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2005-08-16 Eyewear mimics image of big flat-panel display
Kopin Corp. offers an alternative miniature display solution to large flat-panel LCDs made from amorphous silicon.
2014-04-11 Experts express hope, concern for IC future
While it is said that defect rates for new nodes are declining faster, the IC industry still has to regard its future in relation to the future nodes and existing technologies like FD-SOI and FinFETs.
2007-01-01 End of Moore's Law prompts technology search
The search is on for a technology that could replace today's workhorse CMOS-based silicon.
2002-10-21 Embedded processors, cores target broad app range
Designers detailed a diverse array of embedded processors at the end of the Microprocessor Forum at San Jose, California.
2015-04-24 EDA tool reduces design time for FinFETs
The Calibre xACT claims to quickly and accurately extract parasitic capacitance, resistance and inductance for IC designs including digital, custom, analogue and RF.
2013-06-12 DRAM makers find new processes for sub-nm DRAM cells
TechInsights studied the processes and device architectures of mass-produced 3xnm SDRAM cell array structures from major manufacturers and found that the technologies can be scaled further.
2009-07-08 Coming soon: Carbon chips
Carbonthe basis of all organic compoundsseems destined to displace silicon as the material of choice for future semiconductors.
2014-03-28 CMOS or FinFET: Exploring cost-effective solutions
The 16/14nm FinFET and 20nm bulk high-K metal gate CMOS next-gen processes deliver small transistors at a price higher that the current 28nm bulk HKMG CMOS.
2008-07-21 Chip industry preps for 'More than Moore' era
Chip and semiconductor equipment makers are at a crossroads as they face an era that might be called "More than Moore."
2004-09-03 Cadence emphasizes solutions in design tech symposium
As part of a promotional campaign of its portfolio in Southeast Asia, Cadence Design Systems showcased different versions of its electronics design software solutions in a design technology symposium held in Manila, Philippines, in Aug. 24.
2011-07-14 Bonding system targets 450mm SOI wafers
EV Group has released a bonding system for 450mm-diameter wafers manufactured from silicon-on-insulator substrates.
2009-02-13 Battle commences in 50nm DRAM arena
Samsung and Hynix, two of the industry's DRAM leaders, have already begun migrating their production of major products to the 50nm class process node. Latest analysis on both 1Gbit DDR2 SDRAM parts from Samsung and Hynix revealed very interesting trends from the two Korean rivals.
2012-08-15 ARM, Globalfoundries team up on 20nm, FinFET process tech
The multiyear agreement aims to jointly deliver optimized SoC solutions for ARM processor designs that extend to include GPUs, which are becoming an increasingly critical component in mobile devices.
2013-04-10 ARM, Cadence to advance IP, design automation
The firms will implement the industry's first Cortex-A57 64bit processor on TSMC's 16nm FinFET process.
2014-02-12 ARM's shift to non-volatile memory bodes well
ARM expands its view on IP, considering the future uses of MRAM and CeRam.
2008-06-02 ANSI C vs. System C: Resolving the confusion
Is ANSI C or SystemC the best language for ESL? Use whichever language is best for a given requirement, while ensuring that a methodology exists to tie everything back together at the highest level.
2013-02-08 Analyst: AMOLED TV panel shipments to remain low
Shipments of AMOLED TV panels are expected to climb to 1.7 million units in 2015, up from 1,600 in 2013, but will remain negligible compared to LCD panel shipments.
2013-05-29 Analysis: More to join ST in FDSOI ecosystem
STMicroelectronics will soon find company in what's currently seen as an empty FDSOI ecosystem as momentum slowly but surely builds up on a global scale.
2012-05-23 Analysis reveal Intel finFETs' triangular structure
The triangular section is markedly different to the idealized rectangular section that Intel had shown previously in 2011.
2012-04-09 Advantages of resistive RAM for next-gen NVM
Here's a discussion on the strengths of hafnium-oxide-based resistive RAM cells, and the main challenges ahead for this technology.
2013-07-08 Addressing memory scaling concerns
Here are some promising research and design directions to overcome challenges posed by memory scaling.
2013-12-19 Achronix demos embedded 100G Ethernet in 22nm FPGAs
The company said its Speedster22i are the only FPGAs that have hardened IP for communication applications including 100G Ethernet, 100G Interlaken, PCI Express Gen3 x8 and DDR3 memory controllers.
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