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2007-08-17 Will AMD push its New York fab plan?
AMD has until July 2009 to decide whether to proceed with its plan to build a 300mm fab in New York, after which the $1.2 billion in state incentives will expire.
2008-07-30 UMC signs up with Sematech consortium
United Microelectronics Corp. has joined the Sematech research consortium to work on R&D for exploratory technologies on 300mm wafers, including 22nm and beyond process generations.
2009-10-13 UMC gears Singapore fab up for 45/40nm
UMC's Fab 12i in Singapore has begun an aggressive expansion project, increasing its capacity and enabling 45/40nm production.
2005-02-22 UMC chairman denies doing wrong in letter to Taiwan prosecutor
A Taiwan government investigation into local foundry chipmaker United Microelectronics Corp. (UMC) took a dramatic twist on Friday (Feb. 18) with the company's chairman admitted he helped set up a Chinese foundry, an act that could lead to criminal charges, but denied wrong-doing in an open letter to the Taiwan prosecutor.
2012-05-25 UMC begins phase 5 & 6 of Fab 12A
The expansion begins UMC's new generation of 300mm manufacturing that will extend 28nm production and establish a solid foundation for 20nm and beyond to meet customers' high-end demand.
2004-08-24 UMC 'engaging' customers with new 65nm process
Amid a major shift towards 90nm technology on 300mm wafers, Taiwan's United Microelectronics Corp. (UMC) is quietly "engaging" customers with its new and unannounced 65nm process.
2008-05-07 TSMC, Intel, Samsung join hands on 450mm shift
Intel, Samsung and TSMC have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012.
2005-05-13 TSMC to get wafer bumping service from STATS
Taiwan Semiconductor Mfg Co. (TSMC) customers will receive 300mm wafer bumping service from STATS ChipPAC Ltd.
2005-08-15 TSMC plans $7.5 billion superfab, says report
Leading foundry Taiwan Semiconductor Manufacturing Co. Ltd has applied to build a next-generation 300mm wafer fab in Taichung, according to a Taipei Times report, which referenced a science park official and a TSMC spokesman as sources.
2008-05-16 TSMC okays $1B expansion budget
TSMC said it has approved a capital appropriation of $995 million to expand a 300mm fab and increase its advanced process capacity.
2006-11-09 TSMC invests $1.1B in 90-, 65nm
Taiwan Semiconductor Manufacturing Co. approved a plan to spend $1.1 billion to expand 65- and 90nm process capacity at its 300mm wafer fabs.
2005-11-11 TSMC boosts capex, sets up VC fund
TSMC said that it has approved a measure to spend $706.5 million to expand its 200- and 300mm fab capacity. The company has also set up a new $75 million venture capital fund
2012-11-28 Tower offers to expand wafer fab project to Indian gov't
Tower Semiconductor had previously announced that it is in a consortium with IBM and Indian firm Jaypee, which was shortlisted by the Indian government to build and run a 300mm wafer fab.
2006-03-15 Toshiba, SanDisk tip new fabagain
According to reports, Toshiba will spend billions of yen to build another new 300mm fab, with construction slated to start by 2009.
2005-08-02 Toshiba to boost NAND production
Anticipating soaring demand for NAND flash memory, Toshiba Corp. will boost investment in its memory fab in Yokkaichi, increasing capacity to 30,000 300mm wafers a month, or 40 percent more than previously planned.
2005-01-12 Taiwan foundries to cut chip production this quarter
The number of chips rolling out of Taiwan's foundries will continue to decline this quarter, as the demand picture turns cloudy and fables customers try to eat through excess inventory.
2006-03-30 Taiwan DRAM maker places follow-on orders for Mattson's strip system
Mattson Technology disclosed that a major DRAM chipmaker from Taiwan has placed follow-on orders for Mattson's Aspen III ICPHT strip system for the next expansion phase of its 90nm and 300mm fab.
2009-10-01 SUSS MicroTec joins ITRI 3D consortium
The Advanced Stacked-System Technology and Application Consortium will implement SUSS MicroTec's 300mm technology.
2007-10-15 Survey: Robust growth for wafer shipments till 2010
Results of a consensus survey by SEMI SMG show wafer shipments are expected to experience robust growth from 2007 to 2010.
2005-11-04 STATS ChipPAC opens wafer bump plant in China
Singapore-based semiconductor test and packaging services supplier STATS ChipPAC has announced it will open a 200-mm wafer bumping operation in China specializing in gold bump services for the liquid crystal display (LCD) driver market.
2009-05-19 ST, Soitec co-develop BSI tech for CMOS image sensors
STMicroelectronics and Soitec have entered an exclusive joint cooperation to develop of 300mm wafer-level backside-illumination (BSI) technology for next-generation image sensors in consumer products.
2006-03-17 ST expands China reach with HHNEC
Hua Hong NEC Electronics continues on its quest to build a 300mm fab and is reportedly working with a new and surprising partner: STMicroelectronics.
2007-10-26 Spansion taps SMIC for 65nm MirrorBit production
Spansion announced it will transfer its 65nm MirrorBit technology to SMIC for foundry services on 300mm wafers in China.
2007-09-21 Spansion starts production of NOR flash at Japan fab
Spansion Inc. announced it has begun production of MirrorBit technology at 65- on 300mm wafers at its Spansion 1 facility in Japan, with plans to ship to customers in high volume by the end of the year.
2006-07-25 Spansion expands manufacturing agreement with TSMC
Spansion announced that it has expanded its foundry manufacturing agreement with Taiwan Semiconductor Mfg Co. to include its 90nm MirrorBit technology on 300mm wafers.
2009-06-02 Sonoscan to debut operator-free wafer inspection system
Sonoscan Inc. will launch its new C-SAM series AW300 for bonded wafer inspection system that carries out robotic handling and acoustic imaging of bonded wafer pairs up to 300mm in diameter.
2007-09-27 SMIC procrastinating on Wuhan fab, says analyst
Semiconductor Manufacturing International Corp. has postponed the ramp up of its 300mm wafer fab in Wuhan, China, according to an analyst.
2007-02-06 SMIC considers IPO in Beijing
Semiconductor Manufacturing International Corp. (SMIC) is mulling the possibility of spinning off its 300mm wafer operations in Beijing for a domestic initial public offering, according to sources.
2005-03-18 SMIC beats Beijing DRAM problems, company claims
Chinese foundry Semiconductor Mfg Int. Corp. said it's overcoming a bumpy rollout for nanometer-scale manufacturing processes at its 300mm wafer fab in Beijing.
2006-09-27 Shin-Etsu to increase capacity to 1 million wafers/month
Shin-Etsu Chemical announced its plan to expand its monthly production of 300mm silicon wafers to 1 million by Q4 2007 to meet rapidly growing market demands.
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