Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > 3d

3d What is a comb filter? Search results

?
?
What is a comb filter?
A comb filter is a bandpass filter used to process audio and video signals by mixing the original with a delayed signal. Comb filters allow selected frequencies to pass while blocking their harmonics and all other frequencies. (Souce: EE Times)
total search2321 articles
2014-06-30 Google to roll out 3D-sensing tablet by next year
The 7in Android tablet runs on an Nvidia Tegra K1 processor with 120GB SSD and 4GB of RAM, a 4MP/2um camera, a high-speed light-sensitive sensor and a custom motion tracking camera.
2013-04-04 Globalfoundries delays 3D IC stack production
The company says it expects to use the 20nm process for 3D chips that may not ship in volume until 2015 or later.
2011-09-05 Global TV firms support full HD 3D glasses initiative
Philips, Sharp, TCL and Toshiba are backing up activities toward a new technology standard for 3D active shutter glasses.
2014-08-19 Global 3D printing market sparks manufacturing revolution
The global 3D printing market was sized at $3 billion in 2013, and expected to reach $6.1 billion by 2018reflecting the growing number of firms transitioning from analogue to digital manufacturing.
2011-12-12 Gesture recognition: Leading toward 3D UIs?
Read about the challenges in gesture recognition in 3D interaction and the techniques to overcome them in embedded systems.
2012-01-11 GaN nanowires show more 3D piezoelectricity than bulk GaN
Researchers at the Northwestern University revealed that individual GaN nanowires as small as 60nm have piezoelectric behavior in 3D up to six times of their bulk counterpart.
2015-04-07 Future of 3D SoCs: Adding unlimited layers sans TSVs
The future of three-dimensional (3D) very large scale integration (VLSI) for system-on-chips (SoCs) will not stack die connected by through-silicon-vias (TSVs), but will build them on a single layered die, according to Qualcomm.
2010-06-17 Full HD 3D plasma display available in 152-inch model
Panasonic Corp. is offering professional-use, ultra-large Full HD 3D plasma display panels in the largest 152-inch model, as well as 103- and 85-inch models.
2008-10-01 Fujifilm bring 3D center stage with new camera
If you still think 3D video is just a gimmick, think again.
2013-12-11 Fringe light projection offers potential for micro-3D survey
A researcher from University of Freiburg revealed how fringe light projection can be applied to measure the dimension of 3D objects in the micrometer range.
2004-10-26 Freescale, Nvidia go mobile with lifelike 3D experiences
Consumers will soon be able to enjoy 3D graphics on portable multimedia devices as a result of a collaborative effort between Freescale Semiconductor Inc. and Nvidia Corp.
2012-02-24 Free viewpoint, no glasses 3Dyour future TV
DisplaySearch forecasted that the market for 3D TVs would grow from below 25 million units and under $3 billion last year to more than 200 million units and nearly $20 billion in 2018.
2014-01-16 FP7 FlexTiles 3D SoC project to run on dual FPGA board
Sundance Multiprocessor Technology has developed a dual FPGA board as the prototyping platform for the European Union's FP7 FlexTiles 3D SoC project.
2006-05-31 FlipChip, Engent to develop 3D wafer level CSP tech
FlipChip and Engent announced an alliance aimed at accelerating the development and deployment of 3D wafer level CSP technologies for stacked die packaging applications.
2015-10-30 Flash storage: 3D TLC NAND to beat MLC (Part 2)
In the first instalment of this series, we discuss alternate methods to increase density, as well as how a new innovation addresses SSD challenges surprisingly well.
2015-10-27 Flash storage: 3D TLC NAND to beat MLC (Part 1)
In the first instalment of this series, we look into the advantages as well as challenges associated with solid state drives (SSDs).
2003-04-04 feinfocus x-ray displays 2D, 3D imagery
feinfocus has released the ?CT-F.O.X. x-ray inspection system, which is claimed to be the first to include 2D and 3D modalities in one device.
2004-02-05 Feinfocus releases x-ray system for 2D, 3D inspection
The ?CT-50 x-ray inspection system from Feinfocus combines high-power ?focus 2D x-ray technology with 3D computed tomography techniques and volume rendering software.
2011-06-16 FEI ion beam cuts imaging time for MEMs, 3D chips
The Vion PFIB tool can cut the time to image MEMS and 3D chip features by 20x, from more than 10hrs to under 40mins for TSVs, revealing in minutes chip features ranging in size from 30nm to 1mm.
2004-06-01 Extending Java with 3D API
To fill what plug-ins lack, JavaSoft and a cooperative industry contingent have extended Java with 3D APIs.
2013-12-30 Exploring monolithic 3D IC technologies
Learn about a relatively new approach that seems really promising: the Monolithic 3D IC technology.
2015-07-03 Examining 3D embedded substrate power packaging
Here is a look at 3D embedded substrate power packaging technologies, which will be increasingly deployed in everything from cell phones to hybrid electric vehicles.
2010-07-13 EVG, IME join hands on 3D IC integration
EV Group and Singapore's Institute of Microelectronics (IME) signed a two-year agreement to cooperate on developing 3D IC integration technologies.
2009-07-21 EVG, Applied ink 3D wafer bonding deal
EV Group (EVG) has partnered with Applied Materials Inc. to develop wafer bonding processes for the manufacture of through-silicon vias (TSVs) in 3D IC packaging applications.
2015-02-06 Entegris touts dispense system for 3D and MEMS applications
Entegris unveils an addition to its family of two-stage dispense systems, the Intelligen MV, designed to filter and dispense sensitive photochemicals.
2014-12-04 End of DDR marks surge of 3D, TSV-based memory
Several DRAM memory architectures based on 3D layer stacking and TSV have evolved to accommodate increasing memory requirements spearheaded by Samsung, Hynix and Micron.
2011-10-01 Employing SoC for cost-effective 3D designs
Here's a look at the current 3D active shutter architectures vis-à-vis the next generation solutions now available.
2011-11-16 Embedded die tech-based 3D package unveiled
ChipletT and ChipsetT enable packaging in the sub-250?m range, up to 50 percent less than alternative embedded die solutions, the companies claimed.
2004-05-21 eMagin wins U.S. patent for 3D OLED device
eMagin Corp. has received notification from the U.S. Patent and Trademark Office of patent issuance for the invention of its 3D OLED device, U.S. Patent No. 10,017,769, "Three dimensional display emulation method and system."
2010-06-23 Elpida, PTI, UMC team on 3D IC integration for 28nm
Elpida Memory Inc., Powertech Technology Inc. (PTI), and United Microelectronics Corp. have reached a three-way cooperation to advance 3D IC integration technologies for advanced processes including 28nm.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top