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3D What is a 3D memristor? Search results

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What is a 3D memristor?
Memristor is touted to be the fourth fundamental circuit element in electrical engineering. In November 2008, HP Labs unveiled what it claims to be the first 3D memristor chip, which had memristor crossbar memory cells stacked on top of a CMOS logic chip. (Souce: EE Times Asia)
total search2322 articles
2005-05-02 ZyCube duo has big plans for 3D circuits
Two executives from Zycube Co. Ltd lay the road map for significant trends in 3D technology.
2004-08-13 Zoran agrees to use Norwegian 3D graphics core
Zoran Corp., a fabless chip company with a background in digital graphics and imaging chips, has formed a partnership with Falanx Microsystems AS, a licensor of graphics processing cores for mobile applications, Zoran said on August 10, 2004.
2010-09-21 Zenith 3D AOI system offers measurement-based inspection
Koh Young Technologies has just introduced their revolutionary Zenith 3D AOI System. It measures the Z-axis profilometry of whole PCB assemblies, including components, leads, and solder joints, based on Moir technology.
2013-08-08 XRM solution bolsters nanoscale 3D imaging by a factor of 10
Xradia 810 Ultra X-ray microscopy solution from Zeiss operates at 5.4keV, a lower X-ray energy that delivers better contrast and image quality for many materials.
2013-10-24 Xilinx, TSMC announce CoWoS 3D IC volume production
The programmable Virtex-7 HT family claims to be the industry's first heterogeneous 3D ICs in production that feature up to sixteen, 28Gb/s and seventyCtwo, 13.1Gb/s transceivers.
2007-04-30 X-ray inspection system delivers high-throughput 3D coverage
Agilent Technologies says its Medalist x6000 3D X-ray inspection systems offer more than double the throughput of leading 3D solutions while using full 3D capability to find PCB assembly (PCBA) solder and manufacturing assembly defects.
2012-09-14 X-Fab claims the first open platform MEMS 3D process
X-Fab's 3-D sensor process is suitable for applications ranging from mobile devices, consumer goods, games and toys, automotive, robotics, industrial and medical equipment.
2008-08-13 World's first 3D chip technology surfaces
The world's first 3D chip process is ready for licensing from the fabless semiconductor design house BeSang.
2008-06-06 Will 3D through-silicon vias break into mainstream?
The 3D technology based on through-silicon vias technology took center stage at the IEEE 2008 International Interconnect Technology Conference but there is still no consensus just how the industry will bring the long-awaited technology into the mainstream.
2010-05-11 Why electronics industry needs 3D shift
According to Silicon Frontline's Dermott Lynch, the electronics industry needs innovation in 3D extraction technology to move past the limitations of existing solutions.
2010-06-09 WHDI 2.0 spec to cover 3D, mobile app integration
The WHDI 2.0 specification will include support for full 3D and next-gen 4Kx2K HD format; as well as mobile app integration through reduced power consumption.
2012-01-17 Webcam controller ICs boast 3D, gesture control
The eSP768 and eSP868 chips feature image signal processors, USB 2.0 interface with an image compression engine and four built-in LDOs.
2012-12-11 Waveguide enables 3D focusing of light
Caltech engineers have created a modified light-focusing device that may lead to applications in computing, communications, and imaging.
2012-01-19 Wafer bonding machine yields 3D integrated LSI ICs
The Bond Meister MWB-12-ST can continuously bond up to five 12in wafers and can perform wafer transfer and alignment for automatic bonding.
2015-08-25 Vietnamese company develops low-cost, high-speed 3D scanner
Vietnamese company An Viet Long has created its first 3D scanner, which is designed to be faster and more affordable than other handheld counterparts in order to meet customer demand.
2005-05-23 Video processor provides enhanced 3D motion
SmartASIC Technology Inc. has released its STV110 video processors that provide enhanced 3D motion adaptive de-interlacing, adaptive scan-rate conversion and bi-linear up and down scaler.
2010-11-24 Video processor allows 3D recording
Ambarella Inc. announced a 3D video pre-processor that the company claims works with its camera SoC to enable full HD 1,080p 3D video recording and high-resolution 3D photography.
2011-07-05 Video primer: HDR, 3D processing challenges
The last couple of decades have witnessed a phenomenal increase in the number of pixels accommodated by display systems, enabling the transition from standard-definition video to high-definition video.
2008-01-23 Video decoder with 3D comb filter aims at HDTVs
Analog Devices has expanded its Advantiv advanced TV portfolio with a new 12bit resolution 3D comb video decoder with an integrated 150MSps digitizer for Full-HD 1,080p input formats.
2003-03-10 VIA licenses Sensaura 3D audio technology
VIA Technologies Inc. has licensed Sensaura Ltd's audio technology.
2001-07-16 Validate EMC design rules with 3D simulation
This article provides an overview of EMC- and 3D-analysis tool capabilities that can enhance an your design's performance.
2015-06-18 Vacuum boosts 3D vapor-phase soldering process
In this article, we demonstrate how to significantly improve the three-dimensional soldering process for a moulded interconnect device (MID) application.
2013-07-09 USHIO books its interposer stepper for 2.5D/3D packaging
The UX7-3Di LIS 350 has achieved a resolution of 2?m L/S on a 300mm Si wafer as well as an organic substrate and is able to address a warp or expansion/contraction of an organic substrate.
2013-07-10 UNIST mass produces 3D mesoporous graphene
A team from the Ulsan National Institute of Science and Technology developed a new method to massively synthesise enhanced, yet affordable, materials for supercapacitors.
2008-07-31 Ultrafast 3D circuit enables higher switching capacity
The Berlin-based Ferdinand Braun Institute for Ultra-High Frequencies (FBH) has launched an IC process that enables transistors switching at frequencies of well beyond 200GHz.
2010-07-30 Twin-lens supports consumer 3D video cameras
Panasonic debuts a digital twin-lens that makes it possible to shoot 3D with an interchangeable lens system camera.
2012-10-02 TVs drive 3D-ready device demand, says report
The 3D display market is set to grow from 50.8 million units and $13.2 billion in revenue in 2011 to 226 million units and $67 billion revenue in 2019 worldwide.
2008-09-22 TV big shots lack stereo 3D patents
LG, Matsushita, Samsung, Sony and Toshiba currently have no significant patents on stereo 3D, according to an initial patent search by EE Times.
2013-10-11 TU Delft, Imec co-author test flow for 3D IC optimisation
3D-COSTAR aims to optimise the test flow of 3D stacked ICs by compiling the yields and costs of design, manufacturing packaging and logistics.
2011-02-22 TSMC, Taiwan university create multi-angle 3D chip
The 3D TV chip allows TV viewers to see an object in stereo from various angles. It also comes with traditional HDTV and 3DTV functions.
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