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| 2005-10-21 | Packaging conference to explore 3D, SIP Building on the first International Wafer-Level Packaging Congress (IWLPC) event, the second IWLPC conference will explore three-dimensional (3D) chip-packaging and other technologies. |
| 2005-06-23 | Stacked package from Sharp allows 0.5-mm grid Sharp Corp. has developed packaging technology that allows stacking of multiple packages with 0.5mm pitch ball grids, which the company claims is the industry's tightest pitch. |
| 2003-03-10 | Sharp, Amkor to develop unified stacked package design Sharp Corp. and Amkor Technology Inc. have agreed to unify the design for 3D system in package assembly that enables the stacking of very thin packages. |
| 2015-06-10 | Altera touts next-gen high-end programmable logic devices The Stratix 10 FPGAs and SoCs leverage Altera's HyperFlex FPGA fabric architecture built on the Intel 14nm Tri-Gate process to provide 2X higher core performance over previous generation FPGAs. |
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