Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > 32nm CMOS

32nm CMOS Search results

?
?
total search121 articles
2010-09-22 Reality? project characterizes ARM926 for inherent variability at 32nm
An IMEC-led project, called “Reality?, has conducted a characterization of an ARM926 core for the statistical variability that is inherent at the 32nm manufacturing process node. The research project, set up in 2008, has cost about $5.8 million
2007-12-20 Toshiba, IBM extend R&D partnership to 32nm
IBM and Toshiba Corp. have extended their collaboration by entering into a joint development agreement on 32nm CMOS process technology.
2007-01-29 ST to import CMOS, change Crolles function
STMicroelectronics CEO Carlo Bozotti told analysts that the company would align with "industry leaders" to obtain a 32nm CMOS process for use in its wafer fabs.
2006-07-14 Micron joins IMEC's 32nm research platform
IMEC announced that Micron Technology joined its (sub)-32nm CMOS research platform as core partner.
2007-12-13 IMEC reports progress on high-k metal gates at 32nm
IMEC reported progress in improving the performance of planar CMOS using hafnium-based high-k dielectrics and tantalum-carbide metal gates targeting the 32nm CMOS node.
2007-10-17 IMEC extends CMOS scaling research to DRAM MIMCAP
IMEC announced it has initiated research on next-generation DRAM MIMCAP process technology as part of its (sub-)32nm CMOS device scaling program.
2008-09-15 IBM, NEC to develop 32nm IC processing
IBM and NEC have entered a multiyear joint development project where they will produce next-generation IC technology.
2007-09-06 AMD, Qimonda partner on 32nm CMOS simulation
AMD and Qimonda have launched a joint chip simulation project for 32nm CMOS and beyond.
2008-04-29 TSMC throws hat in 32nm high-k ring
TSMC has outlined details of its 32nm road map, giving an impression it may be playing catch-up with its foundry rivals, particularly in the emerging arena of high-k materials and metal gates
2007-06-05 TSMC eyes 2009 for 32nm jump
TSMC is looking to unveil the 32nm process technology in two years' time, according to a DigiTimes report
2007-12-14 Toshiba details 32nm advancements for system LSIs
Toshiba has unveiled advancements in three basic technologies for 32nm generation system LSIs and beyond
2007-10-19 Toshiba 'validates' imprint litho for 22nm CMOS
Toshiba Semiconductor has reportedly validated the use of imprint lithography technology in developing 22nm node CMOS devices
2005-06-17 TI outlines further CMOS scaling
Texas Instruments Inc. (TI) is presenting papers that describe key accomplishments on advanced materials and manufacturing process development at the 2005 Symposium on VLSI Technology.
2012-07-04 The CMOS-mobile apps connection
The two biggest markets for logic chips are, of course, mobile (smartphone and tablet) and PC devices. These markets are now steering the technology direction and defining the winners and losers.
2007-01-30 Sematech unveils solution for high-k CMOS devices
In its quest for developing dual metal gates for high-k CMOS devices, chip-making R&D consortium Sematech has demonstrated high-k/metal gate stacks to build high-performance nMOS and pMOS transistors in CMOS configuration
2007-06-14 Renesas touts SOI SRAM tech for 32nm, beyond
Renesas has developed new technology to implement on-chip SOI SRAM in the 32nm node and finer processes
2008-10-13 Panasonic, Renesas bring partnership to 32nm
Panasonic and Renesas are now collaborating on the development of elemental process technologies for SoCs of the next-generation 32nm node
2012-08-13 Module touts dual-core 32nm Intel Atom, NM10 Express chipset
The ETX-CV is targeted at replacing current entry level and older high performance ETX modules, featuring power consumption ranging between 6W and 12W.
2007-02-01 Logic chipmakers seek 32nm breakthroughs
Even as they put the finishing touches on their 45nm process technologies and tweak them for low power, leading-edge logic chipmakers are scrambling to find manufacturing breakthroughs for the 32nm node and beyond
2008-10-31 Intel to showcase 32nm technology at confab
In the upcoming 2008 IEEE International Electron Devices Meeting, Intel is expected to release its new 32nm process technology for high-capacity microprocessors
2009-09-16 Intel preps 32nm chip launch by year's end
Intel Corp. said its 32nm production wafers are now moving through its D1D fab in Oregon and would be in support of planned Q4 revenue production
2006-01-13 IBM, Sony, Toshiba tip 32nm alliance
IBM, Sony and Toshiba disclosed that they have begun a new, five-year phase of their joint technology development alliance in ICs.
2008-03-12 IBM, Hitachi forge joint 32nm chip research
IBM and Hitachi have signed a two-year joint semiconductor metrology research agreement to speed the pace of semiconductor innovation.
2010-03-15 GlobalFoundries Dresden fab takes on 22nm CMOS
GlobalFoundries Inc.'s Fab 1 in Dresden, Germany is working to help develop 22nm CMOS process and will run the process in volume
2008-06-19 Fujitsu simplifies development of 32nm LSIs
Fujitsu Laboratories Ltd and Fujitsu Microelectronics Ltd today announced the development of low-power CMOS technology for 32nm-generation logic LSIs, which makes it possible to minimize the number of necessary manufacturing processes for LSIs, and without the need to use additional materials.
2004-01-14 Europe plans mega funding for nano CMOS
The European Commission (EC) has approved the first phase of a proposed multiyear collaborative research program to advance CMOS beyond the 45nm node
2007-03-19 Elpida joins IMEC for sub-32nm design project
Japan DRAM manufacturer Elpida Memory Inc. has signed a multiyear contract that allows the company to join the IMEC research platform for sub-32nm geometries
2007-05-25 Common Platform, partners extend chip pact to 32nm
Common Platform partners IBM, Chartered Semiconductor and Samsung Electronics, along with joint-development alliance partners Infineon and Freescale, announced plans to extend their chip development pact to the 32nm node
2006-08-16 CMOS scaling: painstaking but possible
CMOS scaling is, in fact, proving to be a painstaking and humbling taskalbeit a possible one
2002-08-30 Chip alliance rolls in 90nm CMOS platform
Motorola Inc., Royal Philips Electronics, and STMicroelectronics have jointly developed a 90nm CMOS design platform
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top