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2008-05-07 TSMC, Intel, Samsung join hands on 450mm shift
Intel, Samsung and TSMC have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012.
2002-04-16 TSMC to offer SoC design-to-manufacturing services
Taiwan Semiconductor Manufacturing Co. Ltd is moving to better coordinate the design and manufacturing flow for SoC customers with the introduction of a development architecture called Nexsys.
2005-01-04 TSMC to accelerate 90nm process ramp
Amid a move to ramp up its 65nm technology, Taiwan Semiconductor Mfg Co. Ltd (TSMC) on Wednesday (Dec. 29) said that it will accelerate its 90nm fab capacity throughout 2005.
2005-07-28 TSMC sees recovery amid strong Q2
Taiwan Semiconductor Mfg Co. Ltd (TSMC) projects a recovery in the lackluster foundry business in the second half of 2005, amid a jump in its own sales, profits and fab utilization rates for the second quarter.
2011-12-16 TSMC preps for $26B fab
TSMC is building a $26 billion fab on a 50-hectare plot at Central Taiwan Science Park in Taichung, Taiwan.
2005-08-15 TSMC plans $7.5 billion superfab, says report
Leading foundry Taiwan Semiconductor Manufacturing Co. Ltd has applied to build a next-generation 300mm wafer fab in Taichung, according to a Taipei Times report, which referenced a science park official and a TSMC spokesman as sources.
2006-11-09 TSMC invests $1.1B in 90-, 65nm
Taiwan Semiconductor Manufacturing Co. approved a plan to spend $1.1 billion to expand 65- and 90nm process capacity at its 300mm wafer fabs.
2006-09-14 Trade group inches China capex downward again
The Semiconductor Equipment and Materials International expects sales of semiconductor equipment in China to total $6.6 billion from 2006 through 2008. The estimate is slightly lower than its estimate from several months ago.
2005-08-02 Toshiba to boost NAND production
Anticipating soaring demand for NAND flash memory, Toshiba Corp. will boost investment in its memory fab in Yokkaichi, increasing capacity to 30,000 300mm wafers a month, or 40 percent more than previously planned
2008-06-18 Toshiba shuts down 200mm NAND JV
Toshiba is slightly scaling back on its 200mm NAND flash-memory production amid a downturn in the arena. It will mainly focus on its 300mm fabs to meet improved production efficiency for the company's overall semiconductor business
2005-04-25 Taxes, not labor costs, drive IC production offshore, says SIA
The U.S. needs a coordinated strategy to reduce the cost differential created by foreign government tax and incentive policies in order to keep chip manufacturing in the domestic market, according to the top executive at the Semiconductor Industry Association (SIA).
2005-01-12 Taiwan foundries to cut chip production this quarter
The number of chips rolling out of Taiwan's foundries will continue to decline this quarter, as the demand picture turns cloudy and fables customers try to eat through excess inventory.
2009-10-01 SUSS MicroTec joins ITRI 3D consortium
The Advanced Stacked-System Technology and Application Consortium will implement SUSS MicroTec's 300mm technology
2005-04-14 Standards may move inside the process chamber, says Intel's Gargini
Paolo Gargini, Intel Fellow and chairman of the International Technology Roadmap for Semiconductors organization, said that standardization may have to go much further than in the past to allow nanotechnology to be developed on 450mm diameter wafers.
2009-05-19 ST, Soitec co-develop BSI tech for CMOS image sensors
STMicroelectronics and Soitec have entered an exclusive joint cooperation to develop of 300mm wafer-level backside-illumination (BSI) technology for next-generation image sensors in consumer products.
2010-06-09 ST readies 20nm tape out in 2012
STMicroelectronics NV chief technology officer Jean-Marc Chery announced the company will be ready to tape out designs using a 20nm CMOS low-power (LP) process technology in Q4 2012.
2007-04-11 SMIC to boost capacity at Chengdu 200mm plant
Semiconductor Manufacturing International Corp. disclosed its plans to expand the capacity of a 200mm wafer fab in Chengdu from 20,000 wafers per month to 70,000
2013-06-05 SMIC sets up 28nm chip manufacturing venture
SMIC has allotted about $3.6 billion to fund the joint-venture that will focus on 45nm and finer geometry manufacturing.
2007-09-27 SMIC procrastinating on Wuhan fab, says analyst
Semiconductor Manufacturing International Corp. has postponed the ramp up of its 300mm wafer fab in Wuhan, China, according to an analyst.
2007-02-06 SMIC considers IPO in Beijing
Semiconductor Manufacturing International Corp. (SMIC) is mulling the possibility of spinning off its 300mm wafer operations in Beijing for a domestic initial public offering, according to sources.
2005-03-18 SMIC beats Beijing DRAM problems, company claims
Chinese foundry Semiconductor Mfg Int. Corp. said it's overcoming a bumpy rollout for nanometer-scale manufacturing processes at its 300mm wafer fab in Beijing.
2009-09-11 Singapore launches 3D TSV consortium
The Institute of Microelectronics has announced a 3D through-silicon via (TSV) consortium to boost next-generation 300mm wafer manufacturing capability.
2006-09-27 Shin-Etsu to increase capacity to 1 million wafers/month
Shin-Etsu Chemical announced its plan to expand its monthly production of 300mm silicon wafers to 1 million by Q4 2007 to meet rapidly growing market demands
2008-07-14 Sematech: 450mm program is on track
International Sematech is moving full speed ahead with its 450mm programs, but the question is whether the industry can meet its lofty goals in building 450mm fabs by 2012.
2004-07-09 Sematech to open R&D center for immersion lithography
International Sematech on Tuesday (July 6, 2004) announced the formation of an R&D center to develop and push immersion lithography into the marketplace.
2012-01-06 Samsung gets green light for memory fab in China
The planned 300mm wafer fab is scheduled to have a manufacturing capacity of 100,000 wafer starts per month, making it about half the size of Samsung's Line-16 megafab.
2007-06-06 Report: TSMC, Hynix in discussion over $1B fab purchase
Taiwan Semiconductor Co. Ltd is reportedly hammering a deal with Hynix Semiconductor Inc. that would see the foundry shell out almost $1 billion to purchase a 200mm wafer fab with a capacity of 129,000 wafers per month
2011-03-25 Renesas' Aomori, Yamagata fabs resume limited production
Renesas' Tsugaru wafer fab in Aomori and Tsuruoka wafer fab in Yamagata have resumed part of their manufacturing, both with limited production capacity
2004-06-29 Renesas to pursue 90-, 65nm push
In a move to keep up with current and future chip demand, Japan's Renesas Technology Corp. plans to more than double its production capacity within its 300mm wafer fab over the next year.
2011-06-14 Renesas moves target date for full supply restoration
Renesas is moving up the target date for full supply restoration of their fabs to the end of September, one month ahead of the previously announced goal.
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