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2009-10-02 TI opens 300mm analog fab in Texas
The Richardson manufacturing facility will use 300mm silicon wafers to manufacture analog chips.
2014-11-07 TI expands presence in China with 300mm bumping facility
The company's new 300mm wafer bumping facility will rise in a second shell that came with the Chengdu site TI purchased back in 2010. The facility is scheduled to begin production in early 2016.
2009-10-05 TI 300mm fab puts pressure on analog rivals
Texas Instruments Inc. is putting its analog rivals on notice with its latest a 300mm fab in the United States.
2003-01-02 The truth about 300mm
The move to 300mm wafers will leave fewer companies owning their own fabs; the few that can fill 300mm fabs will pull increasingly ahead of direct competitors that choose to use foundries.
2002-07-16 TEL to roll out next-gen processing systems for 300mm wafers
Tokyo Electron Ltd is developing a next-generation process coater/developer for use in 300mm wafers.
2008-08-04 Taiwan ponders on 300mm fabs in China
The Taiwan government is mulling over a plan to relax its IC export control laws in China, according to a report from Forbes.
2006-07-20 System enables fully automated inspection of 300mm wafer surface
Vistec Semiconductor Systems announced that its new-generation LDS3300 enables fully automated inspection of the complete 300mm wafer surface.
2005-03-22 Sumco to double 300mm wafer output
Japan's Sumitomo Mitsubishi Silicon Corp. (Sumco) plans to double its monthly production capacity of 300mm-diameter silicon wafers from 300,000 units to 600,000 by summer 2008 at a cost of about $765 million.
2005-05-17 STATS ChipPAC to offer 300mm electroplated wafer bumping services
STATS ChipPAC Ltd announced it will offer 300mm electroplated wafer bumping services in the third quarter of 2005 to complete its full turnkey service offering for advanced flip chip applications.
2010-06-18 ST muses 300mm wafer for analog
STMicroelectronics is considering making analog ICs on 300mm wafers at its Crolles-2 wafer fab near Grenoble, France, according to CEO Carlo Bozotti.
2012-10-11 SPTS signs JDP with Fraunhofer for 300mm 3D IC Apps
The program will use 300mm APM plasma enhanced chemical vapor deposition modules installed on a Versalis platform alongside SPTS etch chambers in the ASSID centre in Germany.
2008-03-10 Spansion's 300mm NOR fab ramps in Japan
Spansion has announced that it has reached a reached a production milestone of more than 25,000 wafer starts per quarter at its Spansion 1 (SP1) facility in Aizuwakamatsu, Japan, the world's first 300mm NOR fab.
2007-02-05 Spansion announces transition to 300mm flash
Spansion Inc. announced its Submicron Development Center (SDC), its R&D headquarters, has successfully completed its transition from 200mm to 300mm.
2004-05-26 Sony's 300mm fab starts test production of Cell processor
Sony Corp.'s Nagasaki 300mm fab has begun test production of Cell processors, Ken Kutaragi, Sony's executive deputy president and COO, acknowledged this week. He declined to elaborate.
2006-07-10 Soitec to build 300mm fab in Singapore
Soitec SA announced that it plans to build a new production plant in Singapore and expand its existing production base in France.
2008-11-11 Soitec opens 300mm wafer fab in Singapore
Soitec has inaugurated its new 300mm silicon-on-insulator wafer fab in new Pasir Ris Wafer Fab Park, Singapore.
2006-08-30 Soitec launches new 300mm fab in Singapore
SOI wafer supplier Soitec has started work on a new 300mm fab at Singapore. According to Soitec CEO Andre-Jacques Auberton-Herve, this new fab will play a key role in the company's growth strategy.
2008-01-31 SMIC to put up 200mm, 300mm fabs in Shenzhen
China's SMIC has struck a deal with the Shenzhen municipal government under which the foundry provider will build new and separate 200mm and 300mm fabs in that region.
2006-05-19 SMIC to build 300mm fab in Hubei
Is Chinese silicon foundry provider Semiconductor Mfg International Corp. building yet another 300mm fab?
2007-12-12 SMIC switches on 300mm fab in Shanghai
SMIC has started of production in the first 300mm wafer fab in China's Shanghai city.
2004-06-07 SMIC receives 300mm wafer equipment for Fab 4
Shanghai-based foundry Semiconductor Mfg Int. Corp. (SMIC) has received its first chip manufacturing equipment for use in its 300mm diameter wafers.
2006-05-17 SMIC plans 300mm fab amid strategic shift
Semiconductor Mfg International Corp. is planning to build a new 300mm fab amid a possible strategic shift towards an IDM business model.
2003-03-28 SMIC may move in 300mm gear this year
Semiconductor Mfg Int. Corp. said that it may move in manufacturing equipment for 300mm wafer pilot lines at its Beijing plant by the end of this year or early next year.
2007-12-28 SMIC licenses IBM's 45nm process for 300mm fab
SMIC has licensed IBM's 45nm bulk CMOS technology for its 300mm wafer foundry service, fabricating devices in mobile, graphics and consumer applications.
2007-01-23 Singapore JV ramps 300mm wafer supply
A billion dollar plant being built in Singapore by Germany's Wacker Chemie and Samsung is on track to begin churning out raw 300mm wafers in mid-2008.
2008-09-04 SIA: 300mm wafers rule IC manufacturing in July
300mm wafers for the first time account for the largest share of wafer manufacturing capacity and actual wafers processed, with 44 percent of total capacity and 47 percent of total silicon processed, according to the Semiconductor Industry Association.
2004-12-31 Shin-etsu Handotai to build 300mm wafer factory in Washington
Seeking to meet growing demand for 300mm wafers, leading wafer supplier Shin-Etsu Handotai Co. Ltd (SEH) will expand its factory and construct a new 300mm wafer factory in Vancouver, Washington.
2004-12-28 Shin-Etsu expands 300mm silicon wafer production
Shin-Etsu Chemical Co. Ltd has revealed major expansion plans in 300mm silicon wafer production capacity at its wholly-owned subsidiary Shin-Etsu Handotai (SHE)'s facilities in Fukushima, Japan; and manufacturing facility in Vancouver, Washington.
2002-05-06 SEZ opens 300mm lab in Arizona
The SEZ Group has opened a 300mm applications lab in Phoenix, Arizona. The new lab will test 300mm wafer-cleaning processes and is anticipated to double SEZ's capacity for customer demos and R&D.
2007-04-12 Service kicks off at Fujitsu's new 300mm fab
Fujitsu Ltd. has begun operating its second 300mm wafer fab for 65nm chip fabrication. Volume shipments will begin in July.
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