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What is a comb filter?
A comb filter is a bandpass filter used to process audio and video signals by mixing the original with a delayed signal. Comb filters allow selected frequencies to pass while blocking their harmonics and all other frequencies. (Souce: EE Times)
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2014-01-28 Stratasys touts first colour multi-material 3D printer
The Objet500 Connex3 Color Multi-material 3D Printer promises to improve design and manufacturing efficiencies and deliver better products through a unique triple-jetting technology.
2013-12-06 Stratasys introduces unfilled nylon for 3D printing
Stratasys releases unfilled nylon for additive manufacturing and double-capacity canisters for three materials used in its Fortus production systems.
2015-08-31 Storage array packs 3D NAND drives
By supporting 3D TLC SSDs, Kaminario's K2 v5.5 customers can double the effective capacity of the array to more than 360TB per K-block and scale one K2 array to multiple petabytes in a single rack unit.
2014-04-15 Stereo 3D camera captures untextured surfaces
IDS' Ensenso N10 series employs the projected texture stereo vision procedure, where the projector projects a static, high contrast texture onto the scene, capturing nearly all surfaces within the field of vision.
2011-01-04 STB SoC with VXP studio quality video processing, 3D
Sigma Designs' SMP8910 is an STB SoC that integrates VXP studio quality video processing and 3D video processing. It reaches more than 6,000DMIPS with its dual-core 1004K MIPS CPU.
2011-11-25 STB IC features 3D TV capability
The MoCA 1.1-certified STi7108M enables HD STBs for home multimedia networking.
2005-10-20 STATS ChipPAC wants to be 3D king
Nearly two years after the big merger, Singapore's STATS ChipPAC Ltd is treading slightly above stormy waters in the competitive chip packaging and test market.
2010-03-03 Startup breaks out with 3D PLDs
Tabula comes out of "stealth mode" with the introduction of a programmable logic architecture that uses time as a third dimension to deliver capability and affordability unmatched by traditional FPGAs and CPLDs.
2008-07-14 Standards for 3D memory chips set
The Intimate Memory Interconnect Standard (IMIS) being promoted by the 3D-IC Alliance recently released its official specification for 3D stacking memory chips.
2008-06-09 ST considers 3D graphics core in next chipsets
STMicroelectronics NV is currently negotiating with IP licensors regarding the inclusion of 3D graphics processing core in the next portable equipment chipsets and TV processors.
2015-04-15 SRC to standardise 3D chip testing
Duke University lays down the plan to designing-for-test the TSVs, so that large inexpensive probes can touch many TSV microbumps simultaneously to take measurements that ensure defect-free stacked die.
2012-10-11 SPTS signs JDP with Fraunhofer for 300mm 3D IC Apps
The program will use 300mm APM plasma enhanced chemical vapor deposition modules installed on a Versalis platform alongside SPTS etch chambers in the ASSID centre in Germany.
2015-02-10 Spansion, XMC team up to develop 3D NAND
U.S.-based Spansion and China-based XMC sign development and cross-licensing agreements for 3D NAND technology. The devices from this joint venture are expected to be available in 2017.
2014-06-02 SpaceX builds rocket thruster with 3D printer
The SuperDraco engine is 3D printed using direct metal laser sintering with a high-performance superalloy called Inconela carbon-laced nickel-chromium alloy trademarked by Special Metals Corp.
2010-01-15 South Korea gears for 3D TV era
As almost all TVs becoming Full HD, South Korea display makers are turning their attention to 3D TV with consumers craving a lot more that just better image quality.
2009-09-07 Sony to bring 3D viewing to the home
Sony Corp. announced plans to lead the way in delivering new 3D viewing experiences by bringing 3D to the home in 2010.
2009-07-16 Soitec, IBM pioneer 22nm for 3D ICs
Soitec Group and IBM Corp. have teamed up to pioneer 22nm node silicon wafer substrate and bonding techniques that will enable wafer-level, 3D integration technology for next-generation ICs.
2009-12-04 Soitec, CEA-Leti push 3D integration
The Soitec Group and CEA-Leti will offer comprehensive industrial solution beginning with process customization for prototype demonstration and will include licensing, both in 200mm and 300mm.
2014-01-27 Software from Zeta Instruments offers 3D imaging, analysis
The ZMorf Surface Imaging and Metrology software supports 3D imaging of surface topography combined with colour image overlays to speed up the identification of surface features and anomalies.
2010-02-12 SoCs handle HD content, 3D graphics
From NEC Electronics comes the EMMA Mobile EV SoCs designed for full HD portable audio-visual devices delivering 3D graphics processing capability.
2010-11-16 SoC addresses 1080p, 3D computing needs
Amlogic combines ARM Cortex-A9 processor and ARM Mali-400 GPU with 1080p video
2012-07-09 Soap film display floating 3D images
Using soap film, scientists have developed an ultra thin and flexible BRDF bidirectional reflectance distribution function screen that can be used to display projected images.
2013-10-23 SMIC opens R&D, manufacturing facility for 3D ICs
By rolling out a centre dedicated to vision, sensors, and 3D IC, SMIC is hoping to let the world know of its ability to extend its manufacturing and R&D capabilities.
2013-10-31 SK Hynix turns to BeSang for 3D IC tech
SK Hynix has licensed BeSang's 3D IC process that uses a low-temperature process to build multi-layer 3D integrated circuits one layer at a time using traditional vias.
2009-10-13 Single-chip audio subsystem enables 3D
ST introduces a single-chip audio subsystem IC that enables 3D sound enhancement for improved stereo effects in small equipments.
2015-09-29 Singapore sets up SE Asia's largest 3D printing facility
U.S.-based semiconductor company Ultra Clean Technology has launched in Singapore a $3.5-million 3D printing facility that is believed to be the biggest and most comprehensive in Southeast Asia.
2009-09-11 Singapore launches 3D TSV consortium
The Institute of Microelectronics has announced a 3D through-silicon via (TSV) consortium to boost next-generation 300mm wafer manufacturing capability.
2015-09-24 Singapore boosts 3D printing capabilities with new cluster
Singapore launched the National Additive Manufacturing Innovation Cluster to harness, strengthen and expand the country's growing 3D printing capabilities as an integrated hub.
2012-06-18 SimMechanics 4.0 uses 3D animation for analysis
MathWorks' SimMechanics 4.0 modeling tool helps engineers detect integration issues between electrical, mechanical, and control systems early in the development process.
2010-09-13 Siemens, National Semi team up for ultrasound, 3D/4D
The two companies have joined in a strategic alliance for advanced ultrasound technology, focusing on 3D/4D imaging capabilities and cutting power consumption.
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