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2012-07-23 AMD: PC CPU sales possibly reduced to single digits
PC processor sales have been projected to slow in the long term to a new baseline of low second-digit growth.
2014-05-06 AMD takes massive strides with ARM cores
AMD has apparently upgraded its on-chip fabric, I/O and memory-management units for its upcoming ARM cores, saying that it is well along in implementing its architecture work and custom designs.
2009-03-06 AMD foundry spinoff christened 'GlobalFoundries'
The new silicon foundry spinoff from Advanced Micro Devices Inc. dubbed GlobalFoundries has officially opened for business and disclosed its corporate name and unveiled its strategy.
2013-09-06 Altera, Micron demonstrate FPGA and HMC interoperability
The demonstration provides an early proof point that production support of HMC will be delivered with Altera's Generation 10 portfolio and includes both Stratix 10 and Arria 10 FPGAs and SoCs.
2014-04-22 Altera adopts fine-pitch copper packaging for Arria FPGAs
TSMC's flip chip ball grid array package technology utilises fine-pitch copper bumps measuring less than 150?m, providing excellent bump joint fatigue life, improved performance in electro-migration current and low stress on the ELK layers.
2014-06-05 Address SoC routing congestion with 2.5D SiP
The best of both worlds approach that the electronics industry has come up with to solve a design dilemma is the System in Package (SiP) in a 2D package.
2012-06-07 A*STAR, UMC team up on TSV tech
The resulting technology will substantially enhance performance, lower costs and shrink the size of multimegapixel image sensors found in mobile applications, the companies said.
2016-01-19 A tech walkthrough of metal gate I/O transistors
The input/output (I/O) transistor is the workhorse of the metal gate CMOS transistors, yet noone really talks about it. In this article, we'll see why it is worth a look.
2015-08-19 A look inside GlobalFoundries' Fab 8
A tour of the plant and an affiliated research centre in nearby Albany provided a look inside an operation that now carries the DNA of chip giants such as AMD, IBM and Samsung.
2015-07-28 A closer look inside SK Hynix's 1st high bandwidth memory
SK Hynix's HBM has a 1,024-wide bus. It employs a base logic die as an interface between the four DRAM die stack and an interposer that supports both the HBM modules and the AMD GPU.
2015-09-10 60 start-up companies to watch in 2015
EE Times has selected 30 start-up companies to come on to version 16.1 of its list of 60 firms that are worth keeping an eye on. Readers are welcome to nominate their own emerging companies.
2011-09-23 5-core mobile CPUs slash power use
Nvidia claims its Tegra 3 processor consumes 14 to 61 percent less energy compared to a standard quad-core.
2015-02-27 5 things to expect at Mobile World Congress
The Mobile World Congress has morphed into a gathering place to discover and debate connected devices and new network technologies tailored for different applications.
2014-02-06 3D TSV Summit underscores cost-effective production
From a maker's perspective, 3D IC production will only ramp up if the added costs for implementing TSVs and all the ensuing steps can be largely compensated by the IC performance benefits.
2012-06-04 3D FPGA address Nx100G, 400G line card apps
Xilinx's heterogeneous all programmable Virtex-7 H580T 3D FPGA feature up to 16 28Gb/s and 72 13.1Gb/s transceivers.
2009-12-28 2009: Rollercoaster ride for foundries
Foundry providers took a beating along with everyone else during this tumultuous year. But the damage done by the economy was multiplied by the foundries' own foul-ups.
2013-01-29 1/f noise measurement system supports 1Hz-10MHz
ProPlus Design Solutions' 9812D can measure low-frequency noise characteristics of on-wafer or packaged semiconductor devices such as MOSFETs, BJTs, JFETs, diodes and diffusion resistors.
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