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2015-11-03 Imec, Ghent University reveal laser arrays on 300mm Si wafer
The breakthrough paves a path toward high-volume manufacturing of cost-effective photonic ICs with monolithically integrated laser sources to enable faster data transfer between logic and memory chips.
2002-10-11 IMEC to establish 300mm silicon research foundry
IMEC has laid its plans of setting up a 300mm silicon research platform initiative to perform advanced process research at least "two generations ahead of manufacturing."
2012-02-14 Imec rolls 300mm directed self-assembly process line
The fab-compatible patterning solution can pave the way for scaling EUV lithography to production level, pushing the boundaries of 193nm tech.
2013-11-07 Imec demos III-V FinFET devices on 300mm Si wafers
The devices enable continual CMOS scaling down to 7nm and below, and also enable new heterogeneous system opportunities in hybrid CMOS-RF and CMOS-optoelectronics.
2006-01-23 IBM's 300mm jump could bode well for PDF Solutions
The news of a 250 percent jump in revenue from IBM's 300mm fab in East Fishkill, New York could bode well for process integration technology provider PDF Solutions Inc.
2008-09-25 IBM opens gates of 300mm fab
Up until recently, IBM Corp. and its secretive chip unit refused to reveal any information about its semiconductor operations.
2002-08-05 IBM inaugurates 300mm chip facility in New York
IBM Microelectronics has formally opened its 300mm semiconductor facility in East Fishkill, New York.
2006-10-03 Hynix-ST to launch 300mm fab in China
Hynix-ST Semiconductor, the joint memory venture between Hynix Semiconductor and STMicroelectronics, will launch its 300mm fab in China on Oct. 10.
2007-04-04 Hynix' new CEO bares 300mm plans
Hynix Semiconductor Inc. announced its Board of Directors has appointed Jong-Kap Kim as the new chairman and CEO.
2006-11-30 Hua Hong drops 300mm wafer plans, goes for 200mm
A Hua Hong NEC affiliate is canceling its plans for a 300mm wafer fab in Shanghai, opting instead to build up a 200mm wafer line, the company said Tuesday.
2003-07-22 Handling solution accommodates to 300mm wafers
Developed under an alliance with Integrated Dynamic Engineering, the Duofem handler from Robotic Vision Systems Inc. accommodates up to 300mm wafers.
2002-01-07 Genus delivers 300mm ALD system to Japan
Genus Inc. has shipped the industry's first 300mm atomic layer deposition (ALD) system to Japan's Asuka consortium.
2004-03-24 Fujitsu plans 300mm fab
Fujitsu Ltd confirmed that it will build a 300mm fab, with a total investment of ?160 billion yen (about $1.5 billion) and volume production reaching 13,000 wafers a month - a bit larger than expected.
2004-03-04 Fujitsu mulls plan for $1.5B 300mm wafer fab
Fujitsu Ltd is planning to spend $1.5 billion to build a 300mm fab, which will begin operation in spring 2005 with a capacity of 10,000 wafers a month, reported a Japanese newspaper.
2009-03-18 FCI, SMIC: new 300mm flip chip allies
FlipChip International (FCI) has formed a partnership alliance with Semiconductor Manufacturing International Corp. for 300mm flip chip bumping and wafer-level packaging.
2004-09-02 FACTS to verify software for 300mm manufacturing
Sematech subsidiary, the International Sematech Manufacturing Initiative, has contracted Texas-based design services firm FACTS Inc. to ensure automation software works properly with 300mm semiconductor manufacturing equipment.
2007-10-17 Elpida-PSC JV opens 300mm fab in Taiwan
Rexchip Electronics, the joint venture company of Elpida Memory and PSC, has opened its first 300m fab at the Central Taiwan Science Park Houli Site.
2006-07-10 Elpida to increase production at 300mm fab
Elpida plans to increase the manufacturing capacity of its 300mm wafer facility (E300 Fab) in Hiroshima Prefecture, Japan.
2008-08-08 Elpida to build 300mm fab in China
After separating from its foundry partner in China, Elpida Memory Inc. plans to create a 300mm fab venture in the country. Its total capital expenditure for the new fab in China reaches $5 billion.
2005-03-11 Elpida pours $960 million into second 300mm fab
Elpida Memory Inc. has made an investment of ?100 billion (about $960 million) on a second 300mm wafer fab under construction since last June.
2005-03-14 Elpida invests in production equipment for 300mm facility
DRAM supplier Elpida Memory Inc. and Hiroshima Elpida Memory Inc., a wholly-owned subsidiary of Elpida, disclosed the first phase of investment in manufacturing equipment for its second 300mm wafer fabrication facility, E300-Fab2.
2005-12-05 Elpida beefs up 300mm wafer fab in Hiroshima
Elpida Memory and Hiroshima Elpida Memory announced the completion of its new 300mm production line at its 300mm wafer fabrication facility in Hiroshima, Japan.
2006-12-05 Dropping 300mm, wise move for Hua Hong
The decision by an affiliate of China's Hua Hong NEC to back away from an earlier commitment to build a 300mm wafer plant makes sense for the company, an iSuppli Corp analyst said.
2003-01-08 DEK rolls bumping solution for 300mm wafers
DEK has announced the availability of a wafer bumping solution for 300mm wafers.
2002-09-17 Dainippon develops cleaning system for 300mm wafers
Dainippon Screen Mfg Co. Ltd has developed the MP-3000CB single-wafer cleaning system designed to clean the back surface and beveled-edge of 300mm wafers after copper processing.
2004-10-29 Cypress SVTC sets up 200mm, 300mm lithography tool
Silicon Valley Technology Center (SVTC), a division of Cypress Semiconductor Corp., has installed a 200mm and 300mm wafer photolithography tool from ASML, and is now offering 65nm silicon processing capabilities to third-party companies.
2005-02-09 Cypress SVTC delivers 300mm wafers using 65nm process tech
Silicon Valley Technology Center (SVTC), a division of Cypress Semiconductor Corp. has disclosed the delivery of its first 300mm wafers.
2003-03-25 Cost crossover near for 300mm wafers?
Though only about 1 percent of all chips are made on 300mm wafers currently, an Applied Materials Corp. executive said that the cost crossover between 300mm and 200mm wafers will occur late this year.
2005-11-04 CMD to build 200-, 300mm fabs in China
A little-known group called CMD International (Tianjin) Electronic Co. Ltd. has broken ground on a large-scale semiconductor and R&D project in Tianjin, China, with claims that it will build both 200- and 300-mm fabs in that nation.
2002-01-09 ChipPAC qualifies 300mm wafer packaging
ChipPAC Inc., a provider of semiconductor assembly and test services, has qualified all of its front-end assembly operations in the 300mm wafer packaging.
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