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2013-12-17 Moore's Law may not be a dead end after all
Henry Samueli, co-founder of Broadcom, said that on a positive note, the looming certainty of Moore's Law could push companies such as Broadcom to be more clever about design possibilities.
2011-06-02 Intel plots new roadmaps for Ultrabook, mobile devices
Intel is prepared to carry out its new roadmaps for its Core and Atom chips with "strong" industry collaboration.
2014-03-20 Chip stacks feature near-zero TSV keep-out zones
GlobalFoundries describes a middle-of-line layer stack technique that uses nitride, PMD oxide, and a contact protection layer with a high coefficient of thermal expansion.
2014-07-01 Chip industry to face hurdles brought by 20nm tech
Executives from two capital equipment firms said chip vendors face the challenges brought by higher costs and complexities due to tighter margins, new processes and materials at 20nm and beyond.
2010-09-22 “Reality? project characterizes ARM926 for inherent variability at 32nm
An IMEC-led project, called “Reality?, has conducted a characterization of an ARM926 core for the statistical variability that is inherent at the 32nm manufacturing process node. The research project, set up in 2008, has cost about $5.8 million.
2010-09-22 World's first two-terminal silicon-only memory chip created
Scientists strip out carbon to create world's first two-terminal silicon-only memory chip
2014-12-18 What's hot at IEDM 2014?
The 2014 International Electron Devices Meeting proved that Moore's Law is still alive. The event was a victory lap for Intel, which gave more details on the 14nm finFET process.
2014-10-10 Wafer foundry market teeters on edge of growth
The market's growth has fluctuated between a high of 39.4 per cent in 2010 and a low of 6.8 per cent in 2013, due mainly to the differentiation in wafer foundry industry.
2013-04-19 Variability, reliability interplay damaging to SRAM design
A study by GSS describes the development of a unique simulation framework and a set of validated tools that could greatly enhance design and yield predictions in advanced technologies.
2012-08-21 Utilize wafer-scale CMOS X-ray imaging for medical apps
This imaging technology can bring key advantages in terms of performance such as high resolution, high dynamic range and low noise capabilities.
2015-02-09 Utilising LEDs for LCD backlighting (Part 1)
Learn about the types of LED LCD backlight units, the market trends and technological developments, the advantages of LED LCD televisions, and the key points in the optical design of LED backlights.
2015-10-05 Using 16nm FinFET as a resistive memory device
An IEDM paper is set to demonstrate that hafnium-dioxide high-k dielectric material, which is used in the high-k metal gate (HKMG) of a 16nm FinFET, can also be turned into a ReRAM device.
2010-04-19 TSMC tech event packs few surprises
Taiwan Semiconductor Manufacturing Co. Ltd presented a dizzying array of technology and new processes plus a few surprises at this year's Technology Symposium.
2010-04-15 TSMC skips 22nm, leaps to 20nm half-node
Taiwan Semiconductor Manufacturing Co. Ltd announced plans to skip the 22nm "full node" after the 28nm node and move directly to the 20nm "half node."
2015-09-01 Touch Taiwan 2015: Foldable, rollable LEDs rule
Taiwan's Industrial Technology Research has unveiled several new technologies to lead development of low-cost wearable devices that can be folded and rolled up in a scroll.
2009-07-09 Top 10 industry issues
Here are the top 10 looming issues that the semiconductor capital equipment industry is facing.
2010-11-25 Superscalar CPU executes two threads at once
Broadcom announced the development of a new MIPS-compatible CPU for its broadband SoCs.
2008-12-25 Studies address process variability issues
CMOS device process variability remains one of the most acute problems facing the semiconductor world, particularly at the 45nm node and beyond, according to presenters at the International Electron Devices Meeting (IEDM).
2007-02-01 Startup weaves new foundation for chip design
Fabbrix claims it can provide the regular circuit patterns or 'fabrics' needed by manufacturable designs at 65nm and belowwithout area, performance or power penalties.
2007-01-29 SiP lacks EDA tool support
System-in-package (SiP) may be an increasingly attractive alternative to SoCs, but EDA tool support is sorely lacking.
2007-02-09 Sematech to advance planar solution devt for 22nm
Sematech front-end engineers will combine planar CMOS approaches with new channel materials to develop transistors for the 22nm half-pitch technology generation.
2009-07-02 Sematech details tips for future IC scaling
IC scaling remains a challenge and to enable it, there is always brute-force lithography.
2012-02-23 Samsung goes quad-core
The new chip comes in versions using two or four ARM Cortex A9 cores running at rates from 200MHz to 1.5GHz along with a 64bit ARM Neon media processing block.
2014-09-03 Samsung funds research for 7nm
The South Korean tech giant is financing Pennsyvania State University's work on III-V, which explores FinFET fabrication using the combination of silicon and indium gallium arsenide.
2015-04-20 Samsung details 14nm FinFET strategy
The Korean company made significant headway when it shipped its first 14nm FinFET chip, beating TSMC to become the second chipmaker after Intel to pave the road for 14nm technology.
2014-10-10 Rising costs drive chip companies to alternate routes
The low cost of capital is fuelling M&A across all industries, and the rising cost and complexity of making chips is pouring gas on the fire in semiconductors.
2016-03-07 Phase change memory advances: Threshold switching
Here's a look at threshold switching as part of the effort to understand every detail of the conduction mechanisms associated with nano-metric sized phase change memory devices.
2012-02-27 Optical links hold key to PCB-processor gap
The pace of growth of processor performance is not in sync with the optical backbone of the Internet, and this is where experts agree efforts should be focused on.
2009-07-16 Novellus, Albany NanoTech team on sub-22nm R&D
The College of Nanoscale Science and Engineering at the University at Albany and Novellus Systems Inc. have formed a $20 million partnership to conduct next-generation R&D sub-22nm semiconductor manufacturing technology.
2007-02-01 Next-gen memory market up for grabs
The frantic search for a next-generation memory technology took center stage at the IEEE International Electron Devices Meeting in December, amid growing concerns that DRAM and flash parts will no longer scale in the near future.
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