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2005-08-19 New 16Mb SRAM module from 3D Plus is radiation hardened
The new commercial-off-the-shelf high capacity SRAM from 3D Plus is organized as 512k x 32, and is made of four memories (512k x 8 each) accessed with independent write enable.
2005-05-13 3D Plus introduces a 3Gb radiation-tolerant SRAM
3D Plus is introducing a commercial-off-the-shelf radiation tolerant memory module, suitable for space applications such as commercial or scientific geo-stationary missions and deep space scientific exploration.
2005-06-01 3D Plus introduces a 1Gb DDR SRAM in small FBGA ball-out
3D Plus introduces the MMDD04256402BTZ, a high speed, highly integrated DDR Synchronous Dynamic RAM memory containing 1,073,741,825 bits
2015-04-15 SRC to standardise 3D chip testing
Duke University lays down the plan to designing-for-test the TSVs, so that large inexpensive probes can touch many TSV microbumps simultaneously to take measurements that ensure defect-free stacked die.
2014-06-02 SpaceX builds rocket thruster with 3D printer
The SuperDraco engine is 3D printed using direct metal laser sintering with a high-performance superalloy called Inconela carbon-laced nickel-chromium alloy trademarked by Special Metals Corp
2010-01-15 South Korea gears for 3D TV era
As almost all TVs becoming Full HD, South Korea display makers are turning their attention to 3D TV with consumers craving a lot more that just better image quality
2002-06-19 Peritek software speeds 3D rendering
Peritek Corp. has unwrapped an accelerated graphics-processing software package that speeds Solaris-based 3D rendering by as much as four times
2015-10-14 MPUs offer support for Full HD video sensing, 3D graphics
The Renesas RZ/G series MPUs support Linux 3.10 LTSI, which will let customers develop flexible systems, claim to speed up development of high-performance Linux and Android applications.
2014-08-19 Monolithic 3D accelerometer boasts WLP tech
The MXC400xXC three-axis accelerometer boasts a technology breakthrough in combining the 3D IC sensor with full WLP that translates directly to a 60 per cent cost and 50 per cent size reduction
2011-05-13 MIT works on high-def, glass-free 3D
MIT Media Lab describes an algorithm for rendering high-definition 3D images utilizing glasses-free technique
2015-12-07 Light polarisation promises significant boost in 3D cameras
MIT researchers have shown that by exploiting the polarisation of light, they can increase the resolution of conventional 3D imaging devices as much as 1,000 times
2011-05-10 In-Stat: Intel takes industry lead with 3D transistors
In-Stat believes Intel has demonstrated its industry leadership as it introduces its next-generation 22nm process technology and 3D transistors
2005-06-29 Highly-integrated 3D-Boomer audio amps tout amazing-sound
National Semiconductor Corp. unveiled two Boomer audio amps for cellphones and portable applications that are said to provide outstanding sound quality and high integration
2004-02-05 Feinfocus releases x-ray system for 2D, 3D inspection
The ?CT-50 x-ray inspection system from Feinfocus combines high-power ?focus 2D x-ray technology with 3D computed tomography techniques and volume rendering software
2010-09-07 DTV SoC and video IC integrates 3D graphics accelerator
STMicroelectronics announced its new TV System-on-Chip, a first-of-its-kind integrated 3D graphics accelerator empowering next-generation Internet TV services, casual gaming as well as appealing user interfaces
2011-06-01 Consortium takes 3D TV to the next level
The TritonZ consortium, together with EUREKA, will make a great leap forward toward 3D TV broadcasting as they develop a new 3D standard called the CoaXPress
2010-06-09 Blu-ray processor handles 3D video playback
Sigma Designs has released the SMP8646 media processor SoC that enables the latest consumer experiences including 3D video, flash video and Android
2012-02-03 Advances in 3D-IC testing
Read about the design-for-3D-test architecture and implementation flow developed by researchers at Industrial Technology Research Institute based on the Synopsys test solution
2011-09-27 A primer on 3D-IC design challenges
Know the 3D-IC design challenges such as system exploration, floorplanning, analysis, and design for test (DFT), and learn how designs will evolve as 3D-IC goes on to become a necessity for managing power, performance, form factor, and cost goals
2016-01-11 3D NAND scales memory back to Moore's Law
Prior to going 3D, Micron could only shrink each new generation in its x-y dimensions, but they hit the wall at 20nm, only able to shrink in one direction, either x or y, at the 16nm node
2010-10-18 3D modelling tool eases verification
Coventor Inc.'s 3D modeling tool for MEMS chip design now enables design engineers to use Mathlab's Simulink behavior modeling tools to verify that the design functions correctly
2010-07-06 3D fires up display tech revolution
The 3D mania started by Avatar has quickly brought the technology into the mainstream after a long time of dribbling without shooting the final ball
2011-02-07 Solution speeds billion-plus gate design at 28nm
Cadence Design Systems Inc. has announced that it is advancing the design of giga-gate/gigahertz SoCs with digital end-to-end flow at 28nm.
2013-09-20 TSMC unveils 16nm FinFET design flows, uses Cortex-A15 core
TSMC's design flows include one for the company's 16FinFET process, one customised for 16FinFET that offers transistor-level design and a 3D-IC flow for the design of vertically stacked structures
2013-03-22 Space and time trade-offs in advanced computing
Here's an examination of real world trade-offs of time and space, and their impact on our modern mobile computing model. Along the way, we touch on relativistic physics, computer science and science fiction, all in an entertaining and informative look at the continuum.
2004-06-30 ProDesign expands hardware-assisted platform line
ProDesign released the CHIPit Platinum Plus Edition that provides ASIC and SoC designers a platform for high-end verification systems
2013-07-26 Metrology system configured for advanced packaging
Rudolph Technologies' metrology suite includes specially-designed configurations for wafer level packaging, 2.5D (interposer) and 3D ICs using through-silicon via (TSV) as interconnects
2014-10-21 MEMS evolution is coming
A change is occurring in the technology options behind MEMS sensors. According to an analysis firm, the market for MEMS devices based on 3D packaging, novel materials and detection principles will see huge growth in 2019
2011-06-02 Elpida, PTI, UMC join forces for TSV tech
The three-way collaboration of Elpida, PTI, and UMC will deliver 3D IC integration technologies including 28nm
2006-12-19 CMOS imager chips enable true machine vision
New CMOS imager chips are emerging that directly sense depth3D pixel-by-pixelenabling machine vision to realize its goal of perceiving objects, and reacting appropriately
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