Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > 300mm

300mm Search results

total search1235 articles
2004-04-28 Infineon bares Richmond production plans
Infineon Technologies AG has revealed capacity expansion plans at its Virginia subsidiary semiconductor plant, Infineon Technologies Richmond, LP, Virginia.
2006-03-15 Infineon aims for 70nm DRAMs in '06
Infineon Technologies' memory unit outlined its technology roadmap to keep pace in the competitive DRAM market.
2010-04-06 IM Flash starts hiring for Singapore fab
Signaling that the delayed 300mm fab in Singapore is moving closer to ramp up, IM Flash Technologies LLC is advertising dozens of jobs openings in the island city-state.
2007-11-08 IBM-led alliance ups investment in 32nm packaging
The Common Platform alliance led by IBM plans to increase its investment in semiconductor packaging technology to pave the way to 32nm devices.
2005-05-23 IBM, Toppan sign $200 million photomask agreement
IBM Corp. and Toppan Printing Co. Ltd have signed a joint development agreement covering 45nm photomasks worth $200 million, IBM said.
2005-01-18 Hynix, ProMOS sign DRAM production agreement
Hynix Semiconductor Inc. and ProMOS Technologies Inc. have signed a definitive agreement for a long-term strategic alliance to produce Dynamic Random Access Memory (DRAM) chips using 300mm processes.
2011-04-12 GSA: Wafer prices rose in Q4 2010
After decreasing for two consecutive quarters, the median pricing for both 200mm and 300mm production CMOS wafers increased by about 5 percent quarter-over-quarter, according to a GSA survey.
2006-01-13 Fujitsu invests $1B for 65nm production
Fujitsu is investing $1.05B in a second 300mm fab in Mie Prefecture, Japan. Volume production on both 90nm and 65nm processes is expected to start in July 2007.
2002-06-03 FSI receives $15M order for wafer processing equipment
FSI Int. Inc. has received follow-on orders of about $15 million for its ZETA 300mm surface conditioning systems and POLARIS 3500 microlithography clusters.
2012-04-10 Fifth phase of TSMC's Fab 14 gigafab underway
The Fab 14 Phase 5 facility will be combined with the planned Fab 14 Phase 6 to offer a total cleanroom area of 87,000 square meters, four times larger than a typical 300mm fab.
2008-01-14 Fab tool vendors face slow year as used equipment flood market
There is more bad news for the IC equipment industry: a glut of used and cheap gear is expected to flood the market.
2011-02-04 Fab firms' focus on 450mm could disrupt supply chain
Analysts fear there is not enough 300mm capacity today and 450mm plants under construction may not start mass production until 2017 or 2018, a scenario that could trigger disruptions in the IC supply chain.
2004-08-19 European alliance grows for 45nm gate stack push
Collaborative research is cranking up in Europe, as France's CEA Laboratory of Electronics and Information Technologies (LETI) has gathered partners in a project to develop a 45nm-and-beyond CMOS gate stack with a high-k insulator and metal gate electrodes.
2004-10-28 Epson begins pilot production of HTPS TFT-LCD
Seiko Epson Corp. (Epson) has commenced pilot fabrication of high-temperature polysilicon (HTPS) TFT-LCDs at its newly built plant in the Chitose Bibi in Hokkaido, Japan.
2007-01-30 Elpida-PSC JV ramps 70nm production
Elpida Memory and Powerchip Semiconductor will commence business in April, aiming to launch manufacturing operations with a 70nm process by this summer.
2007-02-26 Elpida sells 200mm fab gear to China's Cension
Elpida Memory Inc. announced last week that it has sold some 200mm fab gear to Cension Semiconductor Manufacturing Corp.
2004-06-14 Elpida plans memory super fab
Japanese DRAM maker Elpida Memory Inc. plans to spend ?500 billion, or about $4.6 billion, over the next three years to build the world's biggest wafer fab.
2008-03-19 Elpida enters Japan fab market with UMC
Elpida Memory and UMC have partnered to pursue semiconductor foundry opportunities in Japan.
2010-11-16 Debate clouds Intel Israel fab expansion
Intel is asking the Israel government for $400 million to subsidize the expansion of its wafer fab in Kiryat Gat, but the government is offering only half that amount.
2005-05-30 Chinese banks agree to loan SMIC $600 million
A consortium of Chinese banks has agreed to loan $600 million to Shanghai-based foundry Semiconductor Mfg Int. Corp. to allow the company to expand its 300mm wafer operations in Beijing.
2012-03-20 China foundry gears up for expansion, gets $600M loan
The loan is mainly intended to support expansion and technology development for SMIC's 300mm wafer fab in Beijing.
2008-01-30 Chartered secures loan to acquire new scanners
Singapore's Chartered Semiconductor Manufacturing has signed an agreement for a $190 million term loan to finance the purchase of new scanners for the phase 2 ramp of its 300mm fab.
2009-12-30 Chartered expands amid ATIC takeover
Amid a plan to be acquired, Singapore's Chartered Semiconductor Manufacturing Ltd said it has begun the next phase of an expansion plan within its 300mm fab in Singapore.
2005-03-03 Chartered delivers 65nm design manual and Spice models
Singaporean foundry Chartered Semiconductor Mfg Ltd said it has made the initial deliveries to customers of items to support design in a 65nm manufacturing process developed with IBM Corp., Infineon Technologies AG and Samsung Electronics Co. Ltd.
2006-06-30 Central China fab begins construction
SMIC announced that the first 300mm fab in Central China began construction in the Wuhan East Lake New Technology Development Zone, Hubei Province, China.
2010-02-05 Ceitec CEO sees mega-fab in Brazil's future
Ceitec SAC CEO Eduard Weichselbaumer says that the company's new fab is only a stepping stone that will lead to a large, 300mm 'TSMC-type fab' in Brazil within three years.
2004-12-03 Axcelis to offer AMD with single-wafer technology
Axcelis Technologies Inc. will provide single-wafer implant technology to AMD's new 300mm fab in Dresden, Germany.
2011-05-24 Automated wafer identifies defective devices
Sonoscan has started shipping its automated double-throughput 300 mm bonded wafer inspection system that could identify and remove devices with defects in the production process.
2002-09-30 Applied Materials technology improves Soitec productivity
Soitec has achieved a reduction in cycle time for its 300mm Smart Cut SOI process as a result of enhancements made by Applied Materials Inc. in its Quantum II ion implant system.
2005-07-29 Analysis: why did Intel announce new fab?
Intel Corp.'s announcement to build a new 300mm fab has little to do with future PC growth, as the chip giant hinted earlier this week.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

Back to Top