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2012-04-20 TSMC shifts from multiple to single-only process at 20nm
Shang-yi Chiang, EVP at TSMC, said the firm might also offer an 18nm or 16nm process node after 20nm if lithography technology is not available to make 14-nm devices cost effectively.
2009-05-06 TSMC resolves 40nm yield issues
Silicon foundry giant Taiwan Semiconductor Manufacturing Co. Ltd posted better-than-expect results in Q1 09.
2014-01-20 TSMC registers 10.9% revenue growth in Q4
The foundry firm attributed its Q4 growth to the accelerated demand for mobile devices late in the year and its improved margins, lifting its Q4 net income and diluted earnings per share by 7.7 percent.
2009-09-07 TSMC rebounds with 28-/32nm roadmap
As it solidifies its process roadmap, foundry giant Taiwan Semiconductor Manufacturing Co. Ltd continues to see a surge in business.
2014-10-17 TSMC raising capex to $10B for FinFET ramp-up
The company will increase its 2015 capex from the $9.6 billion slated for this year. TSMC is raising the stakes with Samsung, both aiming to win FinFET orders from Apple and Qualcomm for the fast-growing smartphone and tablet segments of the electronics business.
2009-04-23 TSMC invests in R&D despite downturn
Taiwan Semiconductor Manufacturing Co. Ltd remains cautiously optimistic about the IC industry and vowed that it will continue to invest in R&D despite the downturn.
2015-09-21 TSMC heats up 10nm engine, preps 16nm for 2017
TSMC has gotten off to a slow start with its 16nm FinFET process and has also announced plans for specialty RRAM and MRAM memories that would act as alternatives to embedded flash.
2015-01-20 TSMC gets negative outlook from analysts
Lower unit demand from Qualcomm will lead to lower fab loading during the second and third quarters of this year. TSMC will also face stiff competition to its 16nm chips from Samsung's 14nm offerings.
2014-04-25 TSMC fleshes out IC line-up with shrunk TSVs
Based on its work on chip stacks, TSMC will launch in July an enhanced version of the 16nm FinFET technology with up to 18 per cent faster data rates and lower leakage, in addition to a planned 10mm and 7mm processes.
2012-01-30 TSMC fires back at analysts
Marced did acknowledge that each process node roll out has problems but said TSMC engineers rise to the challenges.
2014-09-26 TSMC fabricates networking chip with 16nm FinFET
The 32-core ARM Cortex A57-based processor is fabricated using TSMC's 16nm FinFET technology, and boasts a three-fold increase in performance compared with the previous processors.
2011-04-11 TSMC enters chip-packaging arena
TSMC will soon open a bumping facility and offer silicon interposers and TSV technologies for 3D chips, but will remain focused on the foundry market and will not compete against subcontractors.
2009-03-03 TSMC details litho roadmap, taps maskless
Taiwan Semiconductor Manufacturing Co. Ltd has detailed it lithography roadmap and said it is still backing maskless technology at the SPIE Advanced Lithography conference.
2010-01-28 TSMC completes Fab 12, Phase 5 construction
TSMC held a topping ceremony for its Fab 12, Phase 5 building located in the Hsinchu Science Park and announced that volume production is expected to begin in Q3 10.
2010-04-16 TSMC CEO calls for industry collaboration
TSMC CEO Morris Chang said there must be more collaboration than ever before between chip makers and foundries with Moore's Law slowing and chip-production costs continuing to soar.
2010-07-21 TSMC breaks ground for new Taiwan plant
Taiwan Semiconductor Manufacturing Co. will invest more than $9.4 billion in a new plant in Taiwan.
2011-01-20 Toppan-IBM photomask agreement to cover 193nm immersion lithography
Toppan Printing Co. Ltd and IBM have agreed to extend their joint photomask process development efforts involving the 14nm technology node for logic devices. The companies will now collaborate on ArF immersion lithography for the 14nm node.
2012-08-15 Tokyo Electron acquires FSI International for $252.2 million
Tokyo Electron has offered to pay $6.20 per share, which represents a premium of 53.5 percent over the Aug. 10 closing price for FSI's common shares.
2014-02-19 Tips for cost-effective 3D IC production
Know how to distribute the cost-of-ownership across the supply chain.
2012-02-02 TI, Avago push signal data rates to the limit
Both companies are using the latest process technologies and signal integrity techniques to hit new milestones catering to responding to the need to carry ever more data over networks while keeping a lid on power and cost.
2012-11-15 TI's SoCs prepped for purpose-built ARM servers
TI hopes to win sockets in systems designed to handle media processing, video analytics, industrial imaging and control and other high performance computing jobs suitable for its DSPs.
2009-10-05 TI 300mm fab puts pressure on analog rivals
Texas Instruments Inc. is putting its analog rivals on notice with its latest a 300mm fab in the United States.
2012-02-29 There's hope for unified networks after all
Global carriers have used two or three flavors of cellular technology. The move to a converged TD/FDD LTE network represents the current best hope for a single global standard.
2012-09-27 The iPhone 5 inside out
Apple's iPhone 5 A1428 model, torn apart for a closer inspection
2012-07-04 The CMOS-mobile apps connection
The two biggest markets for logic chips are, of course, mobile (smartphone and tablet) and PC devices. These markets are now steering the technology direction and defining the winners and losers.
2011-03-31 Tensilica releases DSP core for cellular basebands
Aimed at cellular basebands, Tensilica's Xtensa LX4 boasts lower power and a smaller footprint, reaching speeds of more than 1GHz in a high-performance 45nm process with an area of only 0.044mm2.
2011-02-09 Tensilica allows customer evaluation of Atlas DPUs
Now available for customer evaluation are ConnX SSP16, a 16-way SIMD baseband core optimized for processing of soft bits, and ConnX BSP3, a baseband core optimized for processing and control of bit streams.
2008-12-17 Tech firms detail high-k developments
IBM, Intel, TSMC and the NEC-Toshiba duo are expected to present papers on 32nm processes with high-k and metal gates at this week's International Electron Devices Meeting (IEDM).
2012-02-29 Team up focuses on reconfigurable RF transceivers
HiSilicon and Imec collaborated to develop RF transceiver architectures for next-generation mobile terminals.
2015-04-30 Taking advantage of TSMC's 28HPC process
Here are five areas where designers can take advantage of this new process with logic library technology to optimise the performance, power and area of their system on chips.
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