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2013-10-24 Xilinx, TSMC announce CoWoS 3D IC volume production
The programmable Virtex-7 HT family claims to be the industry's first heterogeneous 3D ICs in production that feature up to sixteen, 28Gb/s and seventyCtwo, 13.1Gb/s transceivers.
2013-10-11 TU Delft, Imec co-author test flow for 3D IC optimisation
3D-COSTAR aims to optimise the test flow of 3D stacked ICs by compiling the yields and costs of design, manufacturing packaging and logistics.
2012-02-06 TSMC to roll 3D IC assembly service next year
The company has one year to get all physical design kits and EDA support in place to allow customers to design with COWOS, the technology standing for chip on wafer on substrate.
2014-02-19 Tips for cost-effective 3D IC production
Know how to distribute the cost-of-ownership across the supply chain.
2011-06-09 Test solution automates 3D IC deployment
Imec and Cadence has released a test solution that automates 3D stacked ICs deployment.
2012-10-11 SPTS signs JDP with Fraunhofer for 300mm 3D IC Apps
The program will use 300mm APM plasma enhanced chemical vapor deposition modules installed on a Versalis platform alongside SPTS etch chambers in the ASSID centre in Germany.
2013-10-31 SK Hynix turns to BeSang for 3D IC tech
SK Hynix has licensed BeSang's 3D IC process that uses a low-temperature process to build multi-layer 3D integrated circuits one layer at a time using traditional vias.
2015-07-27 Semicon West highlights path towards 3D IC
The recent event underlined the significance of the move towards more advanced 3D IC technology, as well as the impact of the 'More than Moore' leading to this progress.
2011-12-22 Sematech details 3D IC tech hurdles
Sematech has identified heterogeneous computing, memory, imaging, smart sensor systems, communication switches and power delivery/conditioning as some of the potential future killer applications
2015-04-21 Qualcomm to bring Monolithic 3D IC tech to smartphones
According to a Qualcomm executive, the company is looking to leverage Monolithic 3D IC technology to win market share in the $8 billion smartphone market.
2013-02-19 Paper tackles 3D IC temperature solutions
The methodology flow presented in the paper will demonstrate the link between the 3-D IC package thermal simulations with the system thermal simulation.
2013-01-31 Open ecosystem team up spawns 3D IC
STATS ChipPAC and UMC unveiled a 3D chip stack, consisting of a Wide I/O memory test chip stacked upon a TSV-embedded 28nm processor test chip, which boasts package-level reliability success.
2010-03-17 Microfluids cool down 3D IC stacks
IBM Researchers, in collaboration with two Swiss partners, seek to extend Moore's Law another 15 years using 3D stack architectures with liquid-cooling microchannels.
2013-12-13 Latest developments in 3D IC technologies
Here's a look at the various forms of 3D IC technology, starting with the simpler incarnations and culminating in today's start-of-the-art implementations.
2011-12-21 JEDEC to release 3D IC standard
JEDEC will release in late December or early January 2012 the first 3D IC interface standard.
2009-10-19 ITRI, Applied Materials push 3D IC dev't
Applied and ITRI will work together as members of the Stacked-System and Application Consortium
2009-12-17 IBM details 3D IC design challenges
IBM Corp. engineer John Knickerbocker offers five challenges for 3D devices based on TSVs.
2012-03-28 Heterogeneous 3D IC test vehicle uses CoWoS Process
Altera claims to be the first chip company to develop and complete characterization of a heterogeneous test vehicle using TSMC's Chip-on-Wafer-on-Substrate process.
2011-12-23 GSA details 3D IC evolution
The 3D IC architecture report provides further insight on the current state of 3D and 2.5D technology such as the benefits of the technologies.
2013-04-04 Globalfoundries delays 3D IC stack production
The company says it expects to use the 20nm process for 3D chips that may not ship in volume until 2015 or later.
2013-12-30 Exploring monolithic 3D IC technologies
Learn about a relatively new approach that seems really promising: the Monolithic 3D IC technology.
2010-07-13 EVG, IME join hands on 3D IC integration
EV Group and Singapore's Institute of Microelectronics (IME) signed a two-year agreement to cooperate on developing 3D IC integration technologies.
2010-06-23 Elpida, PTI, UMC team on 3D IC integration for 28nm
Elpida Memory Inc., Powertech Technology Inc. (PTI), and United Microelectronics Corp. have reached a three-way cooperation to advance 3D IC integration technologies for advanced processes including 28nm.
2013-07-10 Dow Corning boards Imec's 3D IC packaging initiative
Dow Corning has teamed up with Imec to advance enabling technologies for 3D IC semiconductor packaging.
2014-01-29 Cost-efficient 3D IC wafer processing without adhesives
AML showcased a unique solution to get rid of the adhesive and to allow for a vacuum to be created between the carrier and the wafer to be processed in 3D IC production.
2014-01-22 Besi, Imec partner on thermocompression for 3D IC bonding
Imec and Besi have announced that they are collaborating to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput.
2013-09-04 AMS spends $33 million for analogue 3D IC production facility
AMS investment aims to increase production capacity in response to a surge in demand outlook for ICs fabricated with 3D IC integration technology.
2012-02-03 Advances in 3D-IC testing
Read about the design-for-3D-test architecture and implementation flow developed by researchers at Industrial Technology Research Institute based on the Synopsys test solution.
2012-09-17 A*STAR, Hitachi Chemical team up on 3D IC packaging tech
Hitachi Chemical hopes to leverage IME's advanced 3D IC process capabilities to enhance material technologies that can support the demanding requirements of thin wafer processing.
2011-09-27 A primer on 3D-IC design challenges
Know the 3D-IC design challenges such as system exploration, floorplanning, analysis, and design for test (DFT), and learn how designs will evolve as 3D-IC goes on to become a necessity for managing power, performance, form factor, and cost goals.
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