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What is a comb filter?
A comb filter is a bandpass filter used to process audio and video signals by mixing the original with a delayed signal. Comb filters allow selected frequencies to pass while blocking their harmonics and all other frequencies. (Souce: EE Times)
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2013-06-03 Si2 set to unveil PDN Standard for 3D integrated ICs
The 3D IC Design Exchange Format Standard for Power Distribution Networks describes a unified interface protocol for both Power/Ground and signal ports for die-2-die and package-2-PCB interfaces.
2014-10-21 Should your company move to 3D printing?
Moving from machining, injection moulding and other manufacturing processes to 3D printing requires analysis of the business case; manufacturers need a cost-benefit analysis.
2003-09-15 Sharp to introduce 3D notebook in October
The company will introduce a 3D notebook PC in October with a 15-inch switchable 2D/3D LCD.
2010-01-21 Setting the stage for 3D TV
The consumer electronics industry is looking at its future through a pair of stereo 3D glasses. The left eye sees an opportunity to revive sagging TV and media revenues, the right eye sees a set of unresolved technical issues.
2015-07-27 Semicon West highlights path towards 3D IC
The recent event underlined the significance of the move towards more advanced 3D IC technology, as well as the impact of the 'More than Moore' leading to this progress.
2007-01-31 Sematech, TEL advance work on 3D interconnects
Sematech and Tokyo Electron entered into a multi-year joint development program to improve the use of 3D interconnect technology and high mobility channel materials in advanced manufacturing.
2011-11-09 Sematech starts 3D tech forum
Sematech has launched an online forum to promote the development of standards for heterogeneous 3D integration.
2011-12-22 Sematech details 3D IC tech hurdles
Sematech has identified heterogeneous computing, memory, imaging, smart sensor systems, communication switches and power delivery/conditioning as some of the potential future killer applications
2008-10-21 Seiko Epson readies 3D images for handsets
While 3D is expected to be visible in the next-generation TV, some Japanese vendors are looking at all possibilities to bring 3D images to mobile screens.
2010-06-14 Secure media processor supports 3D graphics
From Sigma Designs comes the SMP8656 media processor that provides a range of new features including 3D graphics with OpenGL ES 2.0 and enhanced security.
2011-08-22 SDK helps accelerate stereo 3D development
The AMD Quad Buffer SDK for AMD HD3D technology offers a tool for developers engaged in building stereo 3D capabilities into upcoming game titles.
2013-04-04 Screen protector for mobile devices yields 3D content
A nano-engineered plastic film created by A*STAR IMRE and Temasek Polytechnic turns ordinary screens of mobile devices into 3D displays.
2013-09-18 Screen protector allows 3D viewing in mobile devices
EyeFly3D, a Singapore-made glasses-free 3D film, has won the Technology Innovation category in the Institution of Engineers Singapore (IES) Prestigious Engineering Achievement Awards 2013.
2008-06-19 SanDisk, Toshiba team up to produce 3D memory chips
Expanding their ties, SanDisk Corp. and Toshiba Corp. plan to collaborate on the development of certain types of rewriteable 3D memory, according to a filing with the U.S. Securities and Exchange Commission.
2014-05-14 SanDisk, Toshiba inch closer to 3D NAND with 15nm
The 15nm technology replaces the previous 19nm and provides a transitional step to 3D NAND. It scales chips along both axes and will be deployed across SanDisk products including enterprise SSDs.
2008-02-07 Samsung: UD tech, 3D content make future TV
The TV of the future will be an 'immersive digital cinema' system with UD technology and 3D user-generated content, said Hyung Kyu Lim, head of Samsung Advanced Institute of Technology.
2014-05-21 Samsung, Toshiba launch all-out 3D NAND production efforts
Both companies are gearing up for the production of 3D NAND devices, with Samsung in China and Toshiba in Japan, in preparation for the market that is believed to take off in the second half of 2015.
2010-04-23 Samsung posts 3D TV health caution
Samsung Electronics Co. Ltd has issued a 3D TV health warning on its Australian Website describing a long list of hazards potentially associated with the technology.
2013-08-07 Samsung embarks on 3D V-NAND mass production
Samsung has begun mass producing 3D vertical NAND flash memory designed for range of application including embedded storage and SSDs.
2015-08-13 Samsung brings 3D NAND to mainstream
According to a company executive, Samsung will soon start making a version of its 850 EVO SSDs using its latest 48-layer, 3bit per cell, 256Gb 3D NAND chips.
2008-04-28 Samsung brings 3D experience to plasma HDTV
Samsung's Series 4 450 plasma HDTVs enable consumers to have an interactive 3D experience for enjoying a wide range of content, including movies, video games and Web content.
2006-09-14 Remcom licenses 3D EM simulation tech to Agilent
Agilent Technologies and privately held Remcom announced that Agilent has licensed 3D electro-magnetic simulation technology from Remcom.
2011-10-19 Recent developments in 3D integration
Here's a discussion on through-silicon via and mechanically flexible interconnect, and how these are being currently developed.
2014-07-30 Raytrix 3D camera packs Cypress' CX3 controller
The R42 supports up to 40Mpx resolution and 4,000 images, leveraging the CX3 solution's throughput to provide 3D images with extended depth-of-field.
2009-11-20 Rattner: Boost supercomputing through 3D Web
Justin Rattner, chief technology officer at Intel, said that high-performance computing needs to boost growth by addressing the needs of the 3D Web.
2011-12-20 Rambus, ITRI team up for 3D packaging
According to the two organizations, they will work together as members of Ad-STAC to push system integration using silicon interposer technology.
2009-03-11 R3Logic to advance 3D design flow R&D
R3Logic announced that it has created a new R&D center in Grenoble, France to develop and enhance its design tools for 3D heterogeneous system and system-in-package design.
2014-11-06 Quantum dot LED 3D printed using five various materials
Exhibiting pure and tunable colour emission properties, the QD-LED demonstrates that diverse classes of materials can be 3D printed and fully integrated into device components with active properties.
2008-07-16 Qualcomm, IMEC team on 3D tech for wireless apps
Qualcomm announced it is the first fabless IC firm to participate in IMEC's industrial affiliation program (IIAP) on 3D integration.
2015-04-21 Qualcomm to bring Monolithic 3D IC tech to smartphones
According to a Qualcomm executive, the company is looking to leverage Monolithic 3D IC technology to win market share in the $8 billion smartphone market.
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