second quarter.
2010-03-01 TSMC takes on 40nm yields, high-k, litho issues
At the TSMC Japan Executive Forum in Yokohama, Shang-Yi Chiang, senior VP of R&D at TSMC, addressed several issues about the silicon foundry giant.
2014-10-07 TSMC takes lead over Samsung in FinFET race
TSMC's 16nm pilot line is gaining incremental confidence among prospective customers, leaving behind Samsung, whose foundry has experienced a setback with its 14nm FinFET project.
2015-04-17 TSMC slashes $1B to 2015 capex
TSMC, which in January weighed in with the chip industry's largest planned layout for expansion this year, said that its revised 2015 capex will fall within a range of $10.5 billion and $11 billion.
2014-01-20 TSMC registers 10.9% revenue growth in Q4
The foundry firm attributed its Q4 growth to the accelerated demand for mobile devices late in the year and its improved margins, lifting its Q4 net income and diluted earnings per share by 7.7 percent.
2014-09-26 TSMC fabricates networking chip with 16nm FinFET
The 32-core ARM Cortex A57-based processor is fabricated using TSMC's 16nm FinFET technology, and boasts a three-fold increase in performance compared with the previous processors.
2011-04-11 TSMC enters chip-packaging arena
TSMC will soon open a bumping facility and offer silicon interposers and TSV technologies for 3D chips, but will remain focused on the foundry market and will not compete against subcontractors.
2009-03-03 TSMC details litho roadmap, taps maskless
Taiwan Semiconductor Manufacturing Co. Ltd has detailed it lithography roadmap and said it is still backing maskless technology at the SPIE Advanced Lithography conference.
2010-01-28 TSMC completes Fab 12, Phase 5 construction
TSMC held a topping ceremony for its Fab 12, Phase 5 building located in the Hsinchu Science Park and announced that volume production is expected to begin in Q3 10.
2010-04-16 TSMC CEO calls for industry collaboration
TSMC CEO Morris Chang said there must be more collaboration than ever before between chip makers and foundries with Moore's Law slowing and chip-production costs continuing to soar.
2010-07-21 TSMC breaks ground for new Taiwan plant
Taiwan Semiconductor Manufacturing Co. will invest more than $9.4 billion in a new plant in Taiwan.
2014-02-19 Tips for cost-effective 3D IC production
Know how to distribute the cost-of-ownership across the supply chain.
2012-11-15 TI's SoCs prepped for purpose-built ARM servers
TI hopes to win sockets in systems designed to handle media processing, video analytics, industrial imaging and control and other high performance computing jobs suitable for its DSPs.
2009-10-05 TI 300mm fab puts pressure on analog rivals
Texas Instruments Inc. is putting its analog rivals on notice with its latest a 300mm fab in the United States.
2012-07-04 The CMOS-mobile apps connection
The two biggest markets for logic chips are, of course, mobile (smartphone and tablet) and PC devices. These markets are now steering the technology direction and defining the winners and losers.
2011-02-09 Tensilica allows customer evaluation of Atlas DPUs
Now available for customer evaluation are ConnX SSP16, a 16-way SIMD baseband core optimized for processing of soft bits, and ConnX BSP3, a baseband core optimized for processing and control of bit streams.
2014-04-08 Taking a closer look at 20nm bulk CMOS
Foundry vendors planned to migrate to 16/14nm FinFETs rather than 20nm bulk CMOS, but the reality of FinFETs is that the present device structures do not give cost competitive products through 4Q17.
2016-04-11 SuVolta: The demise of the promising start-up
SuVolta said it was going after opportunities in mobile processors, DRAM and IoT but was probably not helped by the fact that the Japanese semiconductor industry was experiencing its own turmoil.
2013-09-06 Suvolta enlists Fujitsu for image processor IC production
SuVolta's MB86S22AA Milbeaut image processor IC includes an ARM Cortex-A5MP and is capable of performing lens distortion and lens resolution correction at a rate of 12 fps across 24 megapixels.
2012-01-26 Startup tries many-core revolution
Kalray's chip is expected to deliver about 200GOPS at 400MHz clock frequency and a maximum performance of about 500GOPS at power consumption of about 5W.
2013-05-21 ST advances PCM foray with NVM-embedded MCUs
STMicroelectronics plans to offer microcontrollers with embedded non-volatile memory as it advances its phase-change memory venture, according to CTO Jean-Marc Chery.
2011-12-14 SRAM boasts operation as low as 0.425V
Fujitsu Semiconductor and SuVolta have cut the power consumption of SRAM blocks by cutting CMOS transistor threshold voltage variation by half.
2013-11-21 Sony PS4 teardown shows near breakeven point on hardware cost
With the PlayStation 4, Sony produced a design whose costs are starting out lower than its price tag—paving the way for the company to quickly attain profitability on hardware sales, said IHS.
2014-09-02 SONOS returns, finds use in IoT
Cypress Semiconductor sees that the 1960s-developed silicon oxide nitride oxide silicon technology has what it takes to address the scaling and power challenges in connected devices.
2013-01-10 Snapdragon powered by quad-core Krait sampled out
The Snapdragon 600 and 800 are powered by quad-core Krait 300 and Krait 400 processors, respectively, enhanced implementations of its currently used ARM-compatible Krait processor.
2010-10-13 SMIC finds focus
SMIC seems to be focusing on logic, analog and mixed-signal markets as it moves to restore customer confidence and emphasize profitability.
2014-04-10 Six hot tech trends emerge in high-speed memory
While DDR4 comes first to mind in consideration of the latest developments in high-speed memory, several others including embedded DRAM and SRAM cells make the top six list.
2011-04-26 Silicon integration key to lower-cost smartphones
To meet growing demand for lower-cost smartphones, most designers will integrate application and baseband processors, putting such integrated chips into nearly 70 percent of all smartphones by 2014.
2013-09-06 SiIP platform supports CEI standards up to 28Gb/s
The SBMULTC2T28HPM28G SiIP PHY from Semtech is targeted for the new generation of chips supporting emerging Exascale computing, Terabit networking and Petabyte storage markets.
2014-06-18 Sensor fusion paves way for next-gen apps
Know the importance of sensor fusion in connected embedded systems and how the ARC EM4 32bit CPU-based sensor IP sub-system allows design of devices with the right performance/power consumption mix.
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