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2005-08-30 TSMC refutes setting up 300mm fab in China
Taiwan Semiconductor Mfg Co. (TSMC) has refuted rumors that it will set up a 300mm wafer fab plant in mainland China
2003-01-02 The truth about 300mm
The move to 300mm wafers will leave fewer companies owning their own fabs; the few that can fill 300mm fabs will pull increasingly ahead of direct competitors that choose to use foundries.
2008-08-04 Taiwan ponders on 300mm fabs in China
The Taiwan government is mulling over a plan to relax its IC export control laws in China, according to a report from Forbes.
2005-08-19 Soaring tool costs to delay 450mm fabs
Soaring IC-equipment development costs could push out the appearance of next-generation 450mm wafer fabs to between 2020 and 2025a delay of more than a decade from its current schedule, warned an analyst at VLSI Research Inc
2005-08-22 Soaring tool costs to delay 450mm fabs
Soaring IC-equipment development costs could push out the appearance of next-generation 450mm wafer fabs to between 2020 and 2025 ? a delay of more than a decade from its current schedule, warned an analyst at VLSI Research Inc
2008-01-31 SMIC to put up 200mm, 300mm fabs in Shenzhen
China's SMIC has struck a deal with the Shenzhen municipal government under which the foundry provider will build new and separate 200mm and 300mm fabs in that region.
2002-08-01 Singapore fabs serve as EE training ground
This news article shows the movement of Engineers to and from Singapore to find better job opportunities and advanced training.
2006-01-26 Sematech CEO tips '300mm-prime' effort
The semiconductor industry is exploring new ways to extend 300mm fabs and push out the need for 450mm plants, according to Sematech.
2006-09-06 ProMOS to invest $5B for two more 300mm fabs
Memory maker ProMOS Technology Inc. disclosed that it is planning to invest $5 billion for two more 300mm wafer DRAM fabs that will be located in central Taiwan. Construction is set to begin in the Q3 of next year.
2006-07-14 Production scheduling tool rolls for 300mm fabs
Ilog has unveiled the Fab PowerOps, touted to be the first software package to address production scheduling for front-end process areas within a 300mm semiconductor fabrication plant
2003-01-17 Motorola pare plants, seeks 300mm partner
In 2000, Motorola Inc.'s Semiconductor Products Sector had 27 front-end and back-end manufacturing sites. By the middle of this year, the company will have reduced that number to 10.
2005-05-26 Mattson equips ProMOS' 300mm Taiwan fab
Mattson Technology Inc. will be used to support the production ramp at Promos Technologies' newest 300mm wafer fab in the Central Taiwan Science Park (CTSP), Taiwan
2005-12-05 Intel to build 300mm wafer fab in Israel
Intel announced plans to build a new 300mm wafer fabrication facility at its site in Kiryat Gat, Israel
2005-10-26 Intel invests $650 million to expand 300mm fab
Continuing its strategy to increase 300mm manufacturing capacity, semiconductor supplier Intel Corp. announced Monday (Oct. 24) it would invest $650 million to expand an existing fab in Rio Rancho, N.M., called Fab 11X
2004-04-27 Intel converts Arizon facility to 300mm
Intel Corp. has begun a $2 billion construction project to convert a 200mm wafer fabrication facility to a 300mm facility in Chandler, Arizona
2008-01-21 Infineon CEO: Chipmakers must build systems, not fabs
To survive the wave of consolidation rolling over the semiconductor industry, companies must shift their focus from building fabs to building systems, and they must engage with customers at deep technical levels, according to Wolfgang Ziebart, Infineon CEO
2008-09-22 Hynix shuts down 200mm fabs
Hynix Semiconductor Inc. will retire its 200mm wafer fabrication plants earlier than planned in order to improve its financial stability and focus on profitability.
2004-03-04 Fujitsu mulls plan for $1.5B 300mm wafer fab
Fujitsu Ltd is planning to spend $1.5 billion to build a 300mm fab, which will begin operation in spring 2005 with a capacity of 10,000 wafers a month, reported a Japanese newspaper
2008-08-08 Elpida to build 300mm fab in China
After separating from its foundry partner in China, Elpida Memory Inc. plans to create a 300mm fab venture in the country. Its total capital expenditure for the new fab in China reaches $5 billion
2006-12-05 Dropping 300mm, wise move for Hua Hong
The decision by an affiliate of China's Hua Hong NEC to back away from an earlier commitment to build a 300mm wafer plant makes sense for the company, an iSuppli Corp analyst said
2003-03-25 Cost crossover near for 300mm wafers
Though only about 1 percent of all chips are made on 300mm wafers currently, an Applied Materials Corp. executive said that the cost crossover between 300mm and 200mm wafers will occur late this year
2005-11-04 CMD to build 200-, 300mm fabs in China
A little-known group called CMD International (Tianjin) Electronic Co. Ltd. has broken ground on a large-scale semiconductor and R&D project in Tianjin, China, with claims that it will build both 200- and 300-mm fabs in that nation
2005-06-10 China to build 20 new fabs by 2008
In what could be the next boom for the IC-equipment industry, China is expected to build 20 new fabs between 2005 to 2008, according to a new report from the Semiconductor Equipment and Materials International (SEMI
2007-01-16 China faces bumpy road to 300mm
The outlook for China's chip industry clouded after a Hua Hong NEC affiliate announced in December it would shelve plans for a 300mm wafer fab and instead build a 200mm line
2006-12-21 China fabs to boost used IC equipment market
By the year 2009, the China market for used semiconductor equipment will hit $800 million as more foreign companies decide to move their legacy gear to the country.
2013-07-04 Capacity for 300mm wafers to grow 70% by 2017
IC Insights forecasted that production using 300mm wafers will steadily increase and reach 70.4 per cent in 2017 while 200mm wafers is expected to drop to 21 per cent in December 2017
2014-02-10 300mm wafer processing dominates, 200mm capacity stays relevant
IC Insights indicated that nearly all fab upgrade and construction activity has to do with 300mm wafer processing, but there is still plenty of life remaining in 200mm fabs.
2005-03-04 300mm fabs to drive 2005 capex growth at 2 percent, says firm
The facilitation of 300mm wafer fabs will help maintain capital expenditure and cause chip capital spending to grow by 2 percent in 2005, according to market research company Strategic Marketing Associates.
2007-08-13 300mm fabs add capacity despite memory price fall
SEMI found that despite the steep memory price fall, manufacturers continue to invest significantly in additional 300mm fab capacity
2003-03-31 Xilinx to ship 300mm-based FPGAs
Xilinx Inc. has announced that it is shipping all its advanced FPGA product lines on 300mm wafers, including its Virtex-E, Virtex-II, Virtex-II Pro, and Spartan-IIE FPGAs
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