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2008-05-01 Partition and package to miniaturize handsets
Designers are turning to system-in-package, 3D IC stacking and wafer-level packaging to enable the acute miniaturization found in handsets, particularly for RF functions
2012-07-12 Multitest platform tests partially stacked dies
Electrical test during device assembly optimizes production yield.
2014-05-05 Exploring Samsung 2x nm LPDDR3 DRAM
Know some of the challenges faced by memory makers as they strive for sub-20 nm devices.
2013-05-06 Conquering FinFET challenges
Here's a look at the challenges from custom/analogue, digital, parasitic extraction and signoff perspectives.
2014-03-27 Nvidia shifts mobile focus to embedded systems, cars
Nvidia will give 3D chip stacks a nudge forward with its next-generation GPUs and will also focus its mobile strategy on embedded systems and cars rather than smartphones and tablets. These are the key takeaways at this year's GPU Tech Conference.
2014-04-25 TSMC fleshes out IC line-up with shrunk TSVs
Based on its work on chip stacks, TSMC will launch in July an enhanced version of the 16nm FinFET technology with up to 18 per cent faster data rates and lower leakage, in addition to a planned 10mm and 7mm processes
2012-03-09 Wide I/O driving 3-D with TSV
Find out how wide I/O is leading the way to through-silicon vias-based heterogeneous die stacks
2007-11-06 Multistandard native 1080/60p HD decoders target next-gen STBs
Horizon Semiconductors claims the industry's first single chip multistandard native 1,080/60p high-definition decoders for triple-play/quad-play cable, satellite and IPTV STBs
2006-10-10 Multimedia processor promises powerful user experience
By achieving 478MIPS performance in the Dhrystone v2.1 benchmark, Renesas' new single-chip processor enables multimedia systems to deliver powerful user experiences
2010-06-08 HP explores memory-centric processors
HP Labs is working on nanostore chip designed around the idea that the explosive growth of storage in Internet data centers requires making data the center of new server design
2014-07-11 Nanotubes: Pocket-sized 80TFLOPS system is the way to go
A carbon nanotube-based 'club sandwich' design that stacks memory and logic technologies could provide a thousand-fold power reduction for a system packing 2,880 IBM Power 7 cores running at 3.5GHz
2016-01-04 What awaits the electronics industry this 2016?
The desktop, notebook, smartphone and tablet markets are expected to carry on this 2016, but none will bring significant growth in this year.
2015-07-08 Trends, challenges for EUV lithography
Imec said cutting costs per transistor at the next-generation, the 10nm node, will be tricky, and even more challenging will be getting extreme ultraviolet lithography ready to enable a full 7nm node.
2013-05-28 The era of Moore's law winding down, says Broadcom's CTO
Henry Samueli, Broadcom's chief technology officer, believes that once Moore's Law ends, standard CMOS silicon transistors will stop scaling around 5 nm and everything will plateau.
2015-02-13 Take a peek at Fujitsu's forum
Fujitsu hosted an event to remind people that it, too, is a tech giant. In Japan, the company employs most of its 160,000 people and makes most of its $46 billion in annual revenues.
2011-10-31 Intel's struggles in digital TV
The problem, in part, is Intel seems to take a bulldozer approach to new market development. Too often, the company drive ambitious initiatives aggressively without its key stakeholders.
2015-02-25 Intel's 14nm process churns out world's smallest SRAM
The company will describe a 0.0500 ?mm2 SRAM bitcell capable of storing 14.5Mb per mm2, which is part of a memory array that will be widely used in Intel's future SoCs such as cellular modems.
2011-09-01 GlobalFoundries ships more chips, prepares for 14nm
GlobalFoundries is claiming it is shipping thousands of 32nm wafers per week and is planning its strategies for the company's 14nm node.
2013-06-12 Altera sketches 20, 14nm FPGAs plan
Stratix 10 FPGAs manufactured under Intel's 14nm process will sample early 2014, packing up to four million logic elements and running at a GHz.
2013-03-13 "Electronic blood" developed for cooling effect
IBM is exploring the use of "electronic blood" to not only cool but also to power the cognitive computers of the future.
2012-12-17 Panel: No single approach in future of ICs
A group of experts at IEDM debated about the various technologies in semiconductor miniaturisation, with FinFETs being just one of many approaches.
2013-12-17 Moore's Law may not be a dead end after all
Henry Samueli, co-founder of Broadcom, said that on a positive note, the looming certainty of Moore's Law could push companies such as Broadcom to be more clever about design possibilities.
2015-04-16 Leading technologists talk about Moore's law
It has been 50 years since Moore's law came to light, and now three top technologists share their thoughts pertaining to Moore's law as well as their take on its proponent, Gordon E. Moore.
2014-10-23 Is there life after CMOS?
Moore's Law is not dead, but it has clearly reached old age, and no fundamental technology has emerged to replace it. Whatever comes next is likely to challenge old assumptions both for technologists and society at large.
2013-02-13 Conflicting proposals hold back IEEE spec
A key standards group is set to draft the spec by May, but so far none of the conflicting proposals from silicon photonics vendors appear to have adequate backing.
2010-12-14 Chipmakers keep secrets at IEDM
Few papers provided clues on vendors' plans at the 2010 International Electron Device Meeting (IEDM). In place of clear presentations on plans for 22-/20nm plans, rumors abounded, with many believing the leading-edge foundries will extend bulk CMOS.
2016-04-12 Stackable NOR, NAND flash suitable for apps, IoT
The mixing and stacking capabilities of Winbond's SpiStack provide designers with flexibility to meet needs for a variety of small machine-to-machine (M2M) and IoT devices.
2006-09-01 Solving the MCP memory test challenge
Multichip packages (MCPs) are the standard for cellphones, with nearly all modern cellphones having at least one MCP. Using MCPs allows manufacturers to offer the new multifunction devices while maintaining small form factors.
2014-09-18 Smartwatch doubles as IoT device with Bluetooth
A low-power wireless technology, Bluetooth, and an equally low-power ARM-based MCU are seen to make an ideal combination for enabling a smartwatch to also function as an Internet-of-Things device.
2008-02-29 Silicon photonics move to rule networks
Developments in silicon photonics have moved the technology into the mainstream, according to presenters at the 2008 Optical Fiber Communication Conference and Exposition.
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