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2009-10-06 Analysis: TI fab deal is good for IC tool vendors
Equipment executives and analysts say that the TI fab deal isn't a blow to the equipment industry. Some suggested that it might even be a positive for gear suppliers.
2006-07-18 AMD ships 64bit CPUs made by Chartered
AMD announced that in June it began its first revenue shipments of AMD64 processors manufactured at Chartered Semiconductor Manufacturing in Singapore.
2007-10-26 AMD puts 450mm fab transition on hold
Adopting a different approach than rival Intel Corp., Advanced Micro Devices Inc. (AMD) is set on maximizing utilization of existing 300mm fabs before moving to the larger 450mm wafer size.
2008-09-23 Albany NanoTech to open 22nm R&D fab
Albany NanoTech is set to open a new facility that will focus on 22nm R&D technology, post-CMOS processes and clean technology.
2007-08-21 A $60M funding for TSMC's packaging tech
Capital appropriations totaling $59.8 million will be set aside by Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) for use in establishing 300mm, wafer-level packaging technology.
2014-10-15 200mm fab lives on, end nowhere in sight
Despite the upgrade to larger wafer sizeswith fabs that transitioned to 300mm over a decade agothere is still plenty of life remaining in 200mm fabs, and the introduction of MEMS-based accelerometers for motion tracking has been a boon to eight-inch wafers.
2008-01-14 Wafer probe stations cut cost in 45nm node
Cascade Microtech has launched the next step in 300mm wafer probe stations designed to meet the need for advanced on-wafer measurements for semiconductor devices.
2011-11-22 Wafer packaging fab opens in Taiwan
STATS ChipPAC has increased production capacity with the completion of its 300mm wafer bump and WLCSP facility.
2003-08-11 Wafer inspection system allows rapid testing
Nikon's SITECH group has introduced the AMI-3000 wafer inspection system that is designed to meet 300mm wafer production in the 90nm node and beyond.
2015-07-13 Wafer fab closures projected to grow in the coming years
Qimonda was the first company to close a 300mm wafer fab after it went out of business in early 2009 and more recently, ProMOS and Powerchip closed 300mm wafer fabs in 2013.
2003-07-16 Wafer coating system eyes deep-UV lithography
Dainippon Screen Mfg. Co. Ltd has released its RF3 offering that is a 300mm coating/developing system for advanced deep-UV lithography.
2004-01-07 Varian Semi to be UMCi ion implant supplier
Varian Semiconductor Equipment Associates Inc. has been selected by UMCi as the high current ion implant supplier for UMCI's 300mm fab in Singapore.
2013-07-09 USHIO books its interposer stepper for 2.5D/3D packaging
The UX7-3Di LIS 350 has achieved a resolution of 2?m L/S on a 300mm Si wafer as well as an organic substrate and is able to address a warp or expansion/contraction of an organic substrate.
2011-01-24 Unity Semi finds new partner in Micron
Troubled memory chipmaker Unity Semiconductor has signed a "two-year" deal with Micron. The agreement calls for Micron to make a small investment in Unity while giving Unity access to Micron's 300mm fabs.
2003-09-22 UMCJ expands manufacturing reach in Singapore plant
United Microelectronics Corp. Japan (UMCJ) announced that they will expand their technology and manufacturing capabilities by investing $45M in UMC's 300mm affiliate in Singapore.
2002-02-12 UMC seeks control of Japan joint-venture fab
United Microelectronics Corp. is seeking to gain management control of its 300mm wafer joint venture with Hitachi Ltd, UMC chairman and chief executive Robert Tsao said Friday (Feb. 8).
2004-01-29 UMC orders Axcelis ion implanters for Tainan fab
United Microelectronics Corp. has issued a multi-system order for Axcelis Technologies' HC3 Ultra high current ion implanter for installation in its 300mm fab in Tainan, Taiwan.
2010-07-23 UMC increases capacity with tools from TI
United Microelectronics Corp. will increase its production capacity by purchasing advanced 300mm CMOS manufacturing tools from Texas Instruments.
2003-10-21 Ulvac Technologies selects Asyst solutions
Asyst Technologies Inc. announced that Ulvac Technologies Inc. has decided to utilize Asyst solutions for its 2G 300mm Enviro resist and residue removal tool.
2003-02-11 Ultratech adopts TMC vibration control system
Ultratech Stepper Inc. has chosen Technical Mfg Corp.'s Electro-Damp II Active Vibration Control System as the new platform for its 200mm and 300mm Saturn Spectrum and Titan Wafer Stepper family.
2014-01-16 TSMC works on fingerprint sensors for iPhone
TSMC is working on fingerprint sensors for Apple's iPhone, according to a report. The sensors are being made using 65nm manufacturing process technology at a 300mm wafer fab, with production expected to start in the second quarter, the report said.
2002-04-26 TSMC to use KLA-Tencor test systems for its Fab 12
Taiwan Semiconductor Mfg Co. (TSMC) has selected KLA-Tencor Corp.'s Klarity Defect automated analysis and defect data management system for its Fab 12, which manufactures advanced ICs on 300mm wafers.
2003-12-05 Toshiba, SanDisk to expand NAND flash memory production
Toshiba Corp. and SanDisk Corp. have agreed to cooperate in the construction of a new 300mm wafer fab facility at Toshiba's Yokkaichi operations.
2006-02-13 Toshiba, SanDisk to boost spending on flash fab
In an effort to keep up with huge demand for its NAND flash-memory devices, SanDisk and Toshiba said that they plan to boost the investment and production levels of its 300mm fab venture in Japan.
2008-06-18 Toshiba shuts down 200mm NAND JV
Toshiba is slightly scaling back on its 200mm NAND flash-memory production amid a downturn in the arena. It will mainly focus on its 300mm fabs to meet improved production efficiency for the company's overall semiconductor business.
2006-07-03 Tokyo Electron unveils probe mark analyzer
Tokyo Electron has released a new probing accuracy diagnosis system that is integrated with the company's 300mm fully automatic wafer prober.
2002-01-30 Sumitomo, Mitsubishi to integrate silicon wafer businesses
Sumitomo Metal Ind. Ltd and Mitsubishi Materials Corp. will merge and integrate their silicon wafer businesses, including 300mm wafers and wafer-related quartz products operations, in Japan as well as overseas.
2011-04-21 STATS ChipPAC aims TSV expansion in Singapore
STATS ChipPAC is expanding its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities in Singapore.
2012-03-05 ST, Luxtera to expand silicon photonics market
The collaboration entails development of Luxtera's IP in silicon photonics in ST's 300mm fab in Crolles, France.
2003-04-23 Sony to deploy new fab line for 65nm process technology
Sony Computer Entertainment Inc. (SCEI) and Sony Corp. have decided to invest a total of about 200 billion yen over three fiscal years from 2003 to 2005 in the installation of a semiconductor fabrication line to build chips with 65nm process on 300mm wafers.
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