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2003-03-04 YES to develop 300mm process tool platform for Adept
Yield Engineering Systems Inc. has selected Adept Technology Inc. to develop a new 300mm process tool platform that will fully automate its vacuum cure oven process.
2003-10-16 Yamato Works reflow oven suits 300mm wafers
The N2 reflow oven for solder bump forming from Yamato Works Co. Ltd features hot plate and upper far-infrared rays that can be used for heating.
2006-05-31 Yamato unveils N2 reflow oven for 200-300mm wafers
Yamato Works rolled out a nitrogen relfow oven for solder bump forming for 200-300mm wafers.
2003-03-31 Xilinx to ship 300mm-based FPGAs
Xilinx Inc. has announced that it is shipping all its advanced FPGA product lines on 300mm wafers, including its Virtex-E, Virtex-II, Virtex-II Pro, and Spartan-IIE FPGAs.
2003-04-01 Xilinx qualifies for 300mm production at UMC
Xilinx Inc. has announced production qualification for its 130nm Virtex-II Pro on 300mm wafers with fab partner United Microelectronics Corp. at the latter's manufacturing facility, Fab12a, in Taiwan.
2005-06-17 Winbond to ramp up 300mm production using ESI Model 9830
Winbond Electronics Corp. has purchased multiple ESI Model 9830 semiconductor link processing systems from Electro Scientific Industries Inc. to be installed at its latest 300mm fab in Taichung, Taiwan.
2004-05-06 Winbond plans 300mm wafer fab in 2005
Looking to ride a recovery in the semiconductor market, Winbond Electronics Corp. is putting into motion plans for a long-awaited 300mm wafer fab that will come on line in late 2005.
2005-01-26 Winbond invests in 300mm wafer fab
Winbond Electronics Corp. said Monday (Jan. 24) it is taking out a $250 million loan to fund the early phase construction of its 300mm wafer fab in central Taiwan.
2005-06-23 Winbond 300mm production adopts VIISta implanters
Taiwan-based Winbond Electronics Corp. has purchased VIISta single wafer ion implanters from Varian Semiconductor Equipment Associates Inc. Winbond has used the tools in its 300mm production.
2005-08-25 Winbond 300mm fab equipped with Mattson production tools
Winbond Electronics Corp. has purchased advanced process equipment from Mattson Technology Inc.
2006-06-07 Wafer supplier's growth reflects development of 300mm wafer industry
ADE announced that it has received a multi-million dollar order for 300mm production wafer quality certification and process control systems.
2005-01-13 Varian Semicon installs ion implanter at UMC's 300mm fab
Varian Semiconductor Equipment Associates Inc. announced that it has completed the installation of a third single wafer VIISta 80HP high current ion implanter to enhance United Microelectronics Corp.'s advanced process capacity at its 300mm Fab in Tainan, Taiwan.
2002-06-05 UMCi jumpstarts new construction phase for 300mm wafer facility
Singapore-based UMCi, a joint venture between UMC, Infineon Technologies AG (IFX) and EDBI, has awarded major contracts for the next-phase of the construction of its 300mm facility located at the Pasir Ris Wafer Fab Park.
2007-01-10 UMC's new 300mm fab to open in '08
United Microelectronics Corp. said it foresees opening a new 300mm wafer plant in 2008.
2002-01-09 UMC may delay 300mm joint-venture fab in Singapore
United Microelectronics Corp. might delay the opening of a 300mm wafer plant joint venture in Singapore by six to nine months.
2002-09-17 UMC denies reports of 300mm wafer capacity cuts
United Microelectronics Corp. is denying a news report that it will slice in half its 300mm wafer capacity to 5,000 wafers per month by the end of the year.
2003-04-23 UMC adopts Agilent solution for 300mm wafer testing
Semiconductor foundry United Microelectronics Corp. has selected Agilent Technologies' 4070|300 system for fully automated 300mm wafer parametric testing.
2003-12-04 TSMC to expand 300mm wafer production capacity
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2005-08-30 TSMC refutes setting up 300mm fab in China
Taiwan Semiconductor Mfg Co. (TSMC) has refuted rumors that it will set up a 300mm wafer fab plant in mainland China.
2016-03-30 TSMC inks deal for first 300mm wafer fab in China
The facility, to rise in the Pukou Economic Development Zone, will have a planned capacity of 20,000 12in wafers monthly and will include a design centre.
2006-08-15 Toshiba, SanDisk start construction of 300mm Yokkaichi fab
Toshiba and SanDisk recently announced that, further to definitive agreements that they entered into in July 2006, the construction of Fab 4, a 300mm wafer fab in Yokkaichi Japan, has started.
2007-09-06 Toshiba, SanDisk open 300mm Yokkaichi fab
Toshiba and SanDisk have inaugurated the 300mm Fab 4 at Toshiba's Yokkaichi Operations in Mie Prefecture, Japan.
2005-02-23 Toshiba, SanDisk move up opening of 300mm flash fab
Toshiba Corp. and SanDisk Corp. plan to open a new 300mm flash memory fab as early as June, several months ahead of scheduled.
2004-04-16 Toshiba, SanDisk expand 300mm NAND fab plan
Toshiba Corp. said it expects the final capacity of its planned 300mm NAND memory fab to be about 37,500 wafers a month, 1.5 times larger than the original plan announced in last December.
2002-12-17 Toshiba's 300mm expansion to cost $3 billion
Toshiba Corp. is targeting a much-anticipated plan for 300mm manufacturing: a $2.9 billion endeavor that includes two fabs, one for SoC LSIs and another for memories.
2003-04-23 Toshiba to manufacture 300mm wafers at new fab
Toshiba Corp. will start in June the construction of an advanced 300mm-wafer cleanroom for system LSIs at its Oita Operations plant in Oita prefecture, Kyushu, Japan.
2004-02-24 Toshiba sets up 300mm wafer fab in Kyushu
Toshiba Corp. has completed the construction of a new 300mm-wafer fabrication facility at its Oita operations in Kyushu, Japan.
2005-08-24 Toshiba mulls 300mm expansion plan
Japan's Toshiba Corp. is considering a plan to spend around $4.2 billion to expand its 300mm wafer production by 150 percent in the 2008 time frame, according to reports.
2010-11-09 TI, Maxim push 300mm analog
Texas Instruments and Maxim Integrated Products have made recent advances in manufacturing 300mm analog devices, prompting analysts to ask how much impact the move will have on the segment.
2010-04-29 TI to double 300mm analog fab capacity
Texas Instruments Inc. plans to double the manufacturing capacity in its 300mm analog fab in Richardson, bringing its revenue capability to about $2 billion.
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