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2015-04-02 Toshiba flexes muscle in 3D NAND arena
The transition to 3D NAND is picking up speed as Toshiba announced in late March that it was shipping samples of its 48-layer 3D Bit Cost Scalable (BiCS) stacked cell structure flash
2012-11-29 Thermal lock-in analysis drives 3D package dev't
The ELITE thermal lock-in analysis system from DCG Systems claims to provide the ability to localise electrical faults within a 3D packaged device with the highest sensitivity and accuracy
2011-10-14 The move toward 3D chips
Semiconductor fabrication is moving toward 3D ICs and by next year, 3D chips will be available for commercialization
2010-07-23 Taiwan maker demonstrates 3D vertical gate NAND device
The 3D NAND Flash uses Macronix's patented BE-SONOS (barrier engineering) charge-trapping technology and 3D decoding architecture
2008-07-14 Standards for 3D memory chips set
The Intimate Memory Interconnect Standard (IMIS) being promoted by the 3D-IC Alliance recently released its official specification for 3D stacking memory chips.
2008-06-19 SanDisk, Toshiba team up to produce 3D memory chips
Expanding their ties, SanDisk Corp. and Toshiba Corp. plan to collaborate on the development of certain types of rewriteable 3D memory, according to a filing with the U.S. Securities and Exchange Commission.
2012-05-10 Microsoft joins memory consortium
Microsoft's participation signals the potential of the Memory Cube to drive changes in the traditional memory hierarchy and systems software for computers and networks
2012-03-28 Micron advances with 3D chips
The company has laid down its plans with the Hybrid Memory Cube that is currently being backed by Altera, OpenSilicon, Samsung, Xilinx and IBM
2002-07-26 Kingston develops CSP technology for memory modules
Kingston Technology Co. Inc. has introduced the Elevated Package Over CSP (EPOC) 3D memory module technology.
2013-01-24 Imec, Cadence team up for DFT solution for 3D memory
Cadence's and imec's solution includes generation of DRAM test control signals in the logic die and inclusion of the DRAM boundary scan registers test access mechanisms of the 3D test architecture
2015-01-09 Identifying memory trends: Issues, standards and specs
Jennie Grosslight, the memory test product manager at Keysight Technologies, revealed what she thinks will be the prevailing memory trends in 2015
2014-09-23 Future memory devices: 10 technologies to keep in mind
While current memory types are smarter and built with higher density, the succeeding memory technologies will integrate new types of materials, as well as smarter algorithms that make storage a hierarchy off-chip in a way that cache memory is hierarchical on-chip
2007-06-25 Designing in the age of 3D systems
The optimal utilization of the third dimension requires a careful design of the overall 3D system architecture
2011-12-08 Designing 3D-ICs (Part 2
Here's the second instalment of this series that tackles the tools that can be used to handle a complete backend flow, and enable true 3D design partitioning, synthesis, placement, and routing
2012-02-13 Challenges, opportunities of the 2.5D/3D ecosystem
While opportunities abound, moving to 2.5D/3D manufacturing has posed significant challenges to designing, fabricating, assembling and testing of 2.5D/3D ICs
2013-10-21 3D memory improved via laser thermal anneal application
Laser thermal anneal application can enhance the current in vertical polysilicon channel devices for 3D memory, as demonstrated by Imec and Excico.
2013-11-12 3D IC success hinges on major foundries
3D chip stack technology is real and has users, but not high-volume ones, according to a panel of experts
2005-05-02 ZyCube duo has big plans for 3D circuits
Two executives from Zycube Co. Ltd lay the road map for significant trends in 3D technology
2010-09-22 World's first two-terminal silicon-only memory chip created
Scientists strip out carbon to create world's first two-terminal silicon-only memory chip
2008-08-13 World's first 3D chip technology surfaces
The world's first 3D chip process is ready for licensing from the fabless semiconductor design house BeSang
2008-06-06 Will 3D through-silicon vias break into mainstream
The 3D technology based on through-silicon vias technology took center stage at the IEEE 2008 International Interconnect Technology Conference but there is still no consensus just how the industry will bring the long-awaited technology into the mainstream
2010-05-11 Why electronics industry needs 3D shift
According to Silicon Frontline's Dermott Lynch, the electronics industry needs innovation in 3D extraction technology to move past the limitations of existing solutions
2012-12-11 Waveguide enables 3D focusing of light
Caltech engineers have created a modified light-focusing device that may lead to applications in computing, communications, and imaging.
2010-11-24 Video processor allows 3D recording
Ambarella Inc. announced a 3D video pre-processor that the company claims works with its camera SoC to enable full HD 1,080p 3D video recording and high-resolution 3D photography
2015-10-05 Using 16nm FinFET as a resistive memory device
An IEDM paper is set to demonstrate that hafnium-dioxide high-k dielectric material, which is used in the high-k metal gate (HKMG) of a 16nm FinFET, can also be turned into a ReRAM device.
2012-02-06 TSMC to roll 3D IC assembly service next year
The company has one year to get all physical design kits and EDA support in place to allow customers to design with COWOS, the technology standing for chip on wafer on substrate.
2015-03-30 Toshiba samples 48-layer, 2bit/cell flash memory
Toshiba's 48-layer stacked cell flash memory BiCS enhances reliability of the write/erase capability and boosts write speed in SSDs. The device is already having sample shipments
2014-02-19 Tips for cost-effective 3D IC production
Know how to distribute the cost-of-ownership across the supply chain.
2013-07-03 The outlook for charge-trapping flash memory
The planar cell structures will enable continued scaling of these charge-trap technologies, while new architectures will emerge and further extend the density-growth trend.
2005-05-11 Tezzaron, PICC to collaborate on 3D flash memory
Tezzaron Semiconductor Inc. and startup Programmable Integrated Circuit Co. (PICC) announced plans to collaborate on the creation of three-dimensional (3D) flash memory components.
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