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2011-01-20 32/28-nm reference flow for Common Platform Alliance ushered
Cadence's 32/28nm Low-Power RTL-to-GDSII Silicon Realization Reference features new design intent, abstraction and convergence capabilities giving more deterministic path to advanced silicon
2015-01-26 1.7GHz ARM Cortex-A7 SoC cuts power usage down to 200mW
UMC developed a silicon-ready 28nm SoC that utilised signoff tools supplied by Cadence, aimed at entry-level smartphones, tablets, high-end wearables and other advanced mobile devices
2011-01-20 Weak volume chip sales seen for 10GBase-T in 2011
According to analysis firm LightCounting, volume chip sales based on 40nm devices for the 10GBase-T standard will be weak this year, with Intel being the only company with an integrated 10GBase-T transceiver for copper cables today.
2013-03-08 Voice activation sol'n based on CEVA-TeakLite-4 DSP
Ceva and Sensory's solution includes Sensory's Low Power Speech Detector technology that claims to cut power use for always listening devices, smartphones, tablets, games, TVs and cars.
2016-01-29 UMC hopes for a turnaround with capex boost in 2016
The company raised its expected capital expenditure for 2016, from $1.8 billion last year, to about $2.2 billion on expectations that the chip industry will emerge from a downturn around 2Q16.
2009-05-06 TSMC resolves 40nm yield issues
Silicon foundry giant Taiwan Semiconductor Manufacturing Co. Ltd posted better-than-expect results in Q1 09.
2014-10-17 TSMC raising capex to $10B for FinFET ramp-up
The company will increase its 2015 capex from the $9.6 billion slated for this year. TSMC is raising the stakes with Samsung, both aiming to win FinFET orders from Apple and Qualcomm for the fast-growing smartphone and tablet segments of the electronics business.
2009-04-23 TSMC invests in R&D despite downturn
Taiwan Semiconductor Manufacturing Co. Ltd remains cautiously optimistic about the IC industry and vowed that it will continue to invest in R&D despite the downturn.
2014-04-25 TSMC fleshes out IC line-up with shrunk TSVs
Based on its work on chip stacks, TSMC will launch in July an enhanced version of the 16nm FinFET technology with up to 18 per cent faster data rates and lower leakage, in addition to a planned 10mm and 7mm processes.
2012-09-27 The iPhone 5 inside out
Apple's iPhone 5 A1428 model, torn apart for a closer inspection
2014-05-23 Synopsys adapts IP solution for PCI Express 4.0
The DesignWare IP supporting the PCIe 4.0 architectureincluding controller, verification, and PHYlowers integration risk and accelerates availability of devices integrating the 16GT/s speed.
2013-12-19 Startup boasts advanced digital modulation tech
Magnacom will use an FPGA board to deliver 10dB signaling advantage compared to QAM4096, the most powerful version of the quadrature amplitude modulation scheme widely used in communications today.
2013-03-20 Spreadtrum wins big in smartphone market
Spreadtrum leads in China Mobile's TD-SCDM-based smartphone market with its single-core smartphone platforms. The company is said to have had more than a 50 percent market share among China Mobile's TD-SCDMA handsets in 2012.
2015-10-22 Single-chip PON OLT device targets fibre service providers
The Broadcom BCM68620 offers support for both existing and next-generation fibre technologies under a common API to enable a unified system software design that can be applied to all PON protocols.
2011-06-03 Simulation products support TSMC's AMS reference
Magma Design Automation announced that TSMC has validated the Titan Mixed-Signal and FineSim simulation products for Analog/Mixed-Signal (AMS) reference.
2012-12-18 Samsung acquires SSD firm, augments Texas fab
Samsung Electronics ramped up its investment at its mobile applications processor facility at Austin, Texas and bolstered its SSD solutions offering with its newest acquisition.
2011-05-31 Renesas Mobile CEO sees LTE, modem tech as keys to success
Renesas Mobile's CEO has revealed the company's medium- and long-term plans, among them, a new modem technology and mobile app processor, and LTE chips connected to cloud services.
2012-05-31 Reference architecture speeds modem time-to-market
Ceva's reference architecture for LTE-Advanced (LTE-A) and cellular modems leverages power management and system partitioning to enable a software-based LTE-A solution as small as 3.4 x 3.4mm.
2012-05-30 Reference architecture anticipates 802.11ac
Ceva and Antcor jointly release a low power, WiFi 802.11ac reference architecture designed for multimode WiFi 802.11ac mobile stations requiring a 1.5 x 1.5mm die area.
2010-11-10 Quickpath IP gets into Achronix FPGAs
Intel's Quickpath IP core for processor communications will be integrated into FPGAs from Achronix that will be manufactured by Intel.
2010-07-08 Qualcomm plans to rev up struggling lines
Qualcomm Inc. launched a number of new initiatives for many of its lesser-known products including Brew OS, Snapdragon and MediaFlo mobile TV.
2013-03-01 Quad-core SoC, LTE slug it out in the mobile arena
Nvidia and Marvell are rushing to announce new smartphone ICs with the mobile industry's two new vital features: quad-core and LTE modem.
2013-08-21 Packet processors target next-gen service delivery apps
The Marvell Prestera DX4200 series aims to enable highly differentiated service-delivery solutions in the access and aggregation layers for a new generation of converged fixed and mobile networks.
2011-03-11 OFC participants eagerly await 25G chips
Engineers are counting on multiple industry announcements of 25G chips in CMOS at the OFC, claiming these chips are a major industry trend that will bring about more efficient next-generation products.
2010-09-23 Nvidia warming up for Kepler launch
Nvidia Corp. has unveiled a road map of graphics processors at its GPU Technical Conference in California.
2013-01-09 Nvidia showcases latest Tegra 4 processor
Nvidia launched a quad-core Tegra 4 application processor based on the Cortex A15 as well as a hybrid mobile game player and streaming system.
2014-08-01 Movidius unveils next-gen vision processing unit
Myriad 2 is said to be 20 times better than its precursor, boasting 2TFLOPS of 16bit performance from a chip measuring only 6.5mm2.
2013-12-18 Monolithic 3D ICs gain momentum
A number of companies have, in one way or another, started to take leverage in the monolithic 3D IC space and designated the technology as an alternative to dimensional scaling.
2013-05-06 MediaTek smartphone platform touts dual-core HSPA+ SoC
In addition to the integrated Wi-Fi, FM, GPS and Bluetooth functions, MediaTek's MT6572 claims to enable a cost-effective 4-layer PCB design.
2012-12-13 MediaTek integrates modem into latest apps SoC
MediaTek is going head to head with Qualcomm with its latest quad-core mobile apps processor with built-in modem.
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