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2010-05-27 Semico: Shift to 450mm is inevitable
The probability that the semiconductor industry will shift to 450mm silicon wafers in manufacturing has increased significantly, however, the chance of achieving volume production by the original target date of 2012 is remote.
2008-05-19 SEMI: Flat growth seen in Q1 wafer shipments
Global silicon wafer area shipments remained stable in Q1, marginally declining 1 percent compared to Q4 07 area shipments, according to the SEMI Silicon Manufacturers Group.
2008-04-11 SEMI acquires World Fab Watch database
SEMI has acquired the World Fab Watch database and the 300mm Fab report from Strategic Marketing Associates.
2004-07-09 Sematech to open R&D center for immersion lithography
International Sematech on Tuesday (July 6, 2004) announced the formation of an R&D center to develop and push immersion lithography into the marketplace.
2007-06-06 Report: TSMC, Hynix in discussion over $1B fab purchase
Taiwan Semiconductor Co. Ltd is reportedly hammering a deal with Hynix Semiconductor Inc. that would see the foundry shell out almost $1 billion to purchase a 200mm wafer fab with a capacity of 129,000 wafers per month.
2004-06-29 Renesas to pursue 90-, 65nm push
In a move to keep up with current and future chip demand, Japan's Renesas Technology Corp. plans to more than double its production capacity within its 300mm wafer fab over the next year.
2007-03-09 Qimonda to raise capacity in Suzhou facility
Qimonda AG will invest about $329 million over the next three years for the construction of a new facility at its back-end manufacturing site in China.
2002-05-14 Powerchip 30mm wafer fab to use PRI reticle system
Taiwan memory chip maker Powerchip Semiconductor Corp. has selected PRI Automation Inc.'s Guardian Bare Reticle Stocker for its new 300mm wafer fab. The order represents PRI's first bare reticle management system in Taiwan.
2008-05-22 Power outage disrupts Hynix DRAM production
South Korea's Hynix Semiconductor May 20 said it was hit by a power outage at its 300mm fab in Chinaan event that has disrupted the company's DRAM production.
2009-10-02 Panasonic, Renesas run 28nm development line
The two companies are teaming up to operate a 28-32nm process development line in Renesas' Naka site in Japan.
2008-12-18 NOR flash parts move to 65nm processing
Spansion has started making some of its NOR flash parts on a 65nm process at its 300mm production lines in Aizu, Japan.
2007-05-24 New UMC R&D lab zeroes in on advanced nanometer tech
UMC has opened a new R&D lab in Southern Taiwan focusing on advanced nanometer technologies for 300mm manufacturing.
2007-10-29 New Intel fab ramps up 45nm chip production
Intel has started production of new-generation microprocessors for PCs, servers and other computing devices at its first high-volume 45nm manufacturing factory in Chandler, Arizona.
2003-06-06 NEC, Hitachi to provide additional funding for Elpida
NEC Corp. and Hitachi Ltd have decided to make additional investments of up to ?9 billion in Elpida Memory Inc.
2007-11-22 NEC jumpstarts 40nm process, eDRAM tech
NEC Electronics has unveiled a 40nm logic process that makes use of a one-two punch: hafnium-based high-k dielectric materials and nickel-silicide gate electrodes.
2005-04-28 NEC Electronics to deploy its DRAM in Microsoft's next Xbox
NEC Electronics Corp. announced that Microsoft Corp. has adopted its embedded DRAM for the next-generation XBox, the U.S. company's game console, to be announced at E3 in Los Angeles next month.
2005-11-02 Matsushita skips 90nm, shipping 65nm
Matsushita Electric Industrial Co. Ltd will make a strategic move from 130nm manufacturing to the 65nm generation this month as it begins to ship 65nm chips in volume. In doing so, the company has bypassed the 90nm generation.
2008-10-20 Mapper, TSMC delve into multiple e-beam lithography
Mapper and TSMC have signed an agreement, according to which Mapper will ship its first 300mm multiple-electron-beam maskless lithography platform.
2005-02-25 Kyocera expands flip-chip assembly
Kyocera America Inc. has expanded its flip-chip assembly operations to include 12-inch (300mm) wafer dicing.
2004-08-12 Japan's TEL selected for European 'gate-stack' project
Chip equipment vendor Tokyo Electron Ltd (TEL) has signed an agreement with France's CEA LETI (Laboratory of Electronics and Information Technologies) to develop a CMOS gate stack that includes a high-k insulator and metal gate materials and deposition steps for 45nm and lower manufacturing process nodes.
2006-09-22 Japan's SEH to spend $1B on wafer expansion
Responding to its domestic rival, Japan's Shin-Etsu Chemical said Sept. 20 that it has embarked on a major 300mm silicon wafer expansion program at a total cost of $1 billion.
2007-03-28 Is SMIC searching for private equity partners?
Semiconductor Manufacturing International Corp. is on the hunt for a strategic investor willing to ante up as much as $500 million for a 20 percent stake.
2006-08-08 Intel, Micron JV preps new fab
IM Flash Technologies will shortly announce a new 300mm fab in an effort to keep pace with its rivals, according to analysts.
2008-06-02 Intel, Micron debut 34nm NAND flash
Intel Corp. and Micron Technology Inc. have leapfrogged the competition and claimed the technical lead in the NAND flash memory market.
2002-07-16 Intel wafer output not affected by increased die size, says In-Stat
Intel is assured to be ahead of its competitors with its considerable investment in new fabs and a ramp up in 300mm wafer production, despite a significant increase in the company's average die size, according to In-Stat/MDR.
2009-03-16 Intel China fab plan is on track
Intel Corp. is denying rumors within the semiconductor equipment community that it has pushed out plans for a 300mm fab in China, saying it remains on schedule to have the facility in production next year.
2009-06-29 Intel China fab gears for 65nm
In a change in strategy, chip giant Intel Corp. plans to make 65nm devicesnot 90nm productswithin its new fab in China.
2005-02-22 Infineon's memory strategy: invest during downturn
Executives of Infineon Technologies' North America operations said its plan to ramp up a new 300mm fab here is part of a simple strategy: bigger wafers, smaller die size, maximum capacity utilization and continuing investment in its memory technology during a downturn.
2014-12-16 Infineon moves automotive power devices to UMC
Infineon will transfer its Smart Power Technology (SPT9) to UMC as an extension of its long-standing partnership with the latter. Production will start early 2018 at UMC's 300mm fab in Taiwan.
2004-08-11 Infineon expands DRAM agreement with Winbond
Semiconductor suppliers Infineon Technologies AG and Winbond Electronics Corp. have signed an agreement to expand their existing cooperation on the production of standard DRAM chips.
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