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2003-04-01 Xilinx qualifies for 300mm production at UMC
Xilinx Inc. has announced production qualification for its 130nm Virtex-II Pro on 300mm wafers with fab partner United Microelectronics Corp. at the latter's manufacturing facility, Fab12a, in Taiwan
2004-05-06 Winbond plans 300mm wafer fab in 2005
Looking to ride a recovery in the semiconductor market, Winbond Electronics Corp. is putting into motion plans for a long-awaited 300mm wafer fab that will come on line in late 2005.
2005-01-26 Winbond invests in 300mm wafer fab
Winbond Electronics Corp. said Monday (Jan. 24) it is taking out a $250 million loan to fund the early phase construction of its 300mm wafer fab in central Taiwan.
2006-06-07 Wafer supplier's growth reflects development of 300mm wafer industry
ADE announced that it has received a multi-million dollar order for 300mm production wafer quality certification and process control systems.
2011-08-09 Wafer reader reduces reading time by 40
Cognex has released a wafer reader that claims to have faster processing power, internal illumination system and total backward compatibility
2004-11-10 Wafer processing device provides quick, accurate leveling
CyberOptics announced a wireless, wafer-like device that enables quick and accurate leveling of semiconductor wafer processing and automation equipment
2008-01-14 Wafer probe stations cut cost in 45nm node
Cascade Microtech has launched the next step in 300mm wafer probe stations designed to meet the need for advanced on-wafer measurements for semiconductor devices.
2011-11-22 Wafer packaging fab opens in Taiwan
STATS ChipPAC has increased production capacity with the completion of its 300mm wafer bump and WLCSP facility.
2003-08-11 Wafer inspection system allows rapid testing
Nikon's SITECH group has introduced the AMI-3000 wafer inspection system that is designed to meet 300mm wafer production in the 90nm node and beyond.
2012-02-17 Wafer fab shut downs on the rise
Suppliers closed or upgraded their fabs that were manufacturing using smaller wafers and shifted operations to produce more cost-effectively on larger wafers.
2015-07-13 Wafer fab closures projected to grow in the coming years
Qimonda was the first company to close a 300mm wafer fab after it went out of business in early 2009 and more recently, ProMOS and Powerchip closed 300mm wafer fabs in 2013.
2012-01-19 Wafer bonding machine yields 3D integrated LSI ICs
The Bond Meister MWB-12-ST can continuously bond up to five 12in wafers and can perform wafer transfer and alignment for automatic bonding
2002-06-05 UMCi jumpstarts new construction phase for 300mm wafer facility
Singapore-based UMCi, a joint venture between UMC, Infineon Technologies AG (IFX) and EDBI, has awarded major contracts for the next-phase of the construction of its 300mm facility located at the Pasir Ris Wafer Fab Park.
2007-01-10 UMC's new 300mm fab to open in '08
United Microelectronics Corp. said it foresees opening a new 300mm wafer plant in 2008.
2002-01-09 UMC may delay 300mm joint-venture fab in Singapore
United Microelectronics Corp. might delay the opening of a 300mm wafer plant joint venture in Singapore by six to nine months.
2002-09-17 UMC denies reports of 300mm wafer capacity cuts
United Microelectronics Corp. is denying a news report that it will slice in half its 300mm wafer capacity to 5,000 wafers per month by the end of the year.
2003-04-23 UMC adopts Agilent solution for 300mm wafer testing
Semiconductor foundry United Microelectronics Corp. has selected Agilent Technologies' 4070|300 system for fully automated 300mm wafer parametric testing.
2005-05-13 TSMC to get wafer bumping service from STATS
Taiwan Semiconductor Mfg Co. (TSMC) customers will receive 300mm wafer bumping service from STATS ChipPAC Ltd.
2003-12-04 TSMC to expand 300mm wafer production capacity
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2005-08-30 TSMC refutes setting up 300mm fab in China
Taiwan Semiconductor Mfg Co. (TSMC) has refuted rumors that it will set up a 300mm wafer fab plant in mainland China.
2016-03-30 TSMC inks deal for first 300mm wafer fab in China
The facility, to rise in the Pukou Economic Development Zone, will have a planned capacity of 20,000 12in wafers monthly and will include a design centre.
2012-11-28 Tower offers to expand wafer fab project to Indian gov't
Tower Semiconductor had previously announced that it is in a consortium with IBM and Indian firm Jaypee, which was shortlisted by the Indian government to build and run a 300mm wafer fab.
2006-08-15 Toshiba, SanDisk start construction of 300mm Yokkaichi fab
Toshiba and SanDisk recently announced that, further to definitive agreements that they entered into in July 2006, the construction of Fab 4, a 300mm wafer fab in Yokkaichi Japan, has started.
2007-09-06 Toshiba, SanDisk open 300mm Yokkaichi fab
Toshiba and SanDisk have inaugurated the 300mm Fab 4 at Toshiba's Yokkaichi Operations in Mie Prefecture, Japan
2005-02-23 Toshiba, SanDisk move up opening of 300mm flash fab
Toshiba Corp. and SanDisk Corp. plan to open a new 300mm flash memory fab as early as June, several months ahead of scheduled
2004-04-16 Toshiba, SanDisk expand 300mm NAND fab plan
Toshiba Corp. said it expects the final capacity of its planned 300mm NAND memory fab to be about 37,500 wafers a month, 1.5 times larger than the original plan announced in last December
2002-12-17 Toshiba's 300mm expansion to cost $3 billion
Toshiba Corp. is targeting a much-anticipated plan for 300mm manufacturing: a $2.9 billion endeavor that includes two fabs, one for SoC LSIs and another for memories
2003-04-23 Toshiba to manufacture 300mm wafers at new fab
Toshiba Corp. will start in June the construction of an advanced 300mm-wafer cleanroom for system LSIs at its Oita Operations plant in Oita prefecture, Kyushu, Japan.
2004-02-24 Toshiba sets up 300mm wafer fab in Kyushu
Toshiba Corp. has completed the construction of a new 300mm-wafer fabrication facility at its Oita operations in Kyushu, Japan.
2005-08-24 Toshiba mulls 300mm expansion plan
Japan's Toshiba Corp. is considering a plan to spend around $4.2 billion to expand its 300mm wafer production by 150 percent in the 2008 time frame, according to reports.
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