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2002-06-26 Nanometrics rolls out 300mm wafer inspection technology
Nanometrics Inc. has launched the NanoUDI technology for 300mm wafer processing, which meets requirements for yield management.
2003-05-16 Motorola's power IC process runs on 300mm wafers
Motorola launched the newest version of its power semiconductor process technology combining voltage capability with analog functions.
2003-01-17 Motorola pare plants, seeks 300mm partner
In 2000, Motorola Inc.'s Semiconductor Products Sector had 27 front-end and back-end manufacturing sites. By the middle of this year, the company will have reduced that number to 10.
2006-08-08 Micromanipulator unveils 300mm manual probe station
Micromanipulator's Model 9020 probe station features motorized drives with interactive manual control via joystick or MicroTouch controls.
2002-02-20 Micromanipulator offers control software for 300mm probing systems
The netProbe prober control system includes a navigator module and a floating live video module for continuous monitoring.
2006-01-12 Metrology tool handles high volume production of 300mm wafers
The new, non-destructive, nanotechnology weight metrology tool from Metryx is designed to handle high volume production of 300mm semiconductor wafers.
2015-09-30 MEMS devices come in 300mm-diameter wafers
CEA-Leti manufactured accelerometer MEMS devices on 300mm-diameter wafers using its piezo-resistive silicon nanowire technology.
2005-08-31 MEMC says its first to produce 300mm wafers in Taiwan
Claiming to be the first to produce 300mm silicon wafers in Taiwan, MEMC Electronic Materials Inc. announced that the company has started 300mm production at its subsidiary in Hsinchu.
2002-01-16 MEMC moves to full-scale 300mm wafer production
MEMC Electronic Materials Inc. has completed the transition of its center of excellence (COE) from a pilot line to a full-scale 300mm silicon manufacturing site.
2010-08-03 Maxim, Powerchip form 300mm foundry alliance
Analog chip maker Maxim Integrated Products Inc. has formed a 300mm foundry alliance with Taiwan's Powerchip Semiconductor Corp., reports Needham & Co.
2005-05-26 Mattson equips ProMOS' 300mm Taiwan fab
Mattson Technology Inc. will be used to support the production ramp at Promos Technologies' newest 300mm wafer fab in the Central Taiwan Science Park (CTSP), Taiwan.
2003-12-29 Matsushita to build 300mm fab
Matsushita Electric Ind. Co. Ltd, confirmed on Tuesday (Dec.23) that it is investing about 130 billion yen (about $1.2 billion) to build a 300mm wafer fab.
2010-04-21 Macronix buys ProMos' 300mm fab
Macronix International Co. will acquire ProMos Technologies' 12-inch fab located in Hsinchu Science Park, Taiwan for NT$8.5 billion($269.6 million).
2005-04-20 Leica's new system eases manual inspection of 300mm wafers
Leica Microsystems disclosed that its new Leica INS300 fits the demands of IC manufacturers for equipment with optimized price and performance ratio
2005-08-04 Lattice selects EG6000 as 300mm wafer prober platform
Lattice Semiconductor Corp. has standardized on the Electroglas Inc. EG6000 for 300mm wafer probing.
2003-12-10 Keithley device tests 300mm wafers in 200mm test times
Keithley Instruments Inc. has expanded its S600 series with the release of the S680DC/RF parametric test system that allows control of 300mm wafer processes in 200mm test times. The optional SimulTest parallel test software measures up to nine devices simultaneously within a single probe touchdown.
2008-06-23 JV eyes 300mm wafer production in Singapore
Siltronic Samsung Wafer Pte Ltd, a joint venture of Samsung Electronics Co. Ltd and Siltronic AG, commissioned a new fab in Singapore for the production of 300mm wafers.
2007-03-27 It's official: Intel to build 300mm wafer fab in China
Intel Corp. will build its first wafer facility in Asiaa 300mm wafer fabin the coastal Northeast China city of Dalian in Liaoning Province.
2011-02-23 Intel to build new 300mm fab
Intel has announced plans to invest $5 billion in a new factory to process wafers at the 14nm node that is expected to be completed in 2013.
2005-12-05 Intel to build 300mm wafer fab in Israel
Intel announced plans to build a new 300mm wafer fabrication facility at its site in Kiryat Gat, Israel.
2005-11-03 Intel re-spins fab for 300mm, 65nm chips
Preparing for a new and steep ramp of advanced microprocessor lines, Intel Corp. on Wednesday (Nov. 2) is expected to announce the 're-opening' of its wafer fab in Arizona. The newly-converted fab will produce 65nm microprocessors and other products on 300mm substrates.
2002-02-27 Intel ramps up production of microprocessors on 300mm wafers
Intel Corp. has completed its first production of microprocessors on the 0.13?m process in its 300mm wafer fab in Hillsboro, Oregon.
2005-10-26 Intel invests $650 million to expand 300mm fab
Continuing its strategy to increase 300mm manufacturing capacity, semiconductor supplier Intel Corp. announced Monday (Oct. 24) it would invest $650 million to expand an existing fab in Rio Rancho, N.M., called Fab 11X.
2004-05-24 Intel invests $2B in Ireland, adds 300mm fab
Intel Corp. has disclosed plans for an additional $2 billion investment in Ireland, including a new 300mm fab module that will produce 65nm designs.
2004-04-27 Intel converts Arizon facility to 300mm
Intel Corp. has begun a $2 billion construction project to convert a 200mm wafer fabrication facility to a 300mm facility in Chandler, Arizona.
2007-09-11 Intel breaks ground on 300mm fab in China
Intel broke ground on its first 300mm wafer fabrication facility in Asia, Fab 68, the $2.5 billion project set to be operational in 2010.
2004-06-17 Intel begins 300mm production in Ireland
Intel Corp.'s newest high-volume wafer fabrication facility in Ireland has commenced production. Fab 24, a $2 billion facility, features 300mm wafer manufacturing based on Intel's 90nm process technology.
2004-07-05 Infineon, Nanya open 300mm DRAM wafer fab
Inotera Memories Inc., the DRAM joint venture formed between Infineon Technologies AG and Nanya Technology Corp. in 2002, opened its 300mm wafer fab Wednesday (June 30).
2013-02-21 Infineon unveils power ICs on 300mm thin wafers
Infineon claim to be the first and only company to produce power semiconductors on 300mm thin wafers.
2002-01-24 Infineon commences volume production of DRAMs on 300mm
Leapfrogging competition, Infineon Technologies has started volume production of 256Mb DRAM chips on 300mm silicon wafers at its Dresden plant.
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