What is a comb filter?
| A comb filter is a bandpass filter used to process audio and video signals by mixing the original with a delayed signal. Comb filters allow selected frequencies to pass while blocking their harmonics and all other frequencies. (Souce: EE Times) |
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| 2012-02-06 | TSMC to roll 3D IC assembly service next year The company has one year to get all physical design kits and EDA support in place to allow customers to design with COWOS, the technology standing for chip on wafer on substrate. |
| 2011-12-15 | TSMC pushes thru with 3D chip The semicon firm claims its approach will be simpler, cheaper and more reliable, focusing on creating TSVs early in the process, then adding packaging capabilities to its fabs. |
| 2008-06-26 | Trio works on 3D solution for home theaters Mitsubishi Digital Electronics America Inc. has tapped Nvidia Corp. and Aspen Media Products LLC to provide the first complete 3D solution for the home entertainment market in one convenient package. |
| 2002-05-09 | Trident 3D graphics processor dissipates <3W Designed for notebooks PCs, the XP4 3D graphics processor from Trident Microsystems Inc. features full-fledged DirectX 8.1 implementation and delivers a 3D graphics performance of 1 billion pixels/s, while dissipating <3W. |
| 2008-04-17 | Tower fabs Canesta 3D image sensors for cars Canesta's 3D image sensors, now in final qualification stages for the automotive industry, are being manufactured at Tower Semi's Fab2 facility, using its CMOS image sensor 0.18?m technology process. |
| 2015-03-06 | Tower develops IR sensor for Intel's 3D camera The near infrared light sensor is used for depth sensing by Intel within its RealSense, which has a 3.5?m pixel size and flaunts a global shutter. |
| 2007-07-16 | Touchscreens, 3D, OLEDs drive new displays The Society for Information Display (SID) conference played host to the upcoming technologies driving the display market. |
| 2010-01-11 | Toshiba, RealD jointly bring home 3D The RealD 3D format multiplexes a left eye and right eye 3D image stream into a single channel. |
| 2009-01-09 | Toshiba shelves 3D, pushes Cell TV Diverging from the path that most consumer electronics vendors are taking, Toshiba Corp. appears to be eschewing 3D TV. |
| 2015-04-02 | Toshiba flexes muscle in 3D NAND arena The transition to 3D NAND is picking up speed as Toshiba announced in late March that it was shipping samples of its 48-layer 3D Bit Cost Scalable (BiCS) stacked cell structure flash. |
| 2014-02-19 | Tips for cost-effective 3D IC production Know how to distribute the cost-of-ownership across the supply chain. |
| 2013-01-02 | TI, SoftKinetic to unveil 3D time-of-flight image sensor The collaboration includes hardware and software integration geared to accelerate adoption of gesture control in TVs and PCs. |
| 2007-02-23 | TI processors take HD video, 3D gaming to handsets TI demonstrated what it says is the industry's first application processor to playback HD video and bring life-like 3D graphics to the handset. |
| 2012-11-29 | Thermal lock-in analysis drives 3D package dev't The ELITE thermal lock-in analysis system from DCG Systems claims to provide the ability to localise electrical faults within a 3D packaged device with the highest sensitivity and accuracy. |
| 2011-10-14 | The move toward 3D chips Semiconductor fabrication is moving toward 3D ICs and by next year, 3D chips will be available for commercialization. |
| 2002-02-19 | The development of a full field 3D-microscale flow measurement technique for application to near contact line flows This application note contains details of the development of a new 3D-velocity field measurement technique which can be used to provide more insight into the dynamics of thin evaporating liquid films. |
| 2005-05-11 | Tezzaron, PICC to collaborate on 3D flash memory Tezzaron Semiconductor Inc. and startup Programmable Integrated Circuit Co. (PICC) announced plans to collaborate on the creation of three-dimensional (3D) flash memory components. |
| 2015-02-04 | Testing the waters for 3D pens Despite being a niche surfing on the hype of the 3D printing industry, 3D pen makers have met a lot of success in their respective crowdfunding campaigns. |
| 2011-07-12 | Test system targets 3D, 28nm node ICs Verigy has released a new generation of test systems for advanced semiconductor designs, including 3D device architecture and IC designs for 28nm technology node and beyond. |
| 2011-06-09 | Test solution automates 3D IC deployment Imec and Cadence has released a test solution that automates 3D stacked ICs deployment. |
| 2008-09-04 | Tegal secures products, IP for 3D packaging, MEMS Tegal Corp. has signed an agreement with AMMS and Alcatel-Lucent to acquire products and the related intellectual property, directed at advanced 3D wafer-level packaging applications. |
| 2008-09-19 | Tegal acquires Alcatel Lucent 3D packing IP Tegal Corp. has completed its previously announced acquisition from Alcatel Micro Machining Systems and Alcatel Lucent of their Deep Reactive Ion Etch (DRIE) and Plasma Enhanced Chemical Vapor Deposition products, and the related intellectual property.. |
| 2010-10-08 | TearDown: Inside a 3D desktop scanner The desktop NextEngine 3D Scanner competes with more expensive scanners by creating mesh files of 3D objects for industrial design, reverse engineering, CGI and content creation. Here's a look inside. |
| 2015-01-05 | Taking to market 3D printer-ready CAD files Developing legal platforms for the delivery of printer-ready 3D CAD files is seen as the way forward for the 3D printing industry and probably the best counter-measure against unlawful design imitations. |
| 2010-07-23 | Taiwan maker demonstrates 3D vertical gate NAND device The 3D NAND Flash uses Macronix's patented BE-SONOS (barrier engineering) charge-trapping technology and 3D decoding architecture. |
| 2011-07-07 | TAITRA: TSMC, Intel to battle over 3D chips TSMC is challenging Intel in the 3D arena as it plans to release 3D chips by the end of 2011. |
| 2014-03-26 | T-bone enables board for 3D printing The T-bone, which utilises an Cortex A8 microcontroller, allows expanded usage of the host's, BeagleBone, resources by offloading the complex motion control processing functions. |
| 2009-10-01 | SUSS MicroTec joins ITRI 3D consortium The Advanced Stacked-System Technology and Application Consortium will implement SUSS MicroTec's 300mm technology. |
| 2002-04-16 | Superscape, Imagination, ARM codevelop 3D technology Superscape, Imagination Technologies and ARM have collaborated to develop and deliver 3D technology to users of mobile devices. |
| 2003-10-10 | Superscape licenses 3D technology to Motorola Superscape Group plc has announced that Motorola has licensed its Swerve i3D Graphics Client, which Superscape jointly developed with ARM Ltd. |
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