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2011-05-19 Russia, Crocus ink $300M MRAM production deal
Under the $300 million deal signed with Rusnano, Crocus will set up a Russian joint venture to manufacture ICs for MRAM using 90nm process technology.
2006-09-27 ASML to spend $300M on Taiwan R&D center, says report
ASML Holding NV is considering spending as much as $300 million to set up an R&D center in Taiwan, having rejected South Korea as a location, according to a Taipei Times report.
2008-07-14 Sematech: 450mm program is on track
International Sematech is moving full speed ahead with its 450mm programs, but the question is whether the industry can meet its lofty goals in building 450mm fabs by 2012.
2008-07-25 Hynix's 200mm U.S. facility to close shop soon
Hynix will close within two months a 200mm DRAM wafer fab in Eugene, Oregon, according to local officials speaking after a visit from Jong Kap Kim, chief executive, Hynix
2004-01-23 Epistar to boost chip production
Epistar Corp. is planning to increase monthly capacity for AlGaAs Epi-wafer chips to 300M units by the end of this year.
2008-02-22 Gennum debuts integrated ROSA line for 10GbE
Gennum will debut a range of short- and long-wave ROSAs for 10GbE and Sonet applications spanning data center to ultra-longhaul distances.
2012-03-09 A*STAR, Applied Materials unveil 3D chip packaging R&D center
The new facility positions Singapore as a global leader in semiconductor R&D and is expected to help accelerate the development and adoption of 3D packaging technology globally.
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