Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > 2D semiconductor

2D semiconductor Search results

?
?
total search132 articles
2016-05-12 Tech breakthrough boosts 2D semiconductor photoluminescence by 20,000-fold
National University of Singapore researchers said the discovery could pave the way for the application of 2D semiconductors such as tungsten diselenide in advanced optoelectronic and photonic devices
2015-06-24 Scalable production of low-temperature 2D MoS2 films
Researchers at the University of Southampton's Zepler Institute characterised large-area 2D films of molybdenum disulphide at room temperature using a process that is scalable to any size wafer
2013-04-17 Research: Layered 2D nanocrystals to replace CMOS
Made up of a material called molybdenum disulfide, the layered structure could pave the way for further scaling and improving compute performance driven by smaller transistors.
2016-02-03 Promising 2D material opens path for next-gen spintronics
Researchers from NUS and Yale-NUS College have established the mechanisms for spin motion in molybdenum disulphide (MoS2), an emerging 2D material that shows potential for low-power devices
2003-06-06 NEC semiconductor package <1mm thick
NEC Corp. and NEC Electronics Ltd. announced that they have developed a MLTS as well as a semiconductor package to support it
2010-12-11 2D/3D chip banks on 3D in smart phones, tablets
Dialog’s DA8223, which has a hardwired, dedicated architecture that puts no extra load on the host application processor and requires no external memory, can be plugged into existing portable devices.
2014-04-11 2D molybdenum shows potential for LED prod'n
Researchers created a method for making 2D molybdenum diselenide using CVD and is widely used by the semiconductor and materials industries to make thin films of silicon, carbon fibres and other materials.
2014-06-06 2D FET exhibits high electron mobility
The FET is built from all 2D material components, suffering no performance drop-off under high voltages and providing high electron mobility even when scaled to a monolayer in thickness
2012-08-13 Multitest introduces integrated 2D code reader
Semiconductor test equipment manufacturer now offers advanced code reader
2013-05-20 2D stacking makes for high-quality semiconductors
MIT researchers discover a new method towards engineering a band gap into graphene, which is necessary to form transistors and other semiconductor devices
2009-07-08 Coming soon: Carbon chips
Carbonthe basis of all organic compoundsseems destined to displace silicon as the material of choice for future semiconductors.
2005-05-02 ZyCube duo has big plans for 3D circuits
Two executives from Zycube Co. Ltd lay the road map for significant trends in 3D technology.
2008-08-13 World's first 3D chip technology surfaces
The world's first 3D chip process is ready for licensing from the fabless semiconductor design house BeSang
2008-07-07 Qimonda, Siltronic team on next-gen transistors
Qimonda has teamed up with wafer manufacturer Siltronic AG to conduct basic research for future transistor architectures that focuses on three-dimensional transistors that will enable smaller geometries.
2003-02-24 PPT Vision, Ismeca ink OEM supply agreement
PPT Vision Inc. has entered into an OEM supply agreement with Ismeca Europe S.A.
2010-05-21 Opinion: Custom IC design needs variation analysis
Incorporating optimal sampling and design-specific corner methods into variation-aware custom IC design can avoid costly over-margining or under-designing, and avoid delaying project schedules.
2007-01-01 Multimedia ICs target China's PMP market
In a bid to woo PMP manufacturers in China, Vimicro Corp. has launched a line of multimedia chips complete with reference designs and software.
2008-08-06 KLA-Tencor to buy microelectronic biz of Vistec
KLA-Tencor has entered into an agreement to acquire the Microelectronic Inspection Equipment business unit of Vistec Semiconductor Systems
2013-09-27 Enable depth discernment in embedded vision apps
Explore the depth sensor technology alternatives available for building vision applications with the ability to sense objects in three dimensions.
2012-02-13 Challenges, opportunities of the 2.5D/3D ecosystem
While opportunities abound, moving to 2.5D/3D manufacturing has posed significant challenges to designing, fabricating, assembling and testing of 2.5D/3D ICs.
2004-05-28 Atsana, 1 Ltd team for auto-focus features on mobile phones
Atsana Semiconductor and 1 Ltd are collaborating on a low cost, low power, small form-factor solution for auto-focus functionality on camera-enabled smartphones
2002-08-19 Agilent to provide inspection solutions to Ismeca
Ismeca SA and Agilent Technologies Inc. have entered into an OEM agreement in which the latter will integrate its machine vision suite and inspection solutions into Ismeca's semiconductor test handler equipment
2014-05-26 7nm, 5nm scaling compels adoption of new materials
Shifting advanced nodes involve exploring alternativesfrom silicon to graphene, FinFET to SOIand considering how to apply the strengths associated with 3D device architectures to new technologies.
2013-12-05 3D NAND industry-wide adoption still shaky
Development and production of 3D NAND is ramping up, but 2014 will clearly be a shakeout year.
2015-01-26 10 vital signs of the semicon industry
According to Bill McClean, president of IC Insights, the semiconductor industry can expect a bright year ahead with a growth forecast of 7 per cent, but things will become tougher in 2018
2010-06-29 Low-cost organic ICs close gap with silicon
McGill University researchers claim a breakthrough that could help organic semiconductors bridge the considerable performance gap with silicon chips.
2011-10-14 The move toward 3D chips
Semiconductor fabrication is moving toward 3D ICs and by next year, 3D chips will be available for commercialization
2007-02-20 SEMI releases 11 tech standards for FPD, MEMS
SEMI has published 11 technical standards for the semiconductor, flat panel display and MEMS manufacturing industries
2014-06-18 Qualcomm advocates monolithic 3D adoption
The chipmaker appears to be making a concentrated effort to employ 3D integration technology to stretch out the semiconductor roadmap beyond the scaling trajectory predicted by Moore's Law
2008-01-14 Processor combines ARM9 CPU, 3D graphics engine
Magnum Semiconductor Corp. announced the ZEVIO ZV1050 multimedia application processor, the latest member of its ZEVIO SoC line for cost-effective and power-sensitive applications in consumer entertainment and information applications
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top