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2012-02-29 Transceiver IC aimed at 2G/3G/4G mobile devices
Fujitsu's multiband, multimode MB86L11A supports LTE (FDD and TDD), HSPA+, WCDMA, GSM, EDGE, EDGE-EVO, CDMA and TD-SCDMA.
2005-02-18 ST abandons GSM baseband chip development
STMicroelectronics disclosed Tuesday (Feb. 15) that it has abandoned a major effort to develop a second-generation GSM baseband chipset
2010-12-22 Spreadtrum to host tech forum on 40nm 3G baseband processor
Spreadtrum will host a technology forum on its 3G baseband processor in Beijing, China on January 19, 2011.
2005-02-17 Renesas, Symbian collaborate on 3G mobile phone platform
Renesas Technology Corp. and Symbian Ltd have entered into an agreement to add full-scale support for Symbian OS to Renesas' advanced silicon platform for 3G mobile phones
2007-10-22 RapidIO switch slashes 3G baseband costs
Tundra has released the Tsi620, a multi-standard serial RapidIO switch that lowers 3G baseband costs by bridging RapidIO-based DSP clusters to low cost embedded processors and FPGAs.
2014-06-26 Qualcomm leapfrogs Intel in cellular baseband market in Q1
Strategy Analytics reported that Qualcomm maintained its baseband market dominance with 66 per cent revenue share, followed by MediaTek with 15 per cent and Spreadtrum with five per cent
2004-11-25 NEC, NEC Electronics to develop system LSIs for 3G mobile terminals
NEC Corp. and NEC Electronics Corp. have entered into a close collaboration to jointly develop a system LSI for 3G mobile terminals, in line with NEC's strategy to strengthen the competitiveness of its 3G mobile terminal platforms for the global market
2003-02-12 Modem-Art ships W-CDMA baseband processor
Modem-Art Ltd's MA1000 W-CDMA programmable baseband processor allows terminal manufacturers an upgrade path for existing GSM/GPRS terminal designs
2005-09-14 LSI Logic's platform ASIC validates TTPCom 3G modem
LSI Logic Corp.'s RapidChip Integrator2 platform has been selected by U.K.-based TTPCom for its next-generation 3G cellular modem technology, named Cellular Baseband Macro 3G.
2007-12-17 HSPA SoC bundles 3G protocols
Broadcom Corp. is sampling a single-chip HSPA processor that's said to integrate all key 3G cellular and mobile technologies on a low-power, 65nm CMOS die
2007-10-17 Broadcom packs key 3G technologies in one chip
Broadcom has announced a new single-chip HSPA processor that integrates all key 3G cellular and mobile technologies on a single low-power 65nm CMOS die
2007-06-08 Broadcom joins ranks of top 3G tech suppliers
Broadcom is now among the top five merchant 3G base band suppliers in the world, according to market research firm iSuppli
2007-09-13 Analyst: 3G iPhone definitely coming very soon
There is no doubt a 3G version of the Apple iPhone is in the wings and it could be announced as soon as this week, according analyst Will Strauss of Forward Concepts
2009-02-19 Analyst skeptical on Broadcom's 3G design wins
The announcement that Broadcom will be a supplier to some of Nokia's next-gen HSPA-based handsets should position the company to gain share in the cellular handset market in years to come, according to Craig Berger, an analyst with FBR Capital Markets.
2008-09-08 Analyst expects more 3G baseband tie-ups
Further consolidation is expected among suppliers of UMTS/HSPA baseband chips. However, the possibilities are limited with Infineon and Icera now the only independent sources for the parts, aside from Qualcomm
2004-02-19 Agere unveils 3G baseband-processing scheme
Agere Systems has rolled out a multimedia-handset architecture it says can shave as much as half a year off of a design cycle.
2010-02-12 3G solution enables high-speed, low-cost smart phones
Broadcom's single-chip HSPA baseband processor and a RF transceiver solution integrates all key 3G mobile technologies for powering the 3G smart phone and smart feature phone product segments.
2007-06-08 32bit dual-MAC DSP cores target 2.5G, 3G baseband
CEVA Inc. has introduced the CEVA-TeakLite-III family of DSP cores and the first three family members aimed at 2.5G and 3G cellular baseband.
2005-02-14 TTPCom, NEC Electronics to team on dual-mode 3G/2G chips
TTP Communications plc and NEC Electronics Corp. announced Thursday (Feb. 10) they would join forces to develop dual-mode chips that will include TTPCom EDGE/GPRS/GSM silicon and software architecture.
2005-02-03 TTPCom links with ARM for 3G designs
TTPCom and ARM have started collaborating on 3G intellectual property platforms, the first fruits of which will see TTP Com integrating an ARM 11 processor core with the its Cellular Baseband Engine (CBEmacro) technology.
2006-01-20 TTPCom 3G modem reduces silicon area
TTPCom and ARM announced that comparative analysis revealed that wireless applications processors that integrate TTPCom's CBEmacro 3G modem occupy less silicon area than current solutions
2004-07-15 TI, DoCoMo to codevelop 3G handset chips
Texas Instruments Inc. (TI) and NTT DoCoMo Inc. will jointly develop a cost-competitive, multimode UMTS (W-CDMA/GSM/GPRS) chipset to serve the worldwide 3G handset market
2004-11-19 TI, Commit enable next-gen chips for China's 3G market
Texas Instruments Inc. and Commit Inc. are driving 3G wireless innovation in Asia, providing the Chinese wireless industry with a flexible TD-SCDMA chipset solution easily customized for supporting complex 3G applications
2011-11-15 TI's baseband strategy, a good call
As TI aggressively pushes its OMAP processor, some believe that its strategy of phasing out its baseband segment may not be a good idea
2009-01-30 TI to keep wireless baseband biz
Texas Instruments Inc. has cancelled plans to sell its wireless merchant base station IC division since it could not find buyers willing to pay what the unit was worth.
2008-10-22 TI seeks to dispose portion of mobile baseband unit
TI is in negotiations with undisclosed potential buyers of its merchant baseband IC business, but would continue to support some of its custom baseband customers
2003-02-06 TI rolls 3G chipsets for handsets, basestations
Texas Instruments has launched two lines of 3G UMTS RF and baseband chipsets, one for handsets and one for basestations.
2003-02-07 Tek rolls comms analyzers to streamline 2.5/3G test
Tektronix's WCA200A series of communication analyzers can be used in both production and R&D test for emerging 2.5/3G wireless apps
2005-09-22 TD-SCDMA serves as a new battleground for 3G
The technology, which relies on a combination of TDD and synchronous CDMA, offers some key advantages.
2007-10-05 System LSI puts 3G in handsets
Renesas Technology Corp. has launched the SH-Mobile G3, a high-speed, high-performance system LSI designed for use in 3G mobile phones
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