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2010-12-15 3DS-IC group to fast-track TSV standards
SEMI worked with SEMATECH to launch the Three-Dimensional Stacked Integrated Circuits (3DS-IC) group to develop manufacturing standards for through-silicon via (TSV) technology.
2011-04-06 Industry pushes TSV-based 3D chips development
Amid fears that IC scaling is becoming too costly for chipmakers, the IC industry is working to develop TSV-based 3D chips, and stack and connect devices in a 3D configuration using TSVs.
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