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2013-10-24 Xilinx, TSMC announce CoWoS 3D IC volume production
The programmable Virtex-7 HT family claims to be the industry's first heterogeneous 3D ICs in production that feature up to sixteen, 28Gb/s and seventyCtwo, 13.1Gb/s transceivers
2008-08-13 World's first 3D chip technology surfaces
The world's first 3D chip process is ready for licensing from the fabless semiconductor design house BeSang
2013-10-11 TU Delft, Imec co-author test flow for 3D IC optimisation
3D-COSTAR aims to optimise the test flow of 3D stacked ICs by compiling the yields and costs of design, manufacturing packaging and logistics
2012-02-06 TSMC to roll 3D IC assembly service next year
The company has one year to get all physical design kits and EDA support in place to allow customers to design with COWOS, the technology standing for chip on wafer on substrate.
2011-12-15 TSMC pushes thru with 3D chip
The semicon firm claims its approach will be simpler, cheaper and more reliable, focusing on creating TSVs early in the process, then adding packaging capabilities to its fabs.
2014-04-25 TSMC fleshes out IC line-up with shrunk TSVs
Based on its work on chip stacks, TSMC will launch in July an enhanced version of the 16nm FinFET technology with up to 18 per cent faster data rates and lower leakage, in addition to a planned 10mm and 7mm processes.
2014-02-19 Tips for cost-effective 3D IC production
Know how to distribute the cost-of-ownership across the supply chain.
2012-11-29 Thermal lock-in analysis drives 3D package dev't
The ELITE thermal lock-in analysis system from DCG Systems claims to provide the ability to localise electrical faults within a 3D packaged device with the highest sensitivity and accuracy
2011-10-14 The move toward 3D chips
Semiconductor fabrication is moving toward 3D ICs and by next year, 3D chips will be available for commercialization
2011-06-09 Test solution automates 3D IC deployment
Imec and Cadence has released a test solution that automates 3D stacked ICs deployment
2008-07-14 Standards for 3D memory chips set
The Intimate Memory Interconnect Standard (IMIS) being promoted by the 3D-IC Alliance recently released its official specification for 3D stacking memory chips.
2012-10-11 SPTS signs JDP with Fraunhofer for 300mm 3D IC Apps
The program will use 300mm APM plasma enhanced chemical vapor deposition modules installed on a Versalis platform alongside SPTS etch chambers in the ASSID centre in Germany.
2013-10-23 SMIC opens R&D, manufacturing facility for 3D ICs
By rolling out a centre dedicated to vision, sensors, and 3D IC, SMIC is hoping to let the world know of its ability to extend its manufacturing and R&D capabilities.
2013-10-31 SK Hynix turns to BeSang for 3D IC tech
SK Hynix has licensed BeSang's 3D IC process that uses a low-temperature process to build multi-layer 3D integrated circuits one layer at a time using traditional vias.
2009-09-11 Singapore launches 3D TSV consortium
The Institute of Microelectronics has announced a 3D through-silicon via (TSV) consortium to boost next-generation 300mm wafer manufacturing capability
2013-06-03 Si2 set to unveil PDN Standard for 3D integrated ICs
The 3D IC Design Exchange Format Standard for Power Distribution Networks describes a unified interface protocol for both Power/Ground and signal ports for die-2-die and package-2-PCB interfaces.
2015-07-27 Semicon West highlights path towards 3D IC
The recent event underlined the significance of the move towards more advanced 3D IC technology, as well as the impact of the 'More than Moore' leading to this progress.
2011-12-22 Sematech details 3D IC tech hurdles
Sematech has identified heterogeneous computing, memory, imaging, smart sensor systems, communication switches and power delivery/conditioning as some of the potential future killer applications
2011-12-20 Rambus, ITRI team up for 3D packaging
According to the two organizations, they will work together as members of Ad-STAC to push system integration using silicon interposer technology.
2015-04-21 Qualcomm to bring Monolithic 3D IC tech to smartphones
According to a Qualcomm executive, the company is looking to leverage Monolithic 3D IC technology to win market share in the $8 billion smartphone market.
2014-06-18 Qualcomm advocates monolithic 3D adoption
The chipmaker appears to be making a concentrated effort to employ 3D integration technology to stretch out the semiconductor roadmap beyond the scaling trajectory predicted by Moore's Law
2013-02-19 Paper tackles 3D IC temperature solutions
The methodology flow presented in the paper will demonstrate the link between the 3-D IC package thermal simulations with the system thermal simulation
2013-01-31 Open ecosystem team up spawns 3D IC
STATS ChipPAC and UMC unveiled a 3D chip stack, consisting of a Wide I/O memory test chip stacked upon a TSV-embedded 28nm processor test chip, which boasts package-level reliability success
2010-03-22 Novellus, IBM launch 3D TSV program
Novellus Systems and IBM Corp. are opening a joint development program to design a manufacturing-worthy, copper-based, 3D semiconductor through-silicon via (TSV) process
2009-09-02 Nanowire crystals produce 3D ICs
Scientists have developed a process for transforming an amorphous germanium layer into a perfect crystal.
2013-12-18 Monolithic 3D ICs gain momentum
A number of companies have, in one way or another, started to take leverage in the monolithic 3D IC space and designated the technology as an alternative to dimensional scaling.
2014-08-19 Monolithic 3D accelerometer boasts WLP tech
The MXC400xXC three-axis accelerometer boasts a technology breakthrough in combining the 3D IC sensor with full WLP that translates directly to a 60 per cent cost and 50 per cent size reduction.
2012-03-28 Micron advances with 3D chips
The company has laid down its plans with the Hybrid Memory Cube that is currently being backed by Altera, OpenSilicon, Samsung, Xilinx and IBM.
2010-03-17 Microfluids cool down 3D IC stacks
IBM Researchers, in collaboration with two Swiss partners, seek to extend Moore's Law another 15 years using 3D stack architectures with liquid-cooling microchannels
2013-12-13 Latest developments in 3D IC technologies
Here's a look at the various forms of 3D IC technology, starting with the simpler incarnations and culminating in today's start-of-the-art implementations.
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