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2005-06-17 Winbond to ramp up 300mm production using ESI Model 9830
Winbond Electronics Corp. has purchased multiple ESI Model 9830 semiconductor link processing systems from Electro Scientific Industries Inc. to be installed at its latest 300mm fab in Taichung, Taiwan.
2007-03-26 Winbond sells 200mm fab for $251M
Winbond Electronics Corp. Board of Directors has approved the deal to sell the 200mm fab in Hsinchu Science Park to Vanguard International Semiconductor Corporation (VIS) for about $251 million
2005-06-23 Winbond 300mm production adopts VIISta implanters
Taiwan-based Winbond Electronics Corp. has purchased VIISta single wafer ion implanters from Varian Semiconductor Equipment Associates Inc. Winbond has used the tools in its 300mm production
2005-08-25 Winbond 300mm fab equipped with Mattson production tools
Winbond Electronics Corp. has purchased advanced process equipment from Mattson Technology Inc.
2007-08-17 Will AMD push its New York fab plan
AMD has until July 2009 to decide whether to proceed with its plan to build a 300mm fab in New York, after which the $1.2 billion in state incentives will expire.
2005-01-13 Varian Semicon installs ion implanter at UMC's 300mm fab
Varian Semiconductor Equipment Associates Inc. announced that it has completed the installation of a third single wafer VIISta 80HP high current ion implanter to enhance United Microelectronics Corp.'s advanced process capacity at its 300mm Fab in Tainan, Taiwan.
2007-01-10 UMC's new 300mm fab to open in '08
United Microelectronics Corp. said it foresees opening a new 300mm wafer plant in 2008
2004-01-29 UMC orders Axcelis ion implanters for Tainan fab
United Microelectronics Corp. has issued a multi-system order for Axcelis Technologies' HC3 Ultra high current ion implanter for installation in its 300mm fab in Tainan, Taiwan.
2009-10-13 UMC gears Singapore fab up for 45/40nm
UMC's Fab 12i in Singapore has begun an aggressive expansion project, increasing its capacity and enabling 45/40nm production
2012-05-25 UMC begins phase 5 & 6 of Fab 12A
The expansion begins UMC's new generation of 300mm manufacturing that will extend 28nm production and establish a solid foundation for 20nm and beyond to meet customers' high-end demand
2005-08-30 TSMC refutes setting up 300mm fab in China
Taiwan Semiconductor Mfg Co. (TSMC) has refuted rumors that it will set up a 300mm wafer fab plant in mainland China.
2006-02-13 Toshiba, SanDisk to boost spending on flash fab
In an effort to keep up with huge demand for its NAND flash-memory devices, SanDisk and Toshiba said that they plan to boost the investment and production levels of its 300mm fab venture in Japan.
2006-03-15 Toshiba, SanDisk tip new fabagain
According to reports, Toshiba will spend billions of yen to build another new 300mm fab, with construction slated to start by 2009.
2006-08-15 Toshiba, SanDisk start construction of 300mm Yokkaichi fab
Toshiba and SanDisk recently announced that, further to definitive agreements that they entered into in July 2006, the construction of Fab 4, a 300mm wafer fab in Yokkaichi Japan, has started.
2007-09-06 Toshiba, SanDisk open 300mm Yokkaichi fab
Toshiba and SanDisk have inaugurated the 300mm Fab 4 at Toshiba's Yokkaichi Operations in Mie Prefecture, Japan.
2004-04-16 Toshiba, SanDisk expand 300mm NAND fab plan
Toshiba Corp. said it expects the final capacity of its planned 300mm NAND memory fab to be about 37,500 wafers a month, 1.5 times larger than the original plan announced in last December.
2002-12-17 Toshiba's 300mm expansion to cost $3 billion
Toshiba Corp. is targeting a much-anticipated plan for 300mm manufacturing: a $2.9 billion endeavor that includes two fabs, one for SoC LSIs and another for memories
2008-10-28 Toshiba seeks to lower fab operating costs
For years, market officials have urged the IC and chip-equipment segments to collaborate in minimizing fab costs and introduce new technologies to the market
2006-09-12 Toshiba keeps mum over Fab 5 location
Toshiba has confirmed it is considering overseas sites for Fab 5, its next NAND wafer fab. The obvious locations for Fab 5 would be in Southeast Asia, most likely in Taiwan. However, Toshiba is not expected to announce the Fab 5 location until sometime in 2007
2010-11-09 TI, Maxim push 300mm analog
Texas Instruments and Maxim Integrated Products have made recent advances in manufacturing 300mm analog devices, prompting analysts to ask how much impact the move will have on the segment
2007-05-22 TI bares details of new 'hybrid' fab strategy
Moving to remain competitive in what has become a brave new world of IC manufacturing, TI had disclosed details of its revised 'hybrid' fab strategy
2009-10-05 TI 300mm fab puts pressure on analog rivals
Texas Instruments Inc. is putting its analog rivals on notice with its latest a 300mm fab in the United States.
2003-01-02 The truth about 300mm
The move to 300mm wafers will leave fewer companies owning their own fabs; the few that can fill 300mm fabs will pull increasingly ahead of direct competitors that choose to use foundries
2006-10-12 ST-Hynix JV fab ramps memory ICs
STMicroelectronics and Hynix Semiconductor officially opened their joint memory manufacturing fab in Wuxi City, Jiangsu Province, China Tuesday, Oct. 10
2008-03-10 Spansion's 300mm NOR fab ramps in Japan
Spansion has announced that it has reached a reached a production milestone of more than 25,000 wafer starts per quarter at its Spansion 1 (SP1) facility in Aizuwakamatsu, Japan, the world's first 300mm NOR fab.
2004-05-26 Sony's 300mm fab starts test production of Cell processor
Sony Corp.'s Nagasaki 300mm fab has begun test production of Cell processors, Ken Kutaragi, Sony's executive deputy president and COO, acknowledged this week. He declined to elaborate.
2006-07-10 Soitec to build 300mm fab in Singapore
Soitec SA announced that it plans to build a new production plant in Singapore and expand its existing production base in France.
2006-08-30 Soitec launches new 300mm fab in Singapore
SOI wafer supplier Soitec has started work on a new 300mm fab at Singapore. According to Soitec CEO Andre-Jacques Auberton-Herve, this new fab will play a key role in the company's growth strategy.
2008-01-31 SMIC to put up 200mm, 300mm fabs in Shenzhen
China's SMIC has struck a deal with the Shenzhen municipal government under which the foundry provider will build new and separate 200mm and 300mm fabs in that region
2006-05-19 SMIC to build 300mm fab in Hubei
Is Chinese silicon foundry provider Semiconductor Mfg International Corp. building yet another 300mm fab?
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