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2008-11-28 HP Labs heralds 3D memristor chip
Hewlett-Packard Labs has recently unveiled what it claims to be the first 3D memristor chip at The Memristor and Memristive Systems Symposium
2015-07-03 Examining 3D embedded substrate power packaging
Here is a look at 3D embedded substrate power packaging technologies, which will be increasingly deployed in everything from cell phones to hybrid electric vehicles
2011-12-08 Designing 3D-ICs (Part 2
Here's the second instalment of this series that tackles the tools that can be used to handle a complete backend flow, and enable true 3D design partitioning, synthesis, placement, and routing
2015-02-09 Dark Silicon: Looking to monolithic 3D for ray of light
According to an ARM executive, dark silicon is projected to account for "about one-third of total area in the 20nm technology node, increasing to as much as 80 per cent by the 5nm node."
2015-01-09 CEA-Leti describes true 3D monolithic integration
According to the research institute, the CoolCube technology no longer relies on tall through silicon vias (TSVs) and coarse redistribution layers typically used for wafer-on-wafer die stacking.
2012-02-02 Carbon nanotube beat silicon as transistor material
IBM researchers found that carbon nanotube transistors at under 10nm outperformed silicon in terms of speed and power.
2013-05-23 Can UHD TVs accomplish what 3D TVs failed to do
IHS said TV panel makers are betting on a high rate of growth for UHD LCD TVs in the next four years, expecting to ship about 943,000 UHD LCD panels this year, up from less than 33,000 units in 2012.
2016-01-11 3D NAND scales memory back to Moore's Law
Prior to going 3D, Micron could only shrink each new generation in its x-y dimensions, but they hit the wall at 20nm, only able to shrink in one direction, either x or y, at the 16nm node
2010-10-18 3D modelling tool eases verification
Coventor Inc.'s 3D modeling tool for MEMS chip design now enables design engineers to use Mathlab's Simulink behavior modeling tools to verify that the design functions correctly
2011-06-20 3D merges chip production routes
As advanced processes accompany the shrinking of devices per Moore's law, another section of the industry is running on more relaxed design rules with older fabs. Monolithic 3D could bridge this gap
2002-11-15 3D IC design promises to boost chip performance
IBM Corp. has developed a new technique for building 3D ICs that will help increase chip performance, functionality, and density
2014-05-08 3D chip-making technique utilises metallisation layers
The technique fabricates active devices interleaved between the metallisation layers atop a standard CMOS die, eliminating the expense of vertically stacked transistors or of stacking dies with TSVs.
2010-12-11 2D/3D chip banks on 3D in smart phones, tablets
Dialog’s DA8223, which has a hardwired, dedicated architecture that puts no extra load on the host application processor and requires no external memory, can be plugged into existing portable devices.
2013-04-15 TSMC FinFET production set in 2013
Company executives detailed the new processes and how they aim to get there and also gave an update on 3D chip stacks and their on-going ramp of today's 28nm process node
2013-01-25 Synopsys boosts uptake of FinFETs
The solution for FinFET-based designs includes various DesignWare Embedded Memory and Logic Library IP, silicon-proven design tools and foundry-endorsed extraction, simulation and modelling tools.
2012-09-20 Slow but strong growth expected for IC market
Though IC unit growth is expected to slow, the IC ASP is expected to jump into the positive range, and help boost average annual IC market growth to eight per cent per year from 2011-2021.
2007-03-05 Samsung begins production of 1Gbit DRAM at 60nm
Capitalizing on the increasing demand for large density DRAMs, Samsung Electronics Co. Ltd has started mass production of the industry's 'first' 1Gbit DDR2 DRAM using 60nm process technology.
2008-07-07 Qimonda, Siltronic team on next-gen transistors
Qimonda has teamed up with wafer manufacturer Siltronic AG to conduct basic research for future transistor architectures that focuses on three-dimensional transistors that will enable smaller geometries
2015-04-16 Leading technologists talk about Moore's law
It has been 50 years since Moore's law came to light, and now three top technologists share their thoughts pertaining to Moore's law as well as their take on its proponent, Gordon E. Moore.
2011-05-12 IHS: Intel's tri-gates impede ARM's dominance
A market research report by IHS cites low-power consumption of Intel's 22nm tri-gate transistor as an advantage of the company over other competitors
2013-04-02 FinFETs still not ready for prime time
Rising capacitance is one of many challenges that lie ahead before a process node that utilises 3D transistors can be realised, according to a panel of experts at the annual Synopsys User Group meeting
2012-03-15 Electronics firms clamour for more collaboration
Executives of Cadence, TSMC and ARM are calling for other companies to step up their collaborations to deal with the growing complexity of technologies of semiconductor design.
2008-12-16 DRAM adopts better features
Samsung Electronics Co. Ltd's 56nm DRAM is something to watch out for. Changes to the basic transistor design for both the cell access transistor in the memory array and the peripheral support transistors used to design the control logic are in the works
2013-05-06 Conquering FinFET challenges
Here's a look at the challenges from custom/analogue, digital, parasitic extraction and signoff perspectives.
2013-07-11 Xilinx tapes out 20nm FPGA device
The firm worked with TSMC to infuse high-end FPGA requirements into the TSMC 20SoC development process to result in the first tape-out of the ASIC-class programmable architecture: UltraScale.
2015-05-22 Why Moore's Law is nowhere near ready to meet its maker
In 2003, Intel predicted an end to Moore's Law shortly after hitting the anticipated 16nm node, but today it seems we're on track for 10nm fairly soon with 7nm not far off.
2015-09-11 Upcoming IEEE conference to focus on key IoT tech
The emerging IoT market is looking for older nodes with lower development costs, broad range of process options, with many more players both at the foundry side and the design side.
2013-09-20 TSMC unveils 16nm FinFET design flows, uses Cortex-A15 core
TSMC's design flows include one for the company's 16FinFET process, one customised for 16FinFET that offers transistor-level design and a 3D-IC flow for the design of vertically stacked structures.
2011-08-11 Tri-gate rouses Intel-ARM rivalry
Intel's announcement of its low-power tri-gate transistor triggers anew its competition with ARM
2014-11-04 The lowdown on manufacturing RRAM
Resistive memory technologies involving simple two-terminal devices can be incorporated into backend metal layers to provide an elegant solution for meeting density, capacity and cost challenges.
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