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2011-05-09 Intel transistor uses 3D structure
Intel has released a 3D transistor design called Tri-Gate into high-volume manufacturing at the 22nm node in an Intel chip codenamed 'Ivy Bridge.'
2002-09-27 Intel develops 3D transistor design
Intel researchers have developed a 3D "tri-gate" transistor design that is expected to perform better than traditional planar (flat) transistors.
2011-05-10 In-Stat: Intel takes industry lead with 3D transistors
In-Stat believes Intel has demonstrated its industry leadership as it introduces its next-generation 22nm process technology and 3D transistors
2012-06-25 Design reduces nanowire transistor footprint
Researchers from the A*STAR Institute of Microelectronics have integrated two transistors onto a single vertical silicon nanowire, pushing the areal density limit of nanowire transistors even further.
2008-08-13 World's first 3D chip technology surfaces
The world's first 3D chip process is ready for licensing from the fabless semiconductor design house BeSang
2015-03-02 Unsolderable no more: Liquid-process transistor does the trick
The "miracle solder" creates new materials by joining their powdered forms into a continuous single-crystal-like material, and can even be used in 3D printers to join formerly incompatible materials
2011-10-14 The move toward 3D chips
Semiconductor fabrication is moving toward 3D ICs and by next year, 3D chips will be available for commercialization
2010-07-23 Taiwan maker demonstrates 3D vertical gate NAND device
The 3D NAND Flash uses Macronix's patented BE-SONOS (barrier engineering) charge-trapping technology and 3D decoding architecture
2011-07-07 TAITRA: TSMC, Intel to battle over 3D chips
TSMC is challenging Intel in the 3D arena as it plans to release 3D chips by the end of 2011
2010-03-03 Startup breaks out with 3D PLDs
Tabula comes out of "stealth mode" with the introduction of a programmable logic architecture that uses time as a third dimension to deliver capability and affordability unmatched by traditional FPGAs and CPLDs.
2013-10-31 SK Hynix turns to BeSang for 3D IC tech
SK Hynix has licensed BeSang's 3D IC process that uses a low-temperature process to build multi-layer 3D integrated circuits one layer at a time using traditional vias
2009-09-11 Singapore launches 3D TSV consortium
The Institute of Microelectronics has announced a 3D through-silicon via (TSV) consortium to boost next-generation 300mm wafer manufacturing capability
2015-07-27 Semicon West highlights path towards 3D IC
The recent event underlined the significance of the move towards more advanced 3D IC technology, as well as the impact of the 'More than Moore' leading to this progress
2007-01-31 Sematech, TEL advance work on 3D interconnects
Sematech and Tokyo Electron entered into a multi-year joint development program to improve the use of 3D interconnect technology and high mobility channel materials in advanced manufacturing
2014-06-18 Qualcomm advocates monolithic 3D adoption
The chipmaker appears to be making a concentrated effort to employ 3D integration technology to stretch out the semiconductor roadmap beyond the scaling trajectory predicted by Moore's Law
2009-09-02 Nanowire crystals produce 3D ICs
Scientists have developed a process for transforming an amorphous germanium layer into a perfect crystal.
2016-04-26 Nanoimprint lithography allows flexible transistor dev't
UW-Madison engineers have pioneered a unique method that could allow makers to easily and cheaply fabricate high-performance transistors on huge rolls of flexible plastic, switching at 110GHz.
2013-12-18 Monolithic 3D ICs gain momentum
A number of companies have, in one way or another, started to take leverage in the monolithic 3D IC space and designated the technology as an alternative to dimensional scaling
2005-02-07 Mezzanine card imparts high-res 2D/3D graphics
A new PMC graphics mezzanine card from MEN Micro gives you a way to include high-resolution 2D/3D graphics into systems that accommodate PMC cards
2014-08-26 Memory process roadmap soldiers on amid looming 3D tech
The constant reduction in feature sizes used to make ICs has improved memory-chip performance by increasing per-chip storage capacities, lowering power consumption, and improving data storage speed.
2013-07-29 Making 3D NAND flash practical
Learn about the key features and benefits of SMArT scheme which is touted to open the 3D NAND flash era
2015-10-14 Laying down the scaling path for monolithic 3D
The IEEE S3S 2015 provided comprehensive coverage of R&D activities in the monolithic 3D space such as integrating a monolithic 3D device without changing the existing frontline fab process
2013-06-20 Intel touts eDRAM as forerunner to 3D ICs
Intel's eDRAM technology is expected to challenge discrete graphics sockets in high-end notebooks and servers.
2005-06-10 Intel tips high-speed 3D imaging for SEMs
Intel Corp. is developing a scanning electron microscope (SEM) technology that claims to be 100,000 times faster than current systems in the marketplace
2010-02-17 Intel sees III-V-on-silicon as 2015 transistor option
Intel director of technology strategy Paolo Gargini said that the inclusion of III-V materials is a 2015 transistor option that could deliver either 3x the performance of silicon at the same power consumption
2015-03-06 Intel recommends 2.5D, 3D integration for next-gen chips
Intel emphasised that heterogeneous integration enabled by 3D IC is essential to the development of future SoCs, especially in terms of scaling lithography processes
2013-05-28 Intel maps out plans for 3D NAND
Intel VP Keyvan Esfarjani discussed the transition of non-volatile NAND flash memory from cells in a 2D array to strings of NAND transistors integrated monolithically in the vertical direction.
2011-04-06 Industry pushes TSV-based 3D chips development
Amid fears that IC scaling is becoming too costly for chipmakers, the IC industry is working to develop TSV-based 3D chips, and stack and connect devices in a 3D configuration using TSVs
2010-03-11 IMEC, Synopsys join hands on 3D stacked ICs
Synopsys Inc. and IMEC have partnered to accelerate the development of 3D stacked IC technologies
2013-01-04 Hynix to start sampling 3D flash memory chips
SK Hynix has announced that it will begin mass producing 3D flash memory chips as investment in such technology grows across the industry
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